Patents by Inventor Yuichi Oka

Yuichi Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210041305
    Abstract: To obtain an imaging device that can improve temperature detection accuracy. An imaging device of the present disclosure includes a processing unit formed on a first semiconductor substrate and capable of performing predetermined image processing on the basis of image data obtained by an imaging unit, a temperature sensor formed on the first semiconductor substrate and capable of generating a detection signal according to a temperature, and a first pad electrode formed on the first semiconductor substrate and electrically insulated from a circuit formed on the first semiconductor substrate.
    Type: Application
    Filed: January 23, 2019
    Publication date: February 11, 2021
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Naoki Kawazu, Keita Sasaki, Takumi Oka, Mohammad Munir Haque, Nobuhiko Fujimori, Makoto Satou, Masahiro Baba, Satoshi Yamamoto, Yuichi Motohashi, Atsushi Suzuki
  • Publication number: 20200412950
    Abstract: An imaging device according to the present disclosure includes: an imaging unit configured to perform an imaging operation; a data generator configured to generate first power supply voltage data corresponding to a first power supply voltage; and a flag generation section configured to generate a flag signal for the first power supply voltage by comparing the first power supply voltage data and first reference data. The first power supply voltage is supplied to the imaging unit.
    Type: Application
    Filed: February 5, 2019
    Publication date: December 31, 2020
    Inventors: NAOKI KAWAZU, KEITA SASAKI, TAKUMI OKA, YUICHI MOTOHASHI, ATSUSHI SUZUKI
  • Publication number: 20200404204
    Abstract: An imaging device according to the present disclosure includes: a plurality of pixels each including a first light-receiving element and a second light-receiving element, the plurality of pixels including a first pixel; a generating section that is able to generate a first detection value on a basis of a light-receiving result by the first light-receiving element of each of the plurality of pixels, and is able to generate a second detection value on a basis of a light-receiving result by the second light-receiving element of each of the plurality of pixels; and a diagnosis section that is able to perform a diagnosis processing on a basis of a detection ratio that is a ratio between the first detection value and the second detection value in the first pixel.
    Type: Application
    Filed: October 15, 2018
    Publication date: December 24, 2020
    Inventors: NAOKI KAWAZU, KEITA SASAKI, TAKUMI OKA, MOHAMMAD MUNIR HAQUE, YUICHI MOTOHASHI, ATSUSHI SUZUKI
  • Patent number: 10844753
    Abstract: A boiler including one or more evaporators, an economizer, and a low-temperature heat exchanger. The economizer is located on a downstream side of the most downstream evaporator which is an evaporator at the most downstream side among the one or more evaporators. The low-temperature heat exchanger is located on the downstream side of the economizer, has an inlet for receiving water from the outside, and is configured to heat the water introduced from the inlet and sent to the economizer with the combustion gas.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: November 24, 2020
    Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
    Inventors: Hideyuki Uechi, Hiroyuki Yagita, Kuniaki Aoyama, Hideaki Sugishita, Yukimasa Nakamoto, Yuichi Oka, Naoki Hisada, Tarou Ichihara
  • Publication number: 20200325799
    Abstract: A gas turbine includes: a compressor configured to compress air; a combustor configured to combust fuel in the air compressed by the compressor so as to generate combustion gas; and a turbine configured to be driven using the combustion gas. Air coolers are configured to bleed the air from a plurality of places having different pressures in the compressor and cool the air bled from the respective places so as to generate cooling air. A waste heat recovery device is configured to recover waste heat from at least two of the air coolers.
    Type: Application
    Filed: May 6, 2020
    Publication date: October 15, 2020
    Inventors: Hideyuki UECHI, Hideaki SUGISHITA, Yukimasa NAKAMOTO, Yuichi OKA
  • Patent number: 10480411
    Abstract: A waste heat recovery device includes: a low-boiling-point medium Rankine cycle in which a low-boiling-point medium circulates while the low-boiling-point medium is repeatedly condensed and evaporated; a heated water line that guides liquid water, which is heated here, to the low-boiling-point medium Rankine cycle from a waste heat recovery boiler; and a water recovery line that returns the water, which has passed through the low-boiling-point medium Rankine cycle, to the waste heat recovery boiler. The low-boiling-point medium Rankine cycle includes a heater that heats the low-boiling-point medium by exchanging heat between the low-boiling-point medium, which is a liquid, and liquid water, which has passed through the heated water line.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: November 19, 2019
    Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
    Inventors: Hideyuki Uechi, Hideaki Sugishita, Yukimasa Nakamoto, Yuichi Oka
  • Publication number: 20190329327
    Abstract: The present invention provides an inexpensive chuck device that can achieve both a stable gripping operation and a high degree of accuracy in gripping and can also reduce limitations in the gripping of a workpiece. According to the present invention, a chuck device is provided, the chuck device being characterized by comprising a chuck main body and a master jaw, wherein the chuck main body has an oscillation supporting hole, and the oscillation supporting holes are rotatably provided in plurality around a rotational axis of the chuck main body, and wherein the master jaw has a top jaw detachably provided on one end thereof, and is fitted into the oscillation supporting hole while maintaining surface contact therewith to enable sliding contact.
    Type: Application
    Filed: November 24, 2017
    Publication date: October 31, 2019
    Applicant: KITAGAWA IRON WORKS CO., LTD
    Inventors: Naoyuki MASATSUGU, Toshihito NAKAMURA, Tamio NISHIMIYA, Youji YAMAGUCHI, Shuya ISHIKAWA, Yuichi HIRATA, Masanobu MIKAMI, Yujiro OKA
  • Patent number: 10347567
    Abstract: In a resin sealing type semiconductor device, a semiconductor chip CP2 is mounted over a die pad DP having conductivity via a bonding member BD2 having insulation property, and a semiconductor chip CP1 is mounted over the die pad DP via a bonding member BD1 having conductivity. A first length of a portion, in a first side formed by an intersection of a first side surface and a second side surface of the semiconductor chip CP2, covered with the bonding member BD2 is larger than a second length of a portion, in a second side formed by an intersection of a third side surface and a fourth side surface of the semiconductor chip CP1, covered with the bonding member BD1.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: July 9, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Atsushi Nishikizawa, Yuichi Yato, Hiroi Oka, Tadatoshi Danno, Hiroyuki Nakamura
  • Patent number: 10287922
    Abstract: A boiler includes one or more evaporators configured to heat water which has flowed therein to a specific heat maximum temperature at constant pressure or more in which a specific heat at constant pressure is maximized using a heated fluid and one or more reheaters configured to heat the steam which has come from the boiler using the heated fluid. All the reheaters configured to supply steam to a low-pressure steam turbine are disposed only at a downstream side of the high-pressure evaporator. All the reheaters heat reheating steam (FRHS) containing steam which has passed through a high-pressure steam turbine configured to receive steam supplied from the high-pressure evaporator and having a temperature lower than a specific heat maximum temperature at constant pressure in the high-pressure evaporator to less than the specific heat maximum temperature at constant pressure.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: May 14, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Hideyuki Uechi, Hideaki Sugishita, Yuichi Oka
  • Publication number: 20180058267
    Abstract: A boiler including one or more evaporators, an economizer, and a low-temperature heat exchanger. The economizer is located on a downstream side of the most downstream evaporator which is an evaporator at the most downstream side among the one or more evaporators. The low-temperature heat exchanger is located on the downstream side of the economizer, has an inlet for receiving water from the outside, and is configured to heat the water introduced from the inlet and sent to the economizer with the combustion gas.
    Type: Application
    Filed: March 22, 2016
    Publication date: March 1, 2018
    Inventors: Hideyuki UECHI, Hiroyuki YAGITA, Kuniaki AOYAMA, Hideaki SUGISHITA, Yukimasa NAKAMOTO, Yuichi OKA, Naoki HISADA, Tarou ICHIHARA
  • Publication number: 20180003085
    Abstract: A boiler includes one or more evaporators configured to heat water which has flowed therein to a specific heat maximum temperature at constant pressure or more in which a specific heat at constant pressure is maximized using a heated fluid and one or more reheaters configured to heat the steam which has come from the boiler using the heated fluid. All the reheaters configured to supply steam to a low-pressure steam turbine are disposed only at a downstream side of the high-pressure evaporator. All the reheaters heat reheating steam (FRHS) containing steam which has passed through a high-pressure steam turbine configured to receive steam supplied from the high-pressure evaporator and having a temperature lower than a specific heat maximum temperature at constant pressure in the high-pressure evaporator to less than the specific heat maximum temperature at constant pressure.
    Type: Application
    Filed: February 6, 2015
    Publication date: January 4, 2018
    Inventors: Hideyuki UECHI, Hideaki SUGISHITA, Yuichi OKA
  • Publication number: 20170152765
    Abstract: A gas turbine including: a compressor that compresses air; a combustor that combusts fuel in the compressed air so as to generate combustion gas; and a turbine that is driven using the combustion gas. A plurality of cooling air coolers bleed the air from a plurality of places having different pressures in the compressor and cool the air bled from the respective places, thereby generating cooling air is provided. A waste heat recovery device that recovers waste heat from the at least two cooling air coolers among the plurality of cooling air coolers is provided.
    Type: Application
    Filed: March 19, 2015
    Publication date: June 1, 2017
    Inventors: Hideyuki UECHI, Hideaki SUGISHITA, Yukimasa NAKAMOTO, Yuichi OKA
  • Publication number: 20170074164
    Abstract: A waste heat recovery device includes: a low-boiling-point medium Rankine cycle in which a low-boiling-point medium circulates while the low-boiling-point medium is repeatedly condensed and evaporated; a heated water line that guides liquid water, which is heated here, to the low-boiling-point medium Rankine cycle from a waste heat recovery boiler; and a water recovery line that returns the water, which has passed through the low-boiling-point medium Rankine cycle, to the waste heat recovery boiler. The low-boiling-point medium Rankine cycle includes a heater that heats the low-boiling-point medium by exchanging heat between the low-boiling-point medium, which is a liquid, and liquid water, which has passed through the heated water line.
    Type: Application
    Filed: March 16, 2015
    Publication date: March 16, 2017
    Applicant: Mitsubishi Hitachi Power Systems, Ltd.
    Inventors: Hideyuki UECHI, Hideaki SUGISHITA, Yukimasa NAKAMOTO, Yuichi OKA
  • Patent number: 4286173
    Abstract: The logical circuit includes therein a logic block for performing a logical function. The logic block is connected with the selection circuit and the selection circuit selects the input signals thereto in response to the selection signal. The input terminals of the logic block are connected with a bypass circuit and the bypass circuit transmits the input signals applied to the input terminals of the logic block to the selection circuit. When the selection signal takes the selected one of the values, the input signals to the logic block are bypassed through the bypass circuit, without being passed through the logic circuit, and delivered as the outputs of the selection circuit.
    Type: Grant
    Filed: March 22, 1979
    Date of Patent: August 25, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Yuichi Oka, Yosimitsu Takiguchi