Abstract: An information processing apparatus includes a data acquisition unit, a simulation execution unit, and an optimization unit. The data acquisition unit acquires execution result data including an execution result of the substrate processing based on a process parameter including a pressure in the substrate processing apparatus and including sensor data of the pressure in the substrate processing apparatus. The simulation execution unit inputs the execution result data into a simulation model pre-stored in a storage to calculate a pressure in the substrate processing apparatus that is predicted to approach a target value for a substrate processing result. The optimization unit calculates a predicted value of the substrate processing result based on the process parameter including the calculated pressure.

Abstract: A substrate processing apparatus includes: a processing container, a temperature adjustment furnace, and a controller. The temperature controller includes at least one of a ceiling heater heating the processing container from a ceiling and a lower heater heating a portion below the processing container. The controller calculates a temperature condition for each of the plurality of zones to uniformize a film thickness among the plurality of substrates during the substrate processing, by using a retained upper-portion temperature model and/or lower-portion temperature model, acquires the film thickness of the plurality of substrates when the substrate processing is performed under the calculated temperature condition, and compares the acquired film thickness with a target film thickness, and when the acquired film thickness falls outside an allowable range of the target film thickness, sets a process region to be applied to the substrate processing on the plurality of substrates, based on the comparison.

Abstract: A socket connector includes a socket housing in which an island part and a peripheral wall surrounding the island part project upward from a bottom plate, a plurality of socket contacts arranged in the socket housing, and two protective metal fittings. In a cutting step, a half-dome part of the two protective metal fittings is formed by cutting a metal plate in such a way that a dome part in a symmetrical shape formed by drawing in the metal plate is split into two halves along a line of symmetry. In a press-fitting step, two press-fitting parts of each socket hold-down are press-fit into two long walls, respectively.

Abstract: A substrate processing apparatus includes: a processing container, a temperature adjustment unit, and a controller.

Abstract: A substrate processing method includes: carrying out a substrate from a substrate transfer container by a substrate transfer device; placing the substrate in a first position of a substrate holder; moving the substrate holder into a reaction container and processing the substrate in the reaction chamber; obtaining a film thickness measurement result of the substrate processed in the reaction container; creating a model from the film thickness measurement result; determining a second position where the substrate is placed in the substrate holder and a transfer position setting value obtained from the model; adjusting the first position of the substrate to the second position; calculating an eccentricity state of the substrate from a newly obtained film thickness measurement result; calculating an optimization such that the eccentricity state is minimized; and determining a third position to which a new substrate is placed from the transfer position setting value.

Abstract: A temperature correction information calculating device for use with a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus is configured to correct a preset temperature in accordance with an accumulated film thickness on an inner wall of the semiconductor manufacturing apparatus, control a temperature by using a heater such that the temperature approaches the corrected preset temperature, and perform a deposition process on an object. The temperature correction information calculating device includes a memory, and a processor coupled to the memory and configured to store a temperature correction value for correcting the preset temperature, obtain first heater power applied to the heater, predict second heater power by adding, to the first heater power, a variation of heater power due to a preset temperature change, and correct the temperature correction value based on the predicted second heater power. The first heater power is included in log information.

Abstract: A temperature correction information calculation device includes a model storage unit that stores a model for generating temperature correction information in which a temperature correction value is associated with a cumulative film thickness on an inner wall of a semiconductor manufacturing apparatus that forms a film on a processing target object by a heat treatment at a set temperature corrected according to the cumulative film thickness; a learning determination unit that determines whether or not to update the model when a film forming result by the heat treatment is obtained; a model learning unit that updates the model based on the film forming result when the learning determination unit determines to update the model; and a temperature correction information generation unit that generates the temperature correction information using the model updated by the model learning unit and corrects the set temperature by the temperature correction information.

Abstract: A connector is mounted on an input-output board. The connector is interposed between the input-output board and a CPU board, and thereby a plurality of pads of the input-output board and a plurality of pads of the CPU board are respectively electrically connected. The connector includes a rectangular flat-plate housing having a first positioning hole and a second positioning hole, and at least one contact row held on the housing. The first positioning hole is formed at a first housing corner part of the housing. The second positioning hole is formed at a fourth housing corner part, which is at a diagonal position with respect to the first housing corner part, of the housing.

Abstract: A substrate processing method includes: carrying out a substrate from a substrate transfer container by a substrate transfer device; placing the substrate in a first position of a substrate holder; moving the substrate holder into a reaction container and processing the substrate in the reaction chamber; obtaining a film thickness measurement result of the substrate processed in the reaction container; creating a model from the film thickness measurement result; determining a second position where the substrate is placed in the substrate holder and a transfer position setting value obtained from the model; adjusting the first position of the substrate to the second position; calculating an eccentricity state of the substrate from a newly obtained film thickness measurement result; calculating an optimization such that the eccentricity state is minimized; and determining a third position to which a new substrate is placed from the transfer position setting value.

Abstract: A connector includes a rectangular flat-plate housing including a first positioning hole and a second positioning hole, and a contact row and a contact row held on the housing. The housing includes a first pitch side surface and a second pitch side surface on an opposite side of the first pitch side surface. The contact row and the contact row extend from the first pitch side surface to the second pitch side surface. The first positioning hole is disposed between the first pitch side surface and the contact row, and the second positioning hole is disposed between the first pitch side surface and the contact row.

Abstract: A deposition system includes a deposition apparatus configured to deposit a film on a substrate, and a control device. The control device includes a recipe storage unit configured to store a recipe that defines a procedure of a substrate processing process performed by the deposition apparatus, and a processor configured to calculate a predicted value of a change amount from a target value of a control target indicating a film thickness or a film quality of a film deposited in a deposition step included in the substrate processing process, by using log information about the deposition apparatus, the log information being collected from when the substrate processing process based on the recipe starts, and update the recipe based on the predicted value so as to change a value of the control target to approach the target value before the deposition step.

Abstract: A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.

Abstract: An information processing device includes: a machine learning model selection part configured to select a machine learning model appropriate for a data set used for learning of the machine learning model; a calculation part configured to perform an optimization calculation by using the selected machine learning model to calculate process conditions that can achieve a target process result, predicted values of a process result corresponding to each of the process conditions, and reliability of the predicted values; a process condition selection part configured to select, among the process conditions that can achieve the target process result, one or more process conditions according to the predicted values of the process result and the reliability of the predicted values; and a display controller configured to display the selected process conditions, the predicted values of the process result corresponding to each of the selected process conditions, and the reliability of the predicted values.

Abstract: A connector includes a rectangular flat-plate housing including a first positioning hole and a second positioning hole, and a contact row and a contact row held on the housing. The housing includes a first pitch side surface and a second pitch side surface on an opposite side of the first pitch side surface. The contact row and the contact row extend from the first pitch side surface to the second pitch side surface. The first positioning hole is disposed between the first pitch side surface and the contact row, and the second positioning hole is disposed between the first pitch side surface and the contact row.

Abstract: A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.

Abstract: A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.

Abstract: A substrate processing apparatus includes a substrate transfer device that transfers a substrate accommodated in a substrate transfer container to a substrate holder; a substrate holder transfer stage that introduces the substrate holder into a reaction container; a substrate transfer controller that obtains a film thickness measurement result of the substrate, and determines a placing position of the substrate in the substrate holder by a model created in advance from the film thickness measurement result and a transfer position setting circuit; an information processing circuit that analyzes an eccentricity state from a film thickness variation state when a film thickness measurement result is newly obtained; a learning function circuit that updates the model from the eccentricity state; and an optimization function circuit that updates the placing position of the substrate by an updated model and the transfer position setting circuit.

Abstract: A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.

Abstract: A connector includes a rectangular flat-plate housing including a first positioning hole and a second positioning hole, and a contact row and a contact row held on the housing. The housing includes a first pitch side surface and a second pitch side surface on an opposite side of the first pitch side surface. The contact row and the contact row extend from the first pitch side surface to the second pitch side surface. The first positioning hole is disposed between the first pitch side surface and the contact row, and the second positioning hole is disposed between the first pitch side surface and the contact row.

Abstract: A control device includes a reception unit configured to receive a film characteristic at a plurality of positions of a film formed on a substrate by a film forming processing based on a processing recipe, an optimization processing unit configured to execute an optimization calculation of the processing recipe based on the film characteristic, a diagnosis unit configured to diagnose a validity of an in-plane shape of the film characteristic based on the film characteristic, and a determination unit configured to determine whether or not to notify a user of an encouraging action based on a diagnosis result by the diagnosis unit.