Abstract: A semiconductor device includes a semiconductor chip, an insulated circuit board including a metal plate, an insulating plate and a circuit pattern, each of which has a rectangular shape, and a spacer part disposed on the periphery of a rear surface of the metal plate including at least one of the four corners thereof. The spacer part protrudes from a rear surface of the metal plate in the thickness direction away from a front surface of the insulated circuit board.

Abstract: A semiconductor module includes a semiconductor unit including a semiconductor chip, a housing for accommodating the semiconductor unit, and a target member bonded to the housing by an adhesive having a water absorption rate of 0.5% or less.

Abstract: A semiconductor module includes a resin case housing a semiconductor element; an insulating layer extending outward from the resin case; and a first external connection terminal extending outward from the resin case, arranged above the insulating layer so as to face the insulting layer, the first external connection terminal having a non-contact portion that is not in contact with the insulating layer in a thickness direction of the insulating layer at a position overlapping the insulating layer in a plan view.

Abstract: A semiconductor module includes a semiconductor chip arranged on a mounting board, and a wiring member electrically connected to the semiconductor chip. The wiring member includes a body portion elongated in the direction of a Y-axis, and one or more ridges protruding from a surface of a flat plate-shaped portion of the body portion and extending along the Y-axis.

Abstract: A semiconductor device including: first and second conductive portions having a gap therebetween; connection wiring including first and second bonding portions respectively bonded to front surfaces of the first and second conductive portions, and a wiring portion straddling the gap and connecting the first and second bonding portions; and a wire bonded to the wiring portion. The wiring portion includes: a vertical portion extending, from a lower end to an upper end thereof, perpendicularly to the first conductive portion, the lower end being connected to the first bonding portion; a parallel portion extending in parallel to the first and second conductive portions from the upper end of the vertical portion, the parallel portion having, on a front surface thereof, a wire bonding portion to which one end of the wire is bonded; and an inclined portion extending inclinedly from the parallel portion toward the second bonding portion.

Abstract: A semiconductor device includes a semiconductor chip having a main electrode on a front surface thereof, a wiring board having a front surface to which a rear surface of the semiconductor chip is bonded, a sealing member sealing the wiring board and the semiconductor chip, and an adhesive layer including at least two adhesive films that are laminated to each other. The adhesive layer is provided on surfaces of the wiring board and the semiconductor chip so that the sealing member seals the wiring board and the semiconductor chip via the adhesive layer. As a result, the sealing member is able to reliably seal the semiconductor chip and wiring board via the adhesive layer, thereby preventing an occurrence and extension of separation.

Abstract: A conductive member constituting a wiring structure includes a first bonding section bonded to an electronic component, a second bonding section bonded to a connection target for the electronic component, and a raised section that protrudes upward from the first bonding section and is connected to the second bonding section. The conductive member has a wire member passage through which a wire member passes, and which is provided in at least a part of the raised section. The wire member passage enables the wire member to be disposed along the raised section from the first bonding section to the second bonding section such that the wire member intersects a surface of the raised section.

Abstract: A semiconductor apparatus includes a substrate, a semiconductor device arranged on an upper surface of the substrate, a lead frame bonded to an upper surface of the semiconductor device via a bonding material, the lead frame having a first recess on an upper surface thereof, a wire connected to the first recess, and a resin that seals the substrate, the semiconductor device, the lead frame, and the wire.

Abstract: A cooling device including a rectangular top plate in a plan view having a front surface on which a semiconductor module is disposed and a rear surface having a sidewall connection region, a flow pass region, and an outer edge region. The flow pass region includes a cooling region and first and second communicating regions that sandwich the cooling region therebetween from a short-side direction of the top plate. The sidewall connection region surrounds an outer periphery of the flow pass region. The outer edge region is outside of the sidewall connection region and closer to an edge of the top plate than is the flow pass region. The cooling region has a first thickness, and the outer edge region has a second thickness that is greater than the first thickness.

Abstract: A power semiconductor module includes an insulating circuit substrate; a printed circuit board disposed over the insulating circuit substrate; and a plurality of terminals each having a rod-shaped portion and including a first protrusion and a second protrusion each protruding laterally form a side face of the rod-shaped portion; wherein at least one of the plurality of terminals is inserted to one of the through-holes of the printed circuit board and is locked to the one of the through-holes via the first protrusion, and wherein at least another one of the plurality of terminals is inserted to another one of the through-holes of the printed circuit board and is locked to said another one of the through-holes via the second protrusion, and an end of the at least another one of the plurality of terminals is electrically connected to a conductive plate on the insulating circuit substrate.

Abstract: A semiconductor device includes an insulated circuit board having a conductive pattern layer, a sintered member disposed on the conductive pattern layer, a semiconductor chip placed on the sintered member, and a coating material covering the semiconductor chip. The sintered member has, on a surface thereof opposite to the conductive pattern layer, a frame shaping the outer edge of a recess. The semiconductor chip is mounted in the recess such that its top face is located closer to the conductive pattern layer than a top end of the frame.

Abstract: A semiconductor module is provided with: a case having a frame that surrounds a substrate and a terminal block formed extending inward from an inner wall surface of the frame; a terminal having one end extending outward from the frame, and another end extending inward from the frame and being secured to a top face of the terminal block; a wiring member that electrically connects the terminal and a semiconductor element on the substrate; and an encapsulating resin that encapsulates the other end of the terminal, the wiring member, and the semiconductor element inside the case. A hole is formed in the top face of the terminal block. The hole is filled with the encapsulating resin, and is positioned closer to the inner wall surface of the frame than a bonding part between the terminal and the wiring member.

Abstract: Provided are a semiconductor module capable of easily connecting extraction pin with a wiring board and having reliable connections, and a method for manufacturing the same. A semiconductor module includes: a multilayer board having a semiconductor device mounted thereon, the multilayer board electrically connecting to the semiconductor device; an extraction pin electrically connecting to one of the semiconductor device and the multilayer board; and a wiring board bonded to the extraction pin for electrical connection. The extraction pin has a press-fit. The wiring board has a hole portion bonded with the press-fit of the extraction pin. The base materials of the press-fit of the extraction pin and the hole portion of the wiring board are copper (Cu). A bonded portion between the base materials of press-fit and the corresponding hole portion of the wiring board includes a CuSnNi alloy layer.

Abstract: A semiconductor device includes a semiconductor chip, an insulated circuit board including a metal plate, an insulating plate and a circuit pattern, each of which has a rectangular shape, and a spacer part disposed on the periphery of a rear surface of the metal plate including at least one of the four corners thereof. The spacer part protrudes from a rear surface of the metal plate in the thickness direction away from a front surface of the insulated circuit board.

Abstract: A semiconductor module includes a resin case housing a semiconductor element; an insulating layer extending outward from the resin case; and a first external connection terminal extending outward from the resin case, arranged above the insulating layer so as to face the insulting layer, the first external connection terminal having a non-contact portion that is not in contact with the insulating layer in a thickness direction of the insulating layer at a position overlapping the insulating layer in a plan view.

Abstract: A semiconductor device including: a semiconductor chip; a plurality of insulating substrates mounted with the semiconductor chip; a printed circuit board facing the plurality of insulating substrates; and a conductive member for electrically connecting the plurality of insulating substrates and the printed circuit board is provided. The printed circuit board has a first through part arranged between the plurality of insulating substrates being adjacent to each other in a top view, and a second through part different from the first through part in shape in the top view.

Abstract: A semiconductor module is provided with: a case having a frame that surrounds a substrate and a terminal block formed extending inward from an inner wall surface of the frame; a terminal having one end extending outward from the frame, and another end extending inward from the frame and being secured to a top face of the terminal block; a wiring member that electrically connects the terminal and a semiconductor element on the substrate; and an encapsulating resin that encapsulates the other end of the terminal, the wiring member, and the semiconductor element inside the case. A hole is formed in the top face of the terminal block. The hole is filled with the encapsulating resin, and is positioned closer to the inner wall surface of the frame than a bonding part between the terminal and the wiring member.

Abstract: Provided are a semiconductor module capable of easily connecting extraction pin with a wiring board and having reliable connections, and a method for manufacturing the same. A semiconductor module includes: a multilayer board having a semiconductor device mounted thereon, the multilayer board electrically connecting to the semiconductor device; an extraction pin electrically connecting to one of the semiconductor device and the multilayer board; and a wiring board bonded to the extraction pin for electrical connection. The extraction pin has a press-fit. The wiring board has a hole portion bonded with the press-fit of the extraction pin. The base materials of the press-fit of the extraction pin and the hole portion of the wiring board are copper (Cu). A bonded portion between the base materials of press-fit and the corresponding hole portion of the wiring board includes a CuSnNi alloy layer.

Abstract: A semiconductor device, including a first board, a second board having a plurality of through holes passing therethrough, and a plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board. The second board is a printed circuit board that further includes, in a top view thereof, a plurality of support regions, each having one of the plurality of through holes formed therein, and a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by each buffer region.

Abstract: A semiconductor device includes an insulated circuit board having conductor layers arranged away from each other and bonding materials each provided on the conductor layers; a wiring board having an opposing surface facing the conductor layers and through holes each corresponding to a position of each bonding material; hollow members each having a cylindrical portion and a flanged portion at one end of the cylindrical portion and having a cavity in common with the cylindrical portion, ok cylindrical portions press-fitted into the through holes, and other ends of the cylindrical portions bonded to the conductor layers by the bonding materials; and external connection terminals each inserted into the cavity of each hollow member and bonded to the conductor layers. Each cylindrical portion is inserted into each through hole such that each flanged portion contacts with an upper surface opposed to the opposing surface of the wiring board.