Abstract: The invention provides a substrate processing device and a substrate processing method for cooling a substrate, which are capable of conveying a substrate in a cleaner condition. A substrate cooling device serving as a substrate processing device of an embodiment of the invention includes: a chamber; a cooling unit which performs cooling; a substrate holder which is provided with a substrate mounting surface for mounting a substrate inside the chamber, and is cooled by the cooling unit; and a shield which is provided with a side surface portion surrounding a lateral side of the substrate mounting surface inside the chamber, and is cooled by the cooling unit. Moreover, a shield heater is provided in the vicinity of a surface on the inside of the shield.

Abstract: The invention provides a substrate processing device and a substrate processing method for cooling a substrate, which are capable of conveying a substrate in a cleaner condition. A substrate cooling device serving as a substrate processing device of an embodiment of the invention includes: a chamber; a cooling unit which performs cooling; a substrate holder which is provided with a substrate mounting surface for mounting a substrate inside the chamber, and is cooled by the cooling unit; and a shield which is provided with a side surface portion surrounding a lateral side of the substrate mounting surface inside the chamber, and is cooled by the cooling unit. Moreover, a shield heater is provided in the vicinity of a surface on the inside of the shield.

Abstract: An electronic apparatus (for example, a projector) includes a cooling fan, a fixation frame that fixes the cooling fan, and an external housing that fixes the fixation frame. The fixation frame includes a plate-shaped portion that fixes the cooling fan. The plate-shaped portion has one end fixed to the external housing and the other end which is released, is installed so as to be substantially perpendicular to an extending direction of a rotation center axis of the cooling fan, and has flexibility that the plate-shaped portion is bent in a substantially extending direction of the rotation center axis when an impact is applied to the electronic apparatus.

Abstract: The present invention provides a film forming apparatus configured such that the occurrence of contamination is reduced between targets. The film forming apparatus includes: a plurality of target electrodes respectively having attachment surfaces to which targets can be attached; a substrate holder for holding a substrate at a position opposing the plurality of target electrodes; a first shutter member rotatably provided between the plurality of target electrodes and the substrate holder and having a plurality of openings that can oppose the attachment surfaces; and a shield member disposed adjacent to the first shutter member and having a number of openings equal to the number of the target electrodes, wherein a gap between the first shutter member and the shield member widens toward an outer perimeter from a portion where adjacent target electrodes are closest.

Abstract: A film-forming apparatus includes a plurality of target electrodes, a substrate holder for holding a substrate, a first shutter member rotatably provided between the plurality of target electrodes and the substrate holder and having a plurality of openings, first separating walls provided on a surface of the first shutter member, the surface being on the target electrode side; and second separating walls provided between the first shutter member and the target electrodes, wherein the first separating walls are provided so as to sandwich each of the plurality of openings of the first shutter member.

Abstract: An apparatus includes a plurality of target electrodes having attachment surfaces, a substrate holder, a first shutter member provided between the plurality of target electrodes and the substrate holder and having a plurality of openings, a first separating portion disposed between the openings of the first shutter member on its surface of the target electrode side, and a second separating portion disposed between the first shutter member and the target electrodes. The first shutter member is driven so as to bring the first separating portion and the second separating portion toward each other so that an indirect path can be formed between the first separating portion and the second separating portion, and driven so as to bring the first separating portion and the second separating portion away from each other so that the first shutter plate can be rotated.

Abstract: To uniformly perform processing such as deposition on a processing object such as a large, heavy substrate for optics, the large, heavy substrate for optics is accurately, reliably attached to a holder.

Abstract: A vacuum processing apparatus includes a process chamber, a load lock chamber connected to the process chamber, and a transfer device configured to transfer a substrate from the load lock chamber to the process chamber. The transfer device is configured to move the substrate by gravity. The transfer device includes a guide configured to form a transfer path when the substrate moves by the gravity, and a stopper configured to limit movement of the substrate by the gravity when holding the substrate, and cancel the limitation when moving the substrate.

Abstract: An apparatus includes a plurality of target electrodes having attachment surfaces, a substrate holder, a first shutter member provided between the plurality of target electrodes and the substrate holder and having a plurality of openings, a first separating portion disposed between the openings of the first shutter member on its surface of the target electrode side, and a second separating portion disposed between the first shutter member and the target electrodes. The first shutter member is driven so as to bring the first separating portion and the second separating portion toward each other so that an indirect path can be formed between the first separating portion and the second separating portion, and driven so as to bring the first separating portion and the second separating portion away from each other so that the first shutter plate can be rotated.

Abstract: The present invention provides a film forming apparatus configured such that the occurrence of contamination is reduced between targets. The film forming apparatus includes: a plurality of target electrodes respectively having attachment surfaces to which targets can be attached; a substrate holder for holding a substrate at a position opposing the plurality of target electrodes; a first shutter member rotatably provided between the plurality of target electrodes and the substrate holder and having a plurality of openings that can oppose the attachment surfaces; and a shield member disposed adjacent to the first shutter member and having a number of openings equal to the number of the target electrodes, wherein a gap between the first shutter member and the shield member widens toward an outer perimeter from a portion where adjacent target electrodes are closest.

Abstract: A film-forming apparatus includes a plurality of target electrodes, a substrate holder for holding a substrate, a fires shutter member rotatably provided between the plurality of target electrodes and the substrate holder and having a plurality of openings, first separating walls provided on a surface of the first shutter member, the surface being on the target electrode side; and second separating walls provided between the first shutter member and the target electrodes, wherein the first separating walls are provided so as to sandwich each of the plurality of openings of the first shutter member.

Abstract: To uniformly perform processing such as deposition on a processing object such as a large, heavy substrate for optics, the large, heavy substrate for optics is accurately, reliably attached to a holder.