Patents by Inventor Yuji Kajiwara

Yuji Kajiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5882317
    Abstract: A method of sampling a suction effusion fluid is provided, which is convenient and highly efficient and which leaves no marks on the skin. First, (a) A suction cell with a cup-shaped hollow body is prepared. The body has an inner space, an aperture connected to the inner space, and a suction port connected to the inner space. The aperture is applied to a skin of a living organism. The inner space of the body is evacuated through the suction port. Next, (b) Bores are formed in a horny layer of the skin of the living organism. The bores has a depth that penetrates the horny layer and do not reach a capillary tube in the skin. Further, (c) The suction cell is held so that the aperture of the cell is opposed to the skin. The cell covers the bores formed in the horny layer and is tightly contacted with the skin. Finally, (d) The inner space of the suction cell is evacuated in such a way that the skin is bulged and the bores are expanded.
    Type: Grant
    Filed: September 19, 1997
    Date of Patent: March 16, 1999
    Assignee: NEC Corporation
    Inventors: Soichi Saito, Yuji Kajiwara, Atsushi Saito
  • Patent number: 5762640
    Abstract: A device for sucking an effusion fluid from the skin of an organism from which keratin has been removed. A disk is received in the cavity of a cell for sucking an effusion fluid in contact with the surface of an organism. Guide grooves are formed in the surface of the disk facing a suction port while holes are formed through the disk in each guide groove. The disk allows a minimum of fluid to remain thereon and guides the fluid toward the suction side in order to enhance efficient collection. When the fluid is collected a plurality of times, the preceding fluid and the following fluid are prevented from being mixed together, insuring accurate measurement.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: June 9, 1998
    Assignee: NEC Corporation
    Inventors: Yuji Kajiwara, Hidetaka Fujiwara
  • Patent number: 4698495
    Abstract: The contact type image sensor includes a transparent insulator substrate, a common electrode formed on a main surface of the insulator substrate, an amorphous silicon layer formed on the common electrode, a plurality of individual electrodes formed on the amorphous silicon layer, an insulator layer covering the amorphous silicon layer and having openings at the portions of the individual electrodes, and a plurality of wiring layers formed on the insulator layer for leading out the output signal in response to the light introduced from a back surface of the insulator substrate. A photo-shield layer may be interposed between the common electrode and the amorphous silicon layer.
    Type: Grant
    Filed: January 23, 1987
    Date of Patent: October 6, 1987
    Assignee: NEC Corporation
    Inventor: Yuji Kajiwara
  • Patent number: 4353047
    Abstract: The present invention provides a dielectric material adapted for microwave integrated circuits (MIC) and an electric circuit making use of said dielectric material. More particularly, an oxide dielectric material principally consisting of (1-x)BaO.xTiO.sub.2 (0.7.ltoreq.x.ltoreq.0.95) and containing both 0.007 to 0.7 weight % of manganese and 0.037 to 3.7 weight % of zirconium, has a large dielectric constant, a small dielectric loss and a small temperature coefficient of dielectric constant and is uniform over a broad range, and especially it is possible to easily manufacture a substrate having a uniform dielectric constant and a uniform dielectric loss. Transistors and MIC's employing such substrates can attain uniform and excellent high-frequency characteristics.
    Type: Grant
    Filed: April 28, 1981
    Date of Patent: October 5, 1982
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Tsutomu Noguchi, Yuji Kajiwara, Masanori Suzuki, Hideo Takamizawa
  • Patent number: 4259564
    Abstract: A thermal printing head having a heating resistor prepared according to a thin-film technique and a wiring circuit prepared according to a thick-film technique achieves a high printing quality at a low cost. A thin-film resistor is formed on a heat-insulating dielectric layer which is, in turn, provided partially on a dielectric substrate, while thick-film lead electrodes, which are connected to a driving circuit, are formed on the dielectric substrate so as to make contact with the edge portion of the heat-insulating dielectric layer. Thin-film lead electrodes electrically connect the thick-film lead electrodes to the opposite ends of the thin-film resistor. The heat-insulating dielectric layer and the thick-film lead electrodes are provided by means of thick-film technique such as screen-printing and succeeding firing processes and the thin-film resistor and the thin-film lead electrodes are formed through thin-film technique such as sputtering or vacuum-evaporating process.
    Type: Grant
    Filed: August 15, 1979
    Date of Patent: March 31, 1981
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Toshio Ohkubo, Hidehiko Katoh, Yuji Kajiwara
  • Patent number: 4241103
    Abstract: A thermal printing head having a heating resistor prepared according to a thin-film technique and a wiring circuit prepared according to a thick-film technique achieves a high printing quality at a low cost. A thin-film resistor is formed on a heat-insulating dielectric layer which is, in turn, provided partially on a dielectric substrate, while thick-film lead electrodes, which are connected to a driving circuit, are formed on the dielectric substrate so as to make contact with the edge portion of the heat-insulating dielectric layer. Thin-film lead electrodes electrically connect the thick-film lead electrodes to the opposite ends of the thin-film resistor. The heat-insulating dielectric layer and the thick-film lead electrodes are provided by means of thick-film technique such as screen-printing and succeeding firing processes and the thin-film resistor and the thin-film lead electrodes are formed through thin-film technique such as sputtering or vacuum-evaporating process.
    Type: Grant
    Filed: May 31, 1978
    Date of Patent: December 23, 1980
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Toshio Ohkubo, Hidehiko Katoh, Yuji Kajiwara
  • Patent number: 4204107
    Abstract: A thermal printing head which effects printing on thermally sensitive paper with Joule's heat generated by passing a current through a thick-film resistor is featured by the surface configuration of the thick-film resistor. In a cross-section perpendicular to the direction of the current passing through the resistor, the resistor is formed in such shape that the center portion is lower than the opposite edge portions. Owing to such concave top surface, despite of the fact that the heating resistor is a thick-film resistor, printing of high quality that is compatible to printing quality by a thin-film resistor can be accomplished. A practically useful thermal head having the resistors with the concave top surface can be realized through the photo-resist pattern technique combined with the screen printing technique.
    Type: Grant
    Filed: May 31, 1978
    Date of Patent: May 20, 1980
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Toshio Ohkubo, Yuji Kajiwara, Tsutomu Itano
  • Patent number: 4037168
    Abstract: As an input and/or an output matching circuit for a transistor, a transistorized high-frequency power amplifier comprises at least one pattern of a conductive material on a sheet of a ferroelectric material placed on a conductive base plate in direct contact therewith. The ferroelectric material is represented by the formula:(1 - x) BaO.xTiO.sub.2,where 0.7 .ltoreq. x < 1.0. Preferably, x .ltoreq. 0.95. The pattern may be in direct contact with the ferroelectric sheet to form a capacitor together with the base plate, a quarter-wavelength impedance transformer, or both. Preferably, the pattern is formed by integrated circuit techniques. An inductor may preferably be provided either by a portion of the pattern with a conventional dielectric material substituted for the ferroelectric material at that part of the sheet which is below the pattern portion or by a chip inductor.
    Type: Grant
    Filed: September 9, 1976
    Date of Patent: July 19, 1977
    Assignee: Nippon Electric Company Limited
    Inventors: Hidehiko Katoh, Yuji Kajiwara, Hideo Takamizawa