Abstract: The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.

Abstract: A circuit pattern forming method that can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern. Thereby, a highly reliable printed circuit board can be formed. A conductive pattern and an insulating pattern of a predetermined thickness are overlappingly drawn by scanning a liquid ejection head and a substrate relative to each other a plurality of times, while ejecting droplets of a conductive pattern forming solution and an insulating pattern forming solution. When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times, until the conductive pattern has a predetermined thickness.

Abstract: A plurality of conductive patterns are formed so as to be arranged in a scanning direction of a recording head. A state of each of the conductive patterns and a state between the adjacent conductive patterns are electrically checked to detect a wire break and a short circuit in the conductive patterns.

Abstract: A production apparatus, for producing a probe array, comprises a liquid discharging device for discharging a liquid containing a probe capable of being specifically bonded to a target substance in order to form a spot on the carrier, a detector for detecting whether the spot is formed or not by observing a surface state on the carrier, and a controller for controlling the liquid discharge device to again discharge the liquid to form the spot on the carrier if the detector detects that the spot has not been formed on the carrier.

Abstract: An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.

Abstract: A circuit pattern forming method includes a first ejection step of ejecting large droplets of a circuit pattern forming liquid onto a substrate, by causing a liquid ejection head to scan the substrate, to form first dots of the liquid on the substrate with gaps between the first dots, a second ejection step of ejecting, from the liquid ejection head, before the first dots formed on the substrate solidify, and while the liquid ejection head is caused to scan the substrate in the first ejection step, a small droplet, which is smaller in size than the large droplets, to form a second dot of the liquid between the first dots of the liquid on the substrate and, thereby to form a liquid circuit pattern by mixing the first dots and the second dot together, and a fixing step of solidifying the liquid circuit pattern to form a circuit pattern on the substrate.

Abstract: In the process of forming, on a substrate, a multi-layered circuit pattern with layers each having a portion made of the same material throughout the different layers in the direction in which the different layers are stacked, the position of nozzles with respect to the substrate when at least one of the layers is formed is shifted from that when the other layers are formed.

Abstract: A circuit pattern forming device includes a liquid ejection device that ejects an insulating pattern forming solution and a conductive pattern forming solution onto a substrate to form insulating dots of the insulating solution and conductive dots of the conductive solution on the substrate. A control device controls an ejection operation that the liquid ejection device performs for each of the solutions. A moving device moves the liquid ejection device and the substrate relative to each other to form a circuit pattern composed of a plurality of the conductive dots and the insulating dots. The liquid ejection device includes a first nozzle array in which a plurality of nozzles for ejecting the insulating solution are arranged along a crossing direction crossing a main scan direction, and a second nozzle array in which a plurality of nozzles for ejecting the conductive solution are arranged along the crossing direction.

Abstract: An apparatus produces a probe carrier by discharging plural kinds of liquids respectively containing plural kinds of probes capable of specifically bonding to a target substance on a carrier. The apparatus includes a liquid discharge device, a positioning device for determining a position between the liquid discharge device and the carrier, and moving the carrier in the scanning direction, an application information detector to detect application information of discharged liquids, and a defective spot detector to detect defective spots where the liquids are not applied. Also included are a discharge data forming device for forming data on the defective spots, a processor for counting a number of redrawings, and a secondary scanning direction driver for relatively moving the carrier in a secondary scanning direction. In the apparatus, redrawing is performed according to discharge data, and when the number of redrawings exceeds a prescribed number, a message of abnormality is outputted.

Abstract: A liquid discharge apparatus for aligning needle-like structures. The apparatus includes a tapered nozzle having an entrance and a discharge opening. The nozzle is tapered in such a manner that its diameter decreases towards the discharge opening. The diameter of the nozzle at the entrance is larger than the length of the needle-like structures, and the diameter of the discharge opening is larger than the diameter of the needle-like structures and smaller than the length of the needle-like structures. By passing through the nozzle, the needle-like structures are aligned.

Abstract: The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.

Abstract: An alignment unit and an alignment method for aligning needle-like structures. The alignment unit includes a substrate having a surface and grooves defined in the surface. The grooves are sized and arranged such that when the needle-like structures are received therein, the needle-like structures are aligned.

Abstract: An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.

Abstract: When forming circuit patterns by ejecting a minute amount of a conductive pattern solution and insulating pattern solution from a liquid ejection head in the form of an ink-jet head, a break or short circuit in a circuit caused by an ejection malfunction is prevented. During the forming process of the circuit patterns, preliminary ejection of the liquid ejection head for forming the circuit patterns is carried out toward an area without the circuit patterns. In addition, the preliminary ejection is carried out at intervals less than an ejection interruption time that might cause the ejection malfunction.

Abstract: In the process of forming, on a substrate, a multi-layered circuit pattern with layers each having a portion made of the same material throughout the different layers in the direction in which the different layers are stacked, the position of nozzles with respect to the substrate when at least one of the layers is formed is shifted from that when the other layers are formed.

Abstract: The present invention is intended to provide a highly reliable circuit pattern forming device which can cause a conductive solution to land on the substrate with high precision and which, when forming a multilayer printed circuit board, prevents closely arranged wires from becoming short-circuited. To realize this objective, this invention forms a circuit pattern by ejecting onto the substrate the droplets of insulating solution and the droplets of conductive solution while moving the liquid ejection unit and the substrate relative to each other. During this process, when both of the droplets are landed close together on the substrate, the droplets of insulating solution are made to land on the substrate prior to the droplets of conductive solution.

Abstract: The present invention provides a circuit pattern forming device and a circuit pattern forming method both of which can eliminate problems, such as open circuits and short circuits, when forming circuit patterns on the substrate and which can form circuit patterns of a thin film uniform in thickness. To this end, the present invention forms liquid dots on the substrate with gaps between the dots. Then, it further forms liquid dots between the liquid dots, thus forming a liquid circuit pattern. The circuit pattern is then solidified by a fixing step.

Abstract: A plurality of conductive patterns are formed so as to be arranged in a scanning direction of a recording head. A state of each of the conductive patterns and a state between the adjacent conductive patterns are electrically checked to detect a wire break and a short circuit in the conductive patterns.

Abstract: A circuit pattern forming method is provided which can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern and thereby can form a highly reliable printed circuit board. To that end, this invention overlappingly draws a conductive pattern and an insulating pattern of a predetermined thickness by scanning a liquid ejection head and a substrate relative to each other a plurality of times while ejecting droplets of a conductive pattern forming solution and an insulating pattern forming solution. When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times until the conductive pattern has a predetermined thickness.

Abstract: An image printing apparatus is capable of printing an image at various resolutions, such as 300- and 360-dpi systems. To drive a printhead at a printing position corresponding to the resolution of printing data, information on whether to discharge ink separately in the forward and return passes of the printhead is stored in the storage area of a RAM in advance in correspondence with the main scanning position of the printhead. Data (0 or 1) stored in the RAM is read out by using, as a RAM address input, a count value output from a printhead position detection unit that represents the current position of the printhead. Only when the readout data is 1, a printing position pulse is generated to print an image at an arbitrary resolution. By setting ink discharge positions separately in the forward and return passes, an image can be printed at a high precision.