Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

Abstract: A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.

Abstract: A vehicle D-ring attachment bracket assembly includes a vehicle D-ring attachment bracket having a first mounting hole, a second mounting hole, and a D-ring bolt hole positioned between the first and second mounting holes. The assembly also includes a first energy absorber attached to the attachment bracket. The first energy absorber includes a first energy absorber first hole positioned coaxially or substantially coaxially with the bracket first mounting hole, and a first energy absorber second hole positioned coaxially or substantially coaxially with the bracket second mounting hole.

Abstract: A vehicle D-ring attachment bracket assembly includes a vehicle D-ring attachment bracket having a first mounting hole, a second mounting hole, and a D-ring bolt hole positioned between the first and second mounting holes. The assembly also includes a first energy absorber attached to the attachment bracket. The first energy absorber includes a first energy absorber first hole positioned coaxially or substantially coaxially with the bracket first mounting hole, and a first energy absorber second hole positioned coaxially or substantially coaxially with the bracket second mounting hole.

Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

Abstract: There is provided a vehicle seat including: a frame member that structures a frame of a seatback; a pair of supporting members that extend in a seat vertical direction, and that are supported by the frame member at a seat upper side and a seat lower side; a fabric spring member that has elasticity and is stretched between the pair of supporting members; and a spanning member that is provided extending between the pair of supporting members, so as to impart tension to the fabric spring member.

Abstract: There is provided a vehicle seat including: a frame member that structures a frame of a seatback; a pair of supporting members that extend in a seat vertical direction, and that are supported by the frame member at a seat upper side and a seat lower side; a fabric spring member that has elasticity and is stretched between the pair of supporting members; and a spanning member that is provided extending between the pair of supporting members, so as to impart tension to the fabric spring member.

Abstract: A vehicle seat includes a seat cushion frame provided at a seat cushion; a seatback frame structuring a seatback, the seatback frame being rotatably coupled to a front-rear direction rear end portion of the seat cushion frame via a rotation axle; a drive unit disposed at a front-rear direction front side of the seat cushion frame; and a first driving force transmission unit that couples the drive unit with the rotation axle and transmits driving force of the drive unit to the rotation axle.

Abstract: A vehicle seat includes a seat cushion frame provided at a seat cushion; a seatback frame structuring a seatback, the seatback frame being rotatably coupled to a front-rear direction rear end portion of the seat cushion frame via a rotation axle; a drive unit disposed at a front-rear direction front side of the seat cushion frame; and a first driving force transmission unit that couples the drive unit with the rotation axle and transmits driving force of the drive unit to the rotation axle.

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

Abstract: A computer is provided with a control unit, including a processor, and a storage unit for storing pieces of data that were used by a plurality of businesses, and calculates the association between the plurality of businesses, wherein: the storage unit stores data identification information identifying the pieces of data that were used by the plurality of businesses, business identification information identifying each of the plurality of businesses, and association information identifying the association between the business identification information and the data identification information about the pieces of data used by the plurality of businesses; and the control unit checks the association information and outputs, as a combination of associated sets of business identification information, different sets of business identification information which are associated with at least one same piece of data among the pieces of data used by the plurality of businesses and identified by the data identification info

Abstract: A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 ?m or more but 20 ?m or less is provided between the joining surfaces and the three-dimensional web structure.

Abstract: There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.

Abstract: A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.

Abstract: A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 ?m or more but 20 ?m or less is provided between the joining surfaces and the three-dimensional web structure.

Abstract: A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.

Abstract: Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.

Abstract: There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.