Abstract: A method for producing a printing plate, containing: an exposure step of forming a relief by the exposure of a photosensitive resin composition; and a developing step of performing development by attaching or adsorbing the photosensitive resin composition of an unexposed portion in the exposure step to a development medium, wherein a storage elastic modulus of the photosensitive resin composition of the unexposed portion at a development temperature of the developing step is 100 Pa or more and 4000 Pa or less, and the development medium is a wiper having an elastic recovery rate of 30% or more and 99% or less.

Abstract: A wastewater treatment device has: an ozone generator which supplies ozone; a mixer which mixes ozone supplied from the ozone generator with wastewater and supplies ozone mixed wastewater; an ozone oxidation unit which progresses ozone oxidation in the ozone mixed wastewater while passing the ozone mixed wastewater therethrough and discharges wastewater in which the ozone has been consumed; a biological treatment unit which performs biological treatment on the wastewater discharged from the ozone oxidation unit using microorganisms; and an adjusting device which adjusts the amount of ozone to be mixed with the wastewater by the mixer so that ozone in an amount that inhibits the microorganisms of the biological treatment unit does not remain in the wastewater discharged from the ozone oxidation unit.

Abstract: A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Abstract: An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

Abstract: Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

Abstract: An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.

Abstract: A wastewater treatment device has: an ozone generator which supplies ozone; a mixer which mixes ozone supplied from the ozone generator with wastewater and supplies ozone mixed wastewater; an ozone oxidation unit which progresses ozone oxidation in the ozone mixed wastewater while passing the ozone mixed wastewater therethrough and discharges wastewater in which the ozone has been consumed; a biological treatment unit which performs biological treatment on the wastewater discharged from the ozone oxidation unit using microorganisms; and an adjusting device which adjusts the amount of ozone to be mixed with the wastewater by the mixer so that ozone in an amount that inhibits the microorganisms of the biological treatment unit does not remain in the wastewater discharged from the ozone oxidation unit.

Abstract: A wastewater treatment device has: an ozone generator which supplies ozone; a mixer which mixes ozone supplied from the ozone generator with wastewater and supplies ozone mixed wastewater; an ozone oxidation unit which progresses ozone oxidation in the ozone mixed wastewater while passing the ozone mixed wastewater therethrough and discharges wastewater in which the ozone has been consumed; a biological treatment unit which performs biological treatment on the wastewater discharged from the ozone oxidation unit using microorganisms; and an adjusting device which adjusts the amount of ozone to be mixed with the wastewater by the mixer so that ozone in an amount that inhibits the microorganisms of the biological treatment unit does not remain in the wastewater discharged from the ozone oxidation unit.

Abstract: An epoxy resin composition that comprises an epoxy resin and a curing agent, the epoxy resin comprising an epoxy compound that has, in one molecule, two or more structural units represented by the following Formula (I) and two or more epoxy groups, and the curing agent comprising a compound having two or more amino groups that are directly bound to an aromatic ring.

Abstract: A washing and drying machine includes: a washing drum for accommodating the washings and rotating under a driving force of a motor; an air supply portion for supplying air into the washing drum; a heating portion configured to heat the air to be supplied into the washing drum when turned on and stop heating when turned off; and a control portion for controlling the motor, the air supply portion and the heating portion to execute a washing and drying operation. A drying procedure in the washing and drying operation includes main drying treatment repeated for multiple times. During each time of the main drying treatment, the control portion is configured to keep the heating portion being on within a first period, and keep the heating portion being off within a second period different from the first period, and the second period is longer than the first period.

Abstract: An epoxy resin, comprising an epoxy compound, the epoxy compound comprising two or more structures represented by the following Formula (I) and at least one divalent biphenyl group: wherein, in Formula (I), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.

Abstract: A resin composition, comprising: a thermosetting resin that has a mesogenic group in a molecule and that is capable of forming a smectic structure via a curing reaction; and mica.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.

Abstract: Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3.

Abstract: A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Abstract: An epoxy resin, comprising a first epoxy compound having a mesogenic structure and a second epoxy compound having two or more mesogenic structures that are the same as the mesogenic structure of the first epoxy compound, a proportion, determined by liquid chromatography, of the first epoxy compound being from 40% to 50% with respect to a total amount of the epoxy resin.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogen structure, wherein, when performing a process of decreasing a temperature of the epoxy resin from 150° C. to 30° C. at a rate of 2° C./min, and a process of increasing the temperature of the epoxy resin from 30° C. to 150° C. at a rate of 2° C./min, in this order, the epoxy resin has a maximum value of ??2/??1 of 20 or less within a temperature range of from 30° C. to 150° C., wherein ??1 is a dynamic shear viscosity (Pa·s) measured in the process of decreasing the temperature, and ??2 is a dynamic shear viscosity (Pa·s) measured in the process of increasing the temperature, ??1 and ??2 being measured at the same temperature, and a value ??2 measured at 100° C. is 1000 Pa·s or less.

Abstract: An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.