Patents by Inventor Yuki Ito

Yuki Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180294680
    Abstract: Disclosed is a resonance type power transmission device in which a plurality of systems having respective transmitters and receivers 3 are arranged opposite to each other and each of the systems transmits electric power having a single frequency, each of the transmitters and receivers having a transmission antenna 5 and a reception antenna 6 which are disposed so as to be fitted to each other, and in which a magnetic sheet 7 is disposed in a portion between the systems, opposite to the transmitters and receivers 3 at a distance, from each of the transmitters and receivers 3, of 1/10 or more of the minimum of the outer diameters of the transmission antenna 5 and the reception antenna 6.
    Type: Application
    Filed: January 28, 2015
    Publication date: October 11, 2018
    Applicant: Mitsubishi Electric Engineering Company, Limited
    Inventors: Yoshiyuki AKUZAWA, Yuki ITO, Hiroshi MATSUMORI
  • Patent number: 10098238
    Abstract: A method of manufacturing a resin multilayer substrate is provided in which a component (3) is incorporated in a stacked body obtained by stacking a plurality of thermoplastic resin sheets (2). The method includes the steps of: softening a first resin sheet (2a) by heating, and pressing the component (3) against the first resin sheet (2a), thereby fixing the component (3) to the first resin sheet (2a); stacking the first resin sheet (2a) on a second resin sheet (2b) having a through hole (14) receiving the component (3) and a third resin sheet (2c) located adjacent to a lower side of the component (3) such that the component (3) is inserted into the through hole (14) and the lower surface of the component (3) faces the third resin sheet (2c); and performing compression bonding by heating and pressurizing the stacked body including these resin sheets (2).
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: October 9, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaki Kawata, Yuki Ito
  • Patent number: 10084677
    Abstract: The present invention relates to a network device that is connected to a network and able to perform communication with a monitoring server via the network, a control method of a network device, and a storage medium that stores a program of implementing the control method. A network device according to the present embodiment generates first transmission data including setting information of the network device and generates second transmission data in the same structure as the first transmission data with lower processing load than the first transmission data. The network device transmits the generated second transmission data to the monitoring server using a command for executing a process different from a communication acknowledgement process. The network device suppresses transmission of the first transmission data in a case where a predetermined response to transmission of the second transmission data from the monitoring server is not received.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: September 25, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Yuki Ito
  • Publication number: 20180245183
    Abstract: Provided is a copper alloy for an electronic and electric device, including: Mg in a range of 0.5 mass % or more and 3.0 mass % or less; and a Cu balance including inevitable impurities, in which, a graph, in which a vertical axis is d?t/d?t and a horizontal axis is a true strain ?t, d?t/d?t being defined by a true stress ?t and the true strain ?t, obtained in a tensile test of the copper alloy, has a strained region that has a positive slope of d?t/d?t.
    Type: Application
    Filed: September 8, 2016
    Publication date: August 30, 2018
    Applicants: MITSUBISHI MATERIALS CORPORATION, Mitsubishi Shindoh Co., Ltd.
    Inventors: Kazunari MAKI, Yuki ITO, Takanori KOBAYASHI
  • Patent number: 10056165
    Abstract: This copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which is composed of Mg at a content of 3.3 to 6.9 atomic %, and a remainder of Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic %, and/or an average number of intermetallic compounds having grain sizes of 0.1 ?m or more is in a range of 1/?m2 or less, ??{1.7241/(?0.0347×A2+0.6569×A+1.7)}×100.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: August 21, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yuki Ito, Kazunari Maki
  • Publication number: 20180213653
    Abstract: A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view.
    Type: Application
    Filed: March 22, 2018
    Publication date: July 26, 2018
    Inventors: Shigeru TAGO, Kuniaki YOSUI, Yuki ITO
  • Patent number: 10033227
    Abstract: Disclosed is a resonant type transmission power supply device including a transmission power state detecting circuit 11 to detect a transmission power state of a transmission antenna 2, a foreign object detecting circuit 124 to detect the presence or absence of a foreign object in an electromagnetic field generated from the transmission antenna 2 on the basis of a detection result acquired by the transmission power state detecting circuit 11, and a power control circuit 125 to reduce or stop the supply of electric power to the transmission antenna 2 when foreign object is detected by the foreign object detecting circuit 124.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: July 24, 2018
    Assignee: Mitsubishi Electric Engineering Company, Limited
    Inventors: Yoshiyuki Akuzawa, Kiyohide Sakai, Toshihiro Ezoe, Yuki Ito
  • Patent number: 10032536
    Abstract: One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic %, ??{1.7241/(?0.0347×A2+0.6569×A+1.7)}×100. Another aspect of this copper alloy is composed of a ternary alloy of Cu, Mg, and Zn which includes Mg at a content of 3.3 to 6.9 atomic % and Zn at a content of 0.1 to 10 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity ? (% IACS) is within the following range when the content of Mg is given as A atomic % and the content of Zn is given as B atomic %, ??{1.7241/(X+Y+1.7)}×100, X=?0.0347×A2+0.6569×A and Y=?0.0041×B2+0.2503×B.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: July 24, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yuki Ito, Kazunari Maki
  • Publication number: 20180205264
    Abstract: A transmission/reception unit including a transmitting antenna and a receiving antenna for carrying out a wireless power transmission in cooperation with the transmitting antenna. Each of the transmitting antenna and the receiving antenna includes a coil which has a shape in which a portion through which a current flows in a direction extends along another portion through which a current flows in an opposite direction.
    Type: Application
    Filed: August 3, 2015
    Publication date: July 19, 2018
    Applicant: Mitsubishi Electric Engineering Company, Limited
    Inventors: Yoshiyuki AKUZAWA, Yuki ITO
  • Patent number: 10028238
    Abstract: A transmitting device includes a transmission power supply to output electric power, whose frequency matches a resonance frequency of each of the transmitting antennas, based on input power, plural switches respectively provided for the transmitting antennas, the switches being switchable to connect or disconnect supply lines for supplying the electric power outputted by the transmission power supply to the transmitting antennas, a parameter detector to detect parameters regarding the transmission power supply, the parameter being changed as a receiving antenna gets close to the transmitting antennas, by using a protective function of the transmission power supply, and a switch controller to estimate the position of the receiving antenna from the result of the detection, and to perform switching control on the switches in accordance with the position of the receiving antenna.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: July 17, 2018
    Assignee: Mitsubishi Electric Engineering Company, Limited
    Inventors: Yoshiyuki Akuzawa, Yuki Ito, Hiroshi Matsumori
  • Patent number: 10021787
    Abstract: A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: July 10, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Keisuke Araki, Yuki Ito, Kenji Kubota
  • Publication number: 20180182681
    Abstract: A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.
    Type: Application
    Filed: February 26, 2018
    Publication date: June 28, 2018
    Inventors: Kuniaki YOSUI, Hirofumi SHINAGAWA, Yuki ITO
  • Patent number: 10003128
    Abstract: Disclosed is a resonant type power transmission antenna device provided with a plurality of transmission antennas 12 and a plurality of reception antennas 13, the resonant type power transmission antenna device including a transmission shield antenna 22 arranged between the plurality of transmission antennas 12, a reception shield antenna 23 arranged between the plurality of reception antennas 13, transmission and reception circuits 21 and 24 to operate the transmission and reception shield antennas 22 and 23 in electromagnetic field resonance having a phase opposite to that of the transmission and reception antennas 12 and 13 respectively adjacent to the transmission and reception shield antennas.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: June 19, 2018
    Assignee: MITSUBISHI ELECTRIC ENGINEERING COMPANY, LIMITED
    Inventors: Yoshiyuki Akuzawa, Kiyohide Sakai, Toshihiro Ezoe, Yuki Ito
  • Publication number: 20180141321
    Abstract: A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.
    Type: Application
    Filed: January 18, 2018
    Publication date: May 24, 2018
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Keisuke IKENO, Shigeru TAGO, Hirohumi SHINAGAWA, Kuniaki YOSUI, Yuki ITO
  • Patent number: 9979315
    Abstract: A rectifying circuit for high-frequency power supply that rectifies an alternating voltage at a high frequency exceeding 2 MHz, the rectifying circuit for high-frequency power supply including a bridge rectifier circuit that rectifies the alternating voltage inputted from a reception antenna for power transmission, a matching functional circuit that matches a resonance condition to that of the reception antenna for power transmission, and a smoothing functional circuit that smooths the voltage rectified by the bridge rectifier circuit into a direct voltage, in which the rectifying circuit for high-frequency power supply causes the bridge rectifier circuit to perform partial resonant switching in a switching operation at the time of rectification by using the matching functional circuit and the smoothing functional circuit.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: May 22, 2018
    Assignee: MITSUBISHI ELECTRIC ENGINEERING COMPANY, LIMITED
    Inventors: Yoshiyuki Akuzawa, Kiyohide Sakai, Toshihiro Ezoe, Yuki Ito
  • Patent number: 9980371
    Abstract: A printed wiring board includes a resin insulating layer having recess portions formed on first surface, a first conductor layer formed in the recess portions and including pads positioned to mount an electronic component, conductive pillars formed on the pads, respectively, and formed to mount the electronic component onto the resin insulating layer, a second conductor layer formed on second surface of the resin insulating layer on the opposite side with respect to the first surface, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the first and second conductor layers. The pillars is formed such that each of the pads has an exposed surface exposed from a respective one of the conductive pillars, and the pads are formed such that the exposed surface is recessed from the first surface of the resin insulating layer.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: May 22, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Takayuki Katsuno, Yuki Ito, Takeshi Furusawa, Takema Adachi
  • Patent number: 9974185
    Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: May 15, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shigeru Tago, Hirofumi Shinagawa, Yuki Wakabayashi, Kuniaki Yosui, Yuki Ito, Toshiro Adachi, Wataru Yanase, Masaki Kawata
  • Patent number: 9961780
    Abstract: A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: May 1, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hirofumi Shinagawa, Shigeru Tago, Masaki Kawata, Yuki Ito
  • Publication number: 20180109413
    Abstract: Provided is a method of controlling an image forming apparatus, the method including: periodically making an inquiry about an instruction to a management server; determining whether or not to display a notification indicating that a message has arrived, based on information about a registered time of the message acquired by the management server as a result of the inquiry, and information about a time when the message is displayed on the image forming apparatus; and controlling the notification indicating that a message has arrived to be displayed in a predetermined display area in accordance with at least a determination, in the determining, that the notification indicating that the message has arrived is displayed, and controlling not to display the notification indicating that the message has arrived in accordance with at least a determination, in the determining, that the notification indicating that the message has arrived is not displayed.
    Type: Application
    Filed: October 13, 2017
    Publication date: April 19, 2018
    Inventor: Yuki Ito
  • Patent number: 9941745
    Abstract: A second resonant type transmission power supply device 1b includes a transmission power state detecting circuit 11b that detects a transmission power state of a second transmission antenna 2b, a foreign object detecting circuit 124b that detects the presence or absence of a foreign object in an overlapping range of electromagnetic fields on the basis of a detection result acquired by the transmission power state detecting circuit 11b, and a power control circuit 125b that, when a foreign object is detected by the foreign object detecting circuit 124b, controls a first resonant type transmission power supply device 1a in such a way as to reduce or stop the supply of electric power to a first transmission antenna 2a.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 10, 2018
    Assignee: Mitsubishi Electric Engineering Company, Limited
    Inventors: Yoshiyuki Akuzawa, Kiyohide Sakai, Toshihiro Ezoe, Yuki Ito