Patents by Inventor Yuki KIKUCHI

Yuki KIKUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11073776
    Abstract: An image forming apparatus includes a heater, a fixing device, and a controller. The heater includes a heat generator that generates heat when the heater is turned on. The fixing device may fix a developer image on a surface of an image forming medium using the heat from the heat generator. The controller detects a voltage of a power supply for supplying electric power to the heater, and determines an occurrence of an abnormality in the heater if a voltage drop amount at the time the heater is turned on as compared to a case in which the heater is turned off is smaller than a first threshold value.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: July 27, 2021
    Assignee: TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Eiji Shinohara, Kazuhiko Kikuchi, Sasuke Endo, Masaya Tanaka, Ryota Saeki, Kousei Miyashita, Ryosuke Kojima, Yohei Doi, Yuki Kawashima, Kiyotaka Murakami
  • Patent number: 11069961
    Abstract: An antenna device to be mounted on a vehicle, including a ground conductor having a planar shape; and an antenna element which is a resonant type, is provided at a position so as not to overlap with the ground conductor within a plane substantially parallel to the ground conductor, and is configured to transmit or receive a polarized wave parallel to the ground conductor. A rectangular notch is formed in the ground conductor to have both a right and left edge portions with a predetermined width being left, and the antenna element is provided at a position overlapping with the notch in a plane substantially parallel to the ground conductor.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: July 20, 2021
    Assignee: YOKOWO CO., LTD.
    Inventors: Takeshi Sampo, Kenichi Yamada, Yuki Kikuchi
  • Patent number: 10978300
    Abstract: Embodiments are disclosed that reduce gouging during multi-patterning processes using thermal decomposition materials. For one embodiment, gouging is reduced or suppressed by using thermal decomposition materials as cores during multiple patterning processes. For one embodiment, gouging is reduced or suppressed by using thermal decomposition materials as a gap fill material during multiple patterning processes. By using thermal decomposition material, gouging of an underlying layer, such as a hard mask layer, can be reduced or suppressed for patterned structures being formed using the self-aligned multi-patterning processes because more destructive etch processes, such as plasma etch processes, are not required to remove the thermal decomposition materials.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: April 13, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Patent number: 10950442
    Abstract: Embodiments are disclosed that improve etch uniformity during multi-patterning processes for the manufacture of microelectronic workpieces by reshaping spacers using thermal decomposition materials as a protective layer. Because the thermal decomposition material can be removed through thermal treatment processes without requiring etch processes, spacers can be reshaped with no spacer profile change or damage while suppressing undesired gouging differences in underlying layers and related degradation in etch uniformity.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: March 16, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Patent number: 10916428
    Abstract: A process is provided in which a patterned layer, an intervening layer and a first layer to be etched according to the pattern of the patterned layer are formed. The intervening layer may be a thermal decomposition layer that may be removed by a heat based removal process. After etching the first layer, the use of a heat based removal process may allow the intervening layer to be removed from the substrate without altering the first layer. In one embodiment, the first layer may be a memorization layer and the process may be a multiple patterning process.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: February 9, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Patent number: 10905510
    Abstract: A manipulator is used to operate a surgical device that treats a body tissue. The manipulator includes a drive mechanism having a stationary section to be attached on a housing of a drive unit containing with at least one motor. A movable part is supported rotatably about a predetermined axis on the stationary section and having a connecting portion configured to be connected to the at least one motor when the stationary section is attached on the housing. A cover is configured to seal a gap between the movable part and the stationary section so as to prevent fluid from entering the gap between the movable part and the stationary part. A power transmission member is connected to both the movable part and the surgical device to transmit power from the motor to the surgical device.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: February 2, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Arimasa Sugimoto, Yuki Kikuchi, Sadahiro Watanabe
  • Publication number: 20210003672
    Abstract: A distance measuring system includes a light source unit that emits infrared light toward a target object, a light receiving unit that receives the infrared light from the target object, and an arithmetic processing unit that obtains information regarding a distance to the target object on the basis of data from the light receiving unit, in which an optical member including a bandpass filter that is selectively transparent to infrared light in a predetermined wavelength range is arranged on a light receiving surface side of the light receiving unit, and the bandpass filter has a concave-shaped light incident surface.
    Type: Application
    Filed: February 19, 2019
    Publication date: January 7, 2021
    Inventors: SOZO YOKOGAWA, YUKI KIKUCHI, TAISUKE SUWA, MAKOTO CHIYODA
  • Patent number: 10886176
    Abstract: Self-aligned interconnect patterning for back-end-of-line (BEOL) structures is described. A method of fabricating an interconnect structure for an integrated circuit includes depositing a first metal layer on an initial interconnect structure, forming a patterned spacer layer containing recessed features on the first metal layer, and etching a self-aligned via in the first metal layer and into the initial interconnect structure using a recessed feature in the patterned spacer layer as a mask. The method further includes filling the via in the first metal layer and the recessed features in the patterned spacer layer with a second metal layer, removing the patterned spacer layer, and etching a recessed feature in the first metal layer using the second metal layer as a mask.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: January 5, 2021
    Assignee: Tokyo Electron Limited
    Inventors: Yuki Kikuchi, Kaoru Maekawa
  • Patent number: 10861739
    Abstract: A process is provided in which low-k layers are protected from damage by the use of thermal decomposition materials. In one embodiment, the low-k layers may be low-k dielectric layers utilized in BEOL process steps. The thermal decomposition materials may be utilized to replace organic layers that typically require ashing processes to remove. By removing the need for certain ashing steps, the exposure of the low-k dielectric layer to ashing processes may be lessened. In another embodiment, the low-k layers may be protected by plugging openings in the low-k layer with the thermal decomposition material before a subsequent process step that may damage the low-k layer is performed. The thermal decomposition materials may be removed by a thermal anneal process step that does not damage the low-k layers.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: December 8, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Publication number: 20200114505
    Abstract: A manipulator includes an elongated portion; a bending portion coupled to a distal end of the elongated portion, the bending portion being formed by articulating a plurality of segment pieces; an end effector coupled to a distal end of the bending portion; an actuator coupled to a proximal end of the elongated portion; a first wire coupled to between the actuator and the end effector, the first wire being configured to actuate the end effector; and a second wire coupled to between the actuator and the bending portion, the second wire being configured to actuate the bending portion. Each of the plurality of segment pieces is configured to be articulated so as to be twisted with respect to a longitudinal central axis of the bending portion, and the first wire is configured to be inserted into the plurality of segment pieces so as to form a substantially twisted path.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 16, 2020
    Applicant: OLYMPUS CORPORATION
    Inventor: Yuki KIKUCHI
  • Publication number: 20200020534
    Abstract: A process is provided in which a patterned layer, an intervening layer and a first layer to be etched according to the pattern of the patterned layer are formed. The intervening layer may be a thermal decomposition layer that may be removed by a heat based removal process. After etching the first layer, the use of a heat based removal process may allow the intervening layer to be removed from the substrate without altering the first layer. In one embodiment, the first layer may be a memorization layer and the process may be a multiple patterning process.
    Type: Application
    Filed: March 1, 2019
    Publication date: January 16, 2020
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Publication number: 20200020523
    Abstract: Embodiments are disclosed that reduce gouging during multi-patterning processes using thermal decomposition materials. For one embodiment, gouging is reduced or suppressed by using thermal decomposition materials as cores during multiple patterning processes. For one embodiment, gouging is reduced or suppressed by using thermal decomposition materials as a gap fill material during multiple patterning processes. By using thermal decomposition material, gouging of an underlying layer, such as a hard mask layer, can be reduced or suppressed for patterned structures being formed using the self-aligned multi-patterning processes because more destructive etch processes, such as plasma etch processes, are not required to remove the thermal decomposition materials.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 16, 2020
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Publication number: 20200013619
    Abstract: Embodiments are disclosed that improve etch uniformity during multi-patterning processes for the manufacture of microelectronic workpieces by reshaping spacers using thermal decomposition materials as a protective layer. Because the thermal decomposition material can be removed through thermal treatment processes without requiring etch processes, spacers can be reshaped with no spacer profile change or damage while suppressing undesired gouging differences in underlying layers and related degradation in etch uniformity.
    Type: Application
    Filed: July 2, 2019
    Publication date: January 9, 2020
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Publication number: 20190393084
    Abstract: A process is provided in which low-k layers are protected from damage caused by exposure to atmospheric conditions by providing protection through the use of thermal decomposition materials. In one embodiment, the low-k layers may be low-k dielectric layers utilized in BEOL process steps. The thermal decomposition materials may be utilized to coat exposed regions of the low-k layers so that the low-k layers are not exposed to atmospheric conditions. In an exemplary embodiment, the low-k layers may be protected by plugging openings in the low-k layer with the thermal decomposition material. In another exemplary embodiment, trench and via openings in the low-k layer are plugged with the thermal decomposition material. The thermal decomposition materials may be removed by a heat based thermal anneal process step that does not damage the low-k layers.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 26, 2019
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Publication number: 20190385903
    Abstract: A process is provided in which low-k layers are protected from damage by the use of thermal decomposition materials. In one embodiment, the low-k layers may be low-k dielectric layers utilized in BEOL process steps. The thermal decomposition materials may be utilized to replace organic layers that typically require ashing processes to remove. By removing the need for certain ashing steps, the exposure of the low-k dielectric layer to ashing processes may be lessened. In another embodiment, the low-k layers may be protected by plugging openings in the low-k layer with the thermal decomposition material before a subsequent process step that may damage the low-k layer is performed. The thermal decomposition materials may be removed by a thermal anneal process step that does not damage the low-k layers.
    Type: Application
    Filed: June 13, 2019
    Publication date: December 19, 2019
    Inventors: Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa, Akiteru Ko
  • Publication number: 20190304836
    Abstract: Self-aligned interconnect patterning for back-end-of-line (BEOL) structures is described. A method of fabricating an interconnect structure for an integrated circuit includes depositing a first metal layer on an initial interconnect structure, forming a patterned spacer layer containing recessed features on the first metal layer, and etching a self-aligned via in the first metal layer and into the initial interconnect structure using a recessed feature in the patterned spacer layer as a mask. The method further includes filling the via in the first metal layer and the recessed features in the patterned spacer layer with a second metal layer, removing the patterned spacer layer, and etching a recessed feature in the first metal layer using the second metal layer as a mask.
    Type: Application
    Filed: April 3, 2019
    Publication date: October 3, 2019
    Inventors: Yuki Kikuchi, Kaoru Maekawa
  • Publication number: 20190273311
    Abstract: An antenna device to be mounted on a vehicle, including a ground plate having a planar shape; and an antenna element which is a resonant type, is provided at a position so as not to overlap with the ground conductor within a plane substantially parallel to the ground conductor, and is configured to transmit or receive a polarized wave parallel to the ground conductor. A rectangular notch is formed in the ground plate to have both a right and left edge portions with a predetermined width being left, and the antenna element is provided at a position overlapping with the notch in a plane substantially parallel to the ground plate.
    Type: Application
    Filed: December 14, 2017
    Publication date: September 5, 2019
    Applicant: YOKOWO CO., LTD.
    Inventors: Takeshi SAMPO, Kenichi YAMADA, Yuki KIKUCHI
  • Publication number: 20190216563
    Abstract: A manipulator is used to operate a surgical device that treats a body tissue. The manipulator includes a drive mechanism having a stationary section to be attached on a housing of a drive unit containing with at least one motor. A movable part is supported rotatably about a predetermined axis on the stationary section and having a connecting portion configured to be connected to the at least one motor when the stationary section is attached on the housing. A cover is configured to seal a gap between the movable part and the stationary section so as to prevent fluid from entering the gap between the movable part and the stationary part. A power transmission member is connected to both the movable part and the surgical device to transmit power from the motor to the surgical device.
    Type: Application
    Filed: March 27, 2019
    Publication date: July 18, 2019
    Applicant: Olympus Corporation
    Inventors: Arimasa Sugimoto, Yuki Kikuchi, Sadahiro Watanabe
  • Publication number: 20180190774
    Abstract: Provided is a self-support diamond substrate made of diamond and a method for producing such a substrate. A foundation substrate is prepared, several pieces of columnar diamond made of diamond single crystal are formed over one surface of the foundation substrate, the diamond single crystal is grown from the tip of each piece of columnar diamond, each piece of diamond single crystal is brought into coalescence to form a diamond substrate layer, the diamond substrate layer is separated from the foundation substrate, and the diamond substrate is produced from the diamond substrate layer. The difference between the highest point and the lowest point in the thickness direction of the diamond substrate is more than 0 ?m and 485 ?m or less and the variation of the angle of the crystal axis over the entire surface of the diamond substrate is more than 0° and 3.00° or less.
    Type: Application
    Filed: January 30, 2018
    Publication date: July 5, 2018
    Inventors: Hideo AIDA, Koji KOYAMA, Kenjiro IKEJIRI, Seongwoo KIM, Yuki KIKUCHI
  • Patent number: 9993822
    Abstract: When taking in outside air with a fan to control the temperature inside a covered portion where a specimen is installed, the internal temperature may change depending on an environment temperature to cause a difference in temperature control. The wind generated by the fan may blow against a reaction container depending on its loading position and it may influence the temperature control over individual specimens and lead to problems with temperature accuracy, temperature rise speed, and temperature drop speed. A reaction container avoiding these problems has a covered portion which performs temperature control on the reaction container and in which a cover and a fin cover have a heat insulating structure. A heat source is provided for controlling an internal temperature of an internal covered space. The internal temperature is kept constant and the influence of the environment temperature over the temperature control of the reaction container is minimized.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: June 12, 2018
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Kimikazu Sugiyama, Minoru Sano, Yasunori Shoji, Yoshiyuki Shoji, Yuki Kikuchi, Manami Nammoku, Ryoji Inaba