Patents by Inventor Yuki Komai
Yuki Komai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11874511Abstract: [Problem] To allow to condense and guide the light emitted by a light emitting element having a large light emission surface to an optical connector, in inspection of a semiconductor integrated circuit. [Solution] The present disclosure provides a connecting apparatus used at the time of inspection of a semiconductor integrated circuit, and the connecting apparatus includes an electric connector electrically connecting to an electrode terminal of the semiconductor integrated circuit, an optical connector optically connecting to an optical terminal of the semiconductor integrated circuit, a connector support substrate configured to support the electric connector and the optical connector so that an end part of the electric connector and an end part of the optical connector respectively connect to the semiconductor integrated circuit, and a light condensing substrate configured to condense light emitted by an optical terminal of the semiconductor integrated circuit to the optical connector.Type: GrantFiled: January 25, 2022Date of Patent: January 16, 2024Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Hiroshi Kamiya, Yuki Komai, Hisao Narita
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Publication number: 20230021569Abstract: A fiber reinforced resin hollow molded body 30 in which a resin-integrated fiber sheet is used. The resin-integrated fiber sheet includes unidirectional continuous fibers that are spread fibers of a continuous fiber group and arrayed unidirectionally in parallel, and thermoplastic resin that is present at least on a surface of the unidirectional continuous fibers. In the hollow molded body, in a state where the resin-integrated fiber sheet or a plurality of the resin-integrated fiber sheets 30 are stacked, the resin-integrated fiber sheet or the plurality of resin-integrated fiber sheets are wound to produce a wound body having an overlapping portion. The thermoplastic resin is impregnated in the unidirectional continuous fibers. The resin-integrated fiber sheet or the plurality of resin-integrated fiber sheets are consolidated.Type: ApplicationFiled: December 8, 2020Publication date: January 26, 2023Inventors: Hayato IIO, Naoya TAKANO, Yoichi HIRAISHI, Tadaharu TANAKA, Yuta NAKAME, Yuki KOMAI
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Publication number: 20220388275Abstract: A resin-integrated fiber sheet 1 for vacuum forming for producing a fiber reinforced resin molded body through vacuum forming includes: unidirectional continuous fibers 2 that are spread fibers of a continuous fiber group and arrayed in parallel in one direction; bridging fibers 3 lying in directions crossing the unidirectional continuous fibers 2; and thermoplastic resin 4 present on part of the surface of the unidirectional continuous fibers 2 to unify the unidirectional continuous fibers 2 and the bridging fibers 3. A fiber reinforced resin molded body of the present invention is a vacuum formed body in which two or more of the resin-integrated fiber sheets 1 are stacked. A method for producing the molded body of the present invention includes subjecting the resin-integrated fiber sheets 1 to vacuum forming from a lower mold with a vacuum line and pressurizing the sheets with compressed air from an upper mold.Type: ApplicationFiled: November 5, 2020Publication date: December 8, 2022Inventors: Tadaharu TANAKA, Takashi NAKAMURA, Yoichi HIRAISHI, Yuta NAKAME, Yuki KOMAI
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Publication number: 20220260792Abstract: [Problem] To allow to condense and guide the light emitted by a light emitting element having a large light emission surface to an optical connector, in inspection of a semiconductor integrated circuit. [Solution] The present disclosure provides a connecting apparatus used at the time of inspection of a semiconductor integrated circuit, and the connecting apparatus includes an electric connector electrically connecting to an electrode terminal of the semiconductor integrated circuit, an optical connector optically connecting to an optical terminal of the semiconductor integrated circuit, a connector support substrate configured to support the electric connector and the optical connector so that an end part of the electric connector and an end part of the optical connector respectively connect to the semiconductor integrated circuit, and a light condensing substrate configured to condense light emitted by an optical terminal of the semiconductor integrated circuit to the optical connector.Type: ApplicationFiled: January 25, 2022Publication date: August 18, 2022Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventors: HIROSHI KAMIYA, YUKI KOMAI, HISAO NARITA
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Publication number: 20220205157Abstract: A resin-integrated carbon fiber sheet 1, including: a carbon fiber sheet 2 in which a carbon fiber filament group is spread and arrayed in parallel in one direction; resin 4 that is present on part of a surface of the carbon fiber sheet; and bridging fibers 3. One or more of the bridging fibers 3 is present on average on a surface of the carbon fiber sheet 2 in a direction across the carbon fiber sheet per 10 mm2 of the sheet 2, and the resin 4 on the surface adhesively fixes the bridging fibers 3 to the carbon fiber sheet 2. Thus, the present invention provides a resin-integrated carbon fiber sheet that is strong in the width direction of the carbon fiber sheet, high in cleavage resistance and excellent in handleability, and a production method of the same.Type: ApplicationFiled: December 6, 2019Publication date: June 30, 2022Inventors: Tadaharu TANAKA, Wataru HORIMOTO, Yoichi HIRAISHI, Takashi NAKAMURA, Yuta NAKAME, Yuki KOMAI
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Publication number: 20220168931Abstract: A fiber-reinforced resin composite having high peeling strength between a fiber-reinforced resin and a resin foam. The fiber-reinforced resin composite (10) is a fiber-reinforced resin composite (10) including a skin (11) and a resin foam (12), the resin foam including a foamed resin (16), the skin including a fiber sheet (14), a thermoplastic matrix resin (15), and the foamed resin (16) that is continuous from the resin foam and is impregnated into the skin.Type: ApplicationFiled: March 11, 2020Publication date: June 2, 2022Applicant: KURASHIKI BOSEKI KABUSHIKI KAISHAInventors: Tadaharu TANAKA, Yoichi HIRAISHI, Takashi NAKAMURA, Yuta NAKAME, Yuki KOMAI
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Patent number: 8199265Abstract: The present invention provides an optical waveform shaping device (10) of high resolution comprising a branching filter (1) for branching the light beam from a light source into light beams of each frequency, a condensing part (2) for condensing a plurality of light beams branched by the branching filter (1), a polarizing plate (3) for adjusting the polarization planes of the light beams having passed through the condensing part (2), and a spatial light modulator (4) having a phase modulation part and an intensity modulation part where the light beams having passed through the polarizing plate (3) are incident.Type: GrantFiled: June 13, 2008Date of Patent: June 12, 2012Assignee: National Institute of Information and Communications TechnologyInventors: Naoya Wada, Seitetsu Boku, Takuya Yoda, Yuki Komai, Fumi Moritsuka, Kashiko Kodate
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Publication number: 20100157179Abstract: It is an object of the present invention to provide an optical waveform shaping device of high resolution. The above-mentioned problem is solved by an optical waveform shaping device (10) comprising a branching filter (1) for branching the light beam from a light source into light beams of each frequency, a condensing part (2) for condensing a plurality of light beams branched by the branching filter (1), a polarizing plate (3) for adjusting the polarization planes of the light beams having passed through the condensing part (2), and a spatial light modulator (4) having a phase modulation part and an intensity modulation part where the light beams having passed through the polarizing plate (3) are incident.Type: ApplicationFiled: June 13, 2008Publication date: June 24, 2010Applicant: National Institute Of Information And Communications TechnologyInventors: Naoya Wada, Seitetsu Boku, Takuya Yoda, Yuki Komai, Fumi Moritsuka, Kashiko Kodate
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Publication number: 20070164502Abstract: An image forming apparatus includes an apparatus main body that carries out an image forming processing with respect to a sheet. A sheet supplying unit is mounted detachably into the apparatus main body and adapted to supply a sheet from a stack of sheets stored therein toward an inside of the apparatus main body. The sheet supplying unit includes a position keeper for keeping the sheet stack in a determined position by contacting sides of the stack. The keeping position is changeable in accordance with the size of a sheet. A lock mechanism locks the position keeper in a keeping position. The locking mechanism releases the locking of the position keeper when the sheet supplying unit is detached from the apparatus main body and placed on a surface. However, the locking mechanism locks the position keeper when the sheet supplying unit is lifted from the surface.Type: ApplicationFiled: January 17, 2007Publication date: July 19, 2007Applicant: Kyocera Mita CorporationInventor: Yuki Komai
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Patent number: D524849Type: GrantFiled: April 26, 2005Date of Patent: July 11, 2006Assignee: Kyocera Mita CorporationInventor: Yuki Komai