Patents by Inventor Yuki Masuda

Yuki Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220229839
    Abstract: A storage unit (14) stores event data (14a) for displaying a figure that represents an operation along a time axis, the event data including a start time point and an end time point of the operation. A search condition acquiring unit (15c) acquires a search condition (14b) that specifies an appearance pattern of the figure that is displayed. A search unit (15d) searches for data pieces of the event data (14a) that match the acquired search condition (14b).
    Type: Application
    Filed: June 10, 2019
    Publication date: July 21, 2022
    Inventors: Fumihiro YOKOSE, Kimio Tsuchikawa, Sayaka Yagi, Yuki Urabe, Takeshi Masuda
  • Patent number: 11392260
    Abstract: A display control device includes a conversion unit which, upon receipt of an operation log file including operation logs that indicate the content of operations performed on windows on a terminal screen, determines data variables representing window states of the windows indicated by each of the operation logs on the basis of a window state setting for setting a window state on the terminal screen, a display control unit that sets correspondence relationships between the data variables and visual variables, generates rectangular objects corresponding to the data variables, and determines attribute values of the rectangular objects on the basis of the visual variables associated with the data variables, and a visualization unit that performs drawing on the basis of sets of the rectangular objects and the attribute values determined by the display control unit.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: July 19, 2022
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Sayaka Yagi, Kimio Tsuchikawa, Takeshi Masuda, Yuki Urabe
  • Patent number: 11347146
    Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: May 31, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Keika Hashimoto, Ryoji Okuda
  • Patent number: 11333976
    Abstract: A resin having a small linear thermal expansion coefficient and a low absorbance is provided.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: May 17, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Tomoyuki Yuba, Yuki Masuda, Jiake Jin, Ping Li
  • Patent number: 11304937
    Abstract: The present invention provides a particle comprising pirfenidone and a lipid, particularly magnesium stearate, and having a mean particle diameter of 5 ?m or less, and a powder formulation comprising the particle and a carrier.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: April 19, 2022
    Assignee: SHIONOGI & CO., LTD.
    Inventors: Takeshi Funaki, Yukiko Nishino, Yuki Masuda, Koichi Tsubone
  • Patent number: 11279802
    Abstract: The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group h
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: March 22, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yutaro Koyama, Yuki Masuda, Masao Tomikawa
  • Patent number: 11174350
    Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: November 16, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Yu Shoji, Kimio Isobe, Ryoji Okuda
  • Patent number: 10990008
    Abstract: The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: April 27, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Ryoji Okuda
  • Publication number: 20210116810
    Abstract: Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 ?m or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).
    Type: Application
    Filed: July 25, 2019
    Publication date: April 22, 2021
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Keika HASHIMOTO, Yuki MASUDA, Yuki TAKEYAMA
  • Publication number: 20210047470
    Abstract: The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group h
    Type: Application
    Filed: March 15, 2019
    Publication date: February 18, 2021
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yutaro KOYAMA, Yuki MASUDA, Masao TOMIKAWA
  • Patent number: 10908500
    Abstract: Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 2, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yu Shoji, Yuki Masuda, Kimio Isobe, Ryoji Okuda
  • Publication number: 20200306928
    Abstract: An assistance apparatus includes a status information acquiring section that acquires a grinding condition as a status information, the grinding condition including set states associated with a plurality of movement command data, an evaluation result acquiring section that acquires evaluation results of a plurality of evaluation objects that are obtained under the grinding condition, a reward calculating section that calculates a reward for the status information based on the evaluation results, a policy storing section that stores a policy which is obtained from a value function, an action determining section that determines the movement command data to be adjusted and an adjustment amount at which said movement command data is adjusted, from among candidates of the plurality of movement command data that are adjustable, based on the status information and the policy, and an action information outputting section that is configured to output determined contents including an action information.
    Type: Application
    Filed: March 23, 2020
    Publication date: October 1, 2020
    Applicant: JTEKT CORPORATION
    Inventors: Yuki MASUDA, Toru KAWAHARA, Shinji MURAKAMI
  • Patent number: 10705425
    Abstract: A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R1-R4 may be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), R5 represents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of R5s in the same molecule may be the same or different.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: July 7, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Hiroyuki Onishi, Yuki Masuda
  • Publication number: 20200133246
    Abstract: A learning model generation device for supporting a machine tool, includes: a first non-control element acquisition unit configured to acquire a first non-control element, the first non-control element including at least one of specifications of a workpiece and specifications of a tool and being not a machining control element for a machine tool; a machining control element acquisition unit configured to acquire the machining control element for the machine tool; and an actual quality element acquisition unit configured to acquire an actual quality element of the workpiece after machining. The leaning model generation device further includes a learning model generation unit configured to generate, by machine learning in which the first non-control element, the machining control element and the actual quality element are set as learning data, a learning model for outputting the machining control element based on the first non-control element and the actual quality element.
    Type: Application
    Filed: October 31, 2019
    Publication date: April 30, 2020
    Applicant: JTEKT Corporation
    Inventors: Toru KAWAHARA, Yuki MASUDA, Shinji MURAKAMI
  • Patent number: 10584205
    Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: March 10, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yu Shoji, Yuki Masuda, Yutaro Koyama, Ryoji Okuda
  • Publication number: 20200030939
    Abstract: An estimation model creating device for grinding wheel surface condition estimation includes a measurement data obtaining unit and a first learning model creating unit. The measurement data obtaining unit obtains measurement data measured during grinding of workpieces with a grinding wheel in a grinding machine. The measurement data obtaining unit obtains the measurement data for a predetermined period of time for each workpiece. The measurement data includes at least one of first measurement data indicating the condition of a structural member of the grinding machine, and second measurement data relating to a ground portion of the workpiece. The first learning model creating unit performs machine learning using the measurement data relating to the workpieces as first-learning input data so as to create a first learning model for estimating a surface condition of the grinding wheel.
    Type: Application
    Filed: July 24, 2019
    Publication date: January 30, 2020
    Applicant: JTEKT Corporation
    Inventors: Yuki MASUDA, Toru KAWAHARA, Shinji MURAKAMI
  • Publication number: 20200033842
    Abstract: A grinding quality estimation model generating device includes a measured data acquiring unit configured to acquire measured data in a predetermined period for each of a plurality of workpieces, the measured data being data measured when grinding of the workpiece is performed using a grinding wheel in a grinding machine, and the measured data being at least one of first measured data indicating a state of a structural member of the grinding machine and second measured data associated with a grinding region; and a first learning model generating unit configured to generate a first learning model for estimating grinding quality of the workpiece by machine learning using the measured data associated with the plurality of workpieces as first learning input data.
    Type: Application
    Filed: July 22, 2019
    Publication date: January 30, 2020
    Applicant: JTEKT Corporation
    Inventors: Yuki MASUDA, Toru KAWAHARA, Shinji MURAKAMI
  • Patent number: 10545406
    Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: January 28, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yu Shoji, Yuki Masuda, Kimio Isobe, Ryoji Okuda
  • Publication number: 20190256655
    Abstract: The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200° C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like.
    Type: Application
    Filed: August 28, 2017
    Publication date: August 22, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki MASUDA, Ryoji OKUDA
  • Publication number: 20190250511
    Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
    Type: Application
    Filed: August 30, 2017
    Publication date: August 15, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki MASUDA, Keika HASHIMOTO, Ryoji OKUDA