Patents by Inventor Yuki Noda

Yuki Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11066092
    Abstract: A steering wheel includes a decorative component and a surface skin on a surface of the rim. The decorative component is formed into a band and a leading-end portion of the decorative component has a tapered form in which an inner edge curves towards an outer circumference of the rim and serves as a curving edge. The surface skin includes a curved-side section adjoining the curving edge and a non-curved-side section adjoining a non-curving edge of the leading-end portion. The curved-side section includes a main body that includes a curving portion which corresponds to the curving edge of the leading-end portion in shape, and an extended portion that extends beyond an apex of the leading-end portion and extends towards the non-curving edge of the leading-end portion of the decorative component. A region of the extended portion beyond the apex is joined to a leading edge of the non-curved-side section.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: July 20, 2021
    Assignees: TOYODA GOSEI CO., LTD., HONDA MOTOR CO., LTD.
    Inventors: Yuki Nonoyama, Jun Sato, Sanae Oritaka, Makoto Noda, Yosuke Iwasaki
  • Patent number: 10772770
    Abstract: A top sheet includes a skin contact surface configured to contact the skin of a wearer. The skin contact surface includes at least one projection and at least one recess. The top sheet further includes a back surface opposite the skin contact surface. The top sheet further includes a coating on the at least one projection. The coating essentially includes a blood slipping agent having a kinematic viscosity of 0.01 to 80 mm2/s at 40° C., a water holding percentage of 0.01 to 4.0 mass %, and a weight-average molecular weight of less than 1,000, and the coating is configured to slip from the skin contact surface, through the top sheet, to the back surface along with menstrual blood.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: September 15, 2020
    Assignee: UNICHARM CORPORATION
    Inventors: Masashi Nakashita, Ichiro Wada, Yuki Noda, Akira Hashino
  • Patent number: 10741505
    Abstract: A method of manufacturing a semiconductor device includes stacking a first substrate comprising a first surface having a semiconductor element and an opposing second surface and a second substrate comprising a third surface having a semiconductor element and an opposing fourth surface, forming a first contact hole extending from the second surface to the first surface of the first substrate and forming a first groove inwardly of a first region of the second surface of the first substrate by etching inwardly of the first substrate from the second surface thereof, forming a first patterned mask on the first substrate, so that the first groove is covered by the material of the first patterned mask, forming a first metal electrode in the first contact hole through an opening in the first mask as a mask, and removing the first mask and subsequently cutting through the first substrate in the first groove.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: August 11, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Masaya Shima, Eiji Takano, Ippei Kume, Yuki Noda
  • Publication number: 20200094271
    Abstract: An electrostatic atomizing apparatus includes a main body portion, a container, a first air flow path, a second air flow path, an electrostatic atomization unit, and an air flow generation unit. The container is detachable from the main body portion, is capable of storing a liquid, and includes a first ventilation hole and a second ventilation hole. The first air flow path includes a first end that includes an air suction port, and a second end that connects to the first ventilation hole. The second air flow path includes a third end that connects to the second ventilation hole, and a fourth end that includes an air exhaust port. The electrostatic atomization unit is disposed on the second air flow path. The air flow generation unit generates an air flow that causes air to flow through the first air flow path, through the container, and through the second air flow path.
    Type: Application
    Filed: March 8, 2019
    Publication date: March 26, 2020
    Inventors: Kenichi KAJIYAMA, Takahiro YAMAGUCHI, Masaru MATSUOKA, Yuki NODA
  • Publication number: 20200094279
    Abstract: An electrostatic atomizing system includes an air flow path having an air intake port and an air exhaust port, a humidifying device, an electrostatic atomizing apparatus, a first sensor, and a control unit. The humidifying device humidifies the air taken in through the air intake port. The electrostatic atomizing apparatus includes an electrode section operable to produce charged particulate water by causing the water in the air humidified by the humidifying device to condense on an electrode and applying voltage to that electrode. Moreover, the electrostatic atomizing apparatus exhausts air that contains the charged particulate water through the air exhaust port. The first sensor senses at least one of humidity and temperature of the air humidified by the humidifying device. The control unit determines, based on a sensing result of the first sensor, if there is a fault in the humidifying device or the electrostatic atomizing apparatus, and outputs the result of the determination.
    Type: Application
    Filed: March 27, 2019
    Publication date: March 26, 2020
    Inventors: Masaru MATSUOKA, Takahiro YAMAGUCHI, Kenichi KAJIYAMA, Yuki NODA
  • Patent number: 10543132
    Abstract: An absorbent article includes a liquid-permeable top sheet, a liquid-impermeable back sheet, and an absorbent body between the liquid-permeable top sheet and liquid-impermeable back sheet. The liquid-permeable top sheet includes a blood modifying agent with an IOB of 0.00-0.60, a melting point of no higher than 45° C., a water solubility of 0.00-0.05 g in 100 g of water at 25° C., and a weight-average molecular weight of no greater than 1,000.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: January 28, 2020
    Assignee: UNICHARM CORPORATION
    Inventors: Shimpei Komatsu, Yuki Noda, Mitsuhiro Wada, Akira Hashino, Hideyuki Kinoshita, Masashi Nakashita, Ichiro Wada
  • Patent number: 10468334
    Abstract: A semiconductor device according to an embodiment includes a semiconductor substrate including a first face having semiconductor elements, and a second face on an opposite side to the first face. A first insulating film is located on the first face of the semiconductor substrate. A conductor is located on the first insulating film. A metal electrode is located between the first face and the second face and passes through the semiconductor substrate to be in contact with the conductor. A second insulating film is located between the metal electrode and the semiconductor substrate. A boundary face between the first insulating film and the second insulating film is located on a side of the conductor relative to the first face of the semiconductor substrate and is inclined to approach the conductor toward a center portion of the metal electrode.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: November 5, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Ippei Kume, Kazuhiko Nakamura, Yuki Noda
  • Patent number: 10413456
    Abstract: An object of the present disclosure is to provide an absorbent body that is both soft and resistant to twisting. The absorbent body of the present disclosure is as follows. An absorbent body for an absorbent article includes thermoplastic resin fibers and cellulose-based water-absorbing fibers, at least some of the thermoplastic resin fibers have a first section 6? exposed on a surface of the liquid-permeable layer side of the absorbent body, a second section 6? exposed on a surface of the liquid-impermeable layer side of the absorbent body and a joint section 6?? connecting the first section 6? and second section 6?, and the tensile strength in a thickness direction of the absorbent body is 100 Pa or greater.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: September 17, 2019
    Assignee: UNICHARM CORPORATION
    Inventors: Yuki Noda, Masashi Uda, Takashi Maruyama
  • Patent number: 10322037
    Abstract: Provided is an absorbent article having a top sheet with an opening-formed area in which openings are formed, and non-opening-formed areas in which no openings are formed, said absorbent article being capable of preventing liquid from remaining on the surface of the opening-formed area of the top sheet. In the present invention, the top sheet is a resin sheet having an opening-formed area (12) in which openings are formed, and non-opening-formed areas (5, 14) in which no openings are formed. The opening-formed area (12) is disposed in an outlet-facing area (16) that faces at least an outlet for fluid from a wearer. The top sheet (2) has a blood modifier layer on the surface of at least the outlet-facing area (16). The blood modifier of the blood modifier layer has an inorganic/organic balance (IOB) of 0 to 0.60, a melting point of not more than 45° C., and an aqueous solubility of 0.05 g or less with respect to 100 g of water at 25° C.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: June 18, 2019
    Assignee: UNICHARM CORPORATION
    Inventors: Yuki Noda, Tatsuya Tamura, Takashi Nomoto, Takashi Onozuka
  • Patent number: 10297531
    Abstract: A method of producing a semiconductor device includes forming, on a semiconductor substrate comprising a first surface on which an insulating layer covering a wiring structure and a first through via passing through the insulating layer are formed and a second surface opposed to, and facing away from, the first surface, a patterned first insulating film comprising at least one opening therethrough on the second surface, forming a through via hole inwardly of the second surface within which the wiring structure is exposed, by anisotropic dry etching into the second surface side of the semiconductor substrate through the at least one opening in the first insulating film, using a gas mixture containing SF6, O2, SiF4, and at least one of CF4, Cl2, BCl3, CF3I, and HBr, and forming a second through via in the through via hole.
    Type: Grant
    Filed: September 4, 2017
    Date of Patent: May 21, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Yuki Noda, Ippei Kume, Kazuhiko Nakamura, Koichi Sato
  • Publication number: 20190139908
    Abstract: A method of manufacturing a semiconductor device includes stacking a first substrate comprising a first surface having a semiconductor element and an opposing second surface and a second substrate comprising a third surface having a semiconductor element and an opposing fourth surface, forming a first contact hole extending from the second surface to the first surface of the first substrate and forming a first groove inwardly of a first region of the second surface of the first substrate by etching inwardly of the first substrate from the second surface thereof, forming a first patterned mask on the first substrate, so that the first groove is covered by the material of the first patterned mask, forming a first metal electrode in the first contact hole through an opening in the first mask as a mask, and removing the first mask and subsequently cutting through the first substrate in the first groove.
    Type: Application
    Filed: January 7, 2019
    Publication date: May 9, 2019
    Inventors: Masaya SHIMA, Eiji TAKANO, Ippei KUME, Yuki NODA
  • Patent number: 10278873
    Abstract: An objective of the present invention is to provide an absorbent article with which, both when dry, prior to absorbing blood, and when wet, after absorbing blood, is provided with a fit in a wearer's excretory orifice, especially the labia minora, and which is not prone to leaking. Provided is an absorbent article, including a liquid-permeable top sheet, a non liquid-permeable back sheet, and an absorbent body between the liquid-permeable top sheet and the non liquid-permeable back sheet. The absorbent article further comprises a center high part which protrudes in the thickness direction of the absorbent article in an excretory orifice contact region. The center high part further includes a portion of the top sheet, and a cushion part which is positioned between the top sheet and the absorbent body. The center high part further includes a central part, and an outer circumference part which surrounds the central part.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: May 7, 2019
    Assignee: UNICHARM CORPORATION
    Inventors: Yuki Noda, Tatsuya Tamura, Akira Hashino
  • Patent number: 10278875
    Abstract: An absorbent article includes a liquid-permeable top sheet, a liquid-impermeable back sheet, and an absorbent body between the top and back sheets. The top sheet has first and second areas, each of which includes a blood lubricity-imparting agent that has a kinematic viscosity of 0.01-80 mm2/s at 40° C., a water hold percentage of 0.01-4.0 mass %, and a weight average molecular weight of less than 1,000. The first area overlaps at least partially with an excretory orifice contact area of the top sheet that is configured to contact with the excretory orifice of the wearer. The second area is arranged more to a rear side in a lengthwise direction of the absorbent article than is the first area. A basis weight of the blood lubricity-imparting agent in the first area is higher than that of the blood lubricity-imparting agent in the second area.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: May 7, 2019
    Assignee: UNICHARM CORPORATION
    Inventors: Yuki Noda, Tatsuya Tamura, Akira Hashino
  • Patent number: 10211165
    Abstract: A method of manufacturing a semiconductor device includes stacking a first substrate comprising a first surface having a semiconductor element and an opposing second surface and a second substrate comprising a third surface having a semiconductor element and an opposing fourth surface, forming a first contact hole extending from the second surface to the first surface of the first substrate and forming a first groove inwardly of a first region of the second surface of the first substrate by etching inwardly of the first substrate from the second surface thereof, forming a first patterned mask on the first substrate, so that the first groove is covered by the material of the first patterned mask, forming a first metal electrode in the first contact hole through an opening in the first mask as a mask, and removing the first mask and subsequently cutting through the first substrate in the first groove.
    Type: Grant
    Filed: September 4, 2017
    Date of Patent: February 19, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Masaya Shima, Eiji Takano, Ippei Kume, Yuki Noda
  • Patent number: 10111788
    Abstract: A package comprises: wrapped absorbent articles comprising: an absorbent article having an absorber; and a wrapper for individually wrapping the absorbent article, the absorbent article being placed on the wrapper and folded together with the wrapper, and the absorbent article being wrapped individually by the wrapper; and a bag containing the plurality of wrapped absorbent articles, wherein the wrapped absorbent articles are provided with a perfume, at least one surface of the bag comprises: aperture through which the perfume of the wrapped absorbent articles contained in the bag can pass; and a perfume indicator for indicating an existence of the perfume, a compressibility of the package is 10% or more when a load of 1.35 kg in weight is applied in an area of 100 mm×200 mm of the package for ten seconds, and a compression resilience of the package is 95% or more after ten seconds has passed after removal of the load.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: October 30, 2018
    Assignee: UNICHARM CORPORATION
    Inventors: Kiyoko Nishimura, Yuki Noda, Toshihisa Hayashi, Taro Nittono
  • Patent number: 10092463
    Abstract: The purpose of the present invention is to provide a nonwoven for a top sheet of an absorbent article that is unlikely to stick after having absorbed menstrual blood, that is smooth and dry, and in which the absorbed menstrual blood is unlikely to diffuse on the nonwoven. This nonwoven has the following configuration. A nonwoven for a top sheet of an absorbent article, having a lengthwise direction and a crosswise direction, wherein the nonwoven has a plurality of ridge parts and a plurality of groove parts extending in the lengthwise direction and disposed in alternating fashion in the crosswise direction, the nonwoven being characterized in that the ridge parts and the groove parts have a plurality of through-holes, and the ridge parts have a region containing a blood lubricity-imparting agent that contains a predetermined blood lubricity-imparting agent.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: October 9, 2018
    Assignee: UNICHARM CORPORATION
    Inventors: Takashi Nomoto, Yuichi Suzuki, Takashi Onozuka, Akira Hashino, Yuki Noda
  • Publication number: 20180286782
    Abstract: A method of producing a semiconductor device includes forming, on a semiconductor substrate comprising a first surface on which an insulating layer covering a wiring structure and a first through via passing through the insulating layer are formed and a second surface opposed to, and facing away from, the first surface, a patterned first insulating film comprising at least one opening therethrough on the second surface, forming a through via hole inwardly of the second surface within which the wiring structure is exposed, by anisotropic dry etching into the second surface side of the semiconductor substrate through the at least one opening in the first insulating film, using a gas mixture containing SF6, O2, SiF4, and at least one of CF4, Cl2, BCl3, CF3I, and HBr, and forming a second through via in the through via hole.
    Type: Application
    Filed: September 4, 2017
    Publication date: October 4, 2018
    Inventors: Yuki NODA, Ippei KUME, Kazuhiko NAKAMURA, Koichi SATO
  • Publication number: 20180277493
    Abstract: A method of manufacturing a semiconductor device includes stacking a first substrate comprising a first surface having a semiconductor element and an opposing second surface and a second substrate comprising a third surface having a semiconductor element and an opposing fourth surface, forming a first contact hole extending from the second surface to the first surface of the first substrate and forming a first groove inwardly of a first region of the second surface of the first substrate by etching inwardly of the first substrate from the second surface thereof, forming a first patterned mask on the first substrate, so that the first groove is covered by the material of the first patterned mask, forming a first metal electrode in the first contact hole through an opening in the first mask as a mask, and removing the first mask and subsequently cutting through the first substrate in the first groove.
    Type: Application
    Filed: September 4, 2017
    Publication date: September 27, 2018
    Inventors: Masaya SHIMA, Eiji TAKANO, Ippei KUME, Yuki NODA
  • Publication number: 20180269133
    Abstract: A semiconductor device according to an embodiment includes a semiconductor substrate including a first face having semiconductor elements, and a second face on an opposite side to the first face. A first insulating film is located on the first face of the semiconductor substrate. A conductor is located on the first insulating film. A metal electrode is located between the first face and the second face and passes through the semiconductor substrate to be in contact with the conductor. A second insulating film is located between the metal electrode and the semiconductor substrate. A boundary face between the first insulating film and the second insulating film is located on a side of the conductor relative to the first face of the semiconductor substrate and is inclined to approach the conductor toward a center portion of the metal electrode.
    Type: Application
    Filed: September 12, 2017
    Publication date: September 20, 2018
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Ippei KUME, Kazuhiko Nakamura, Yuki Noda
  • Patent number: 10063967
    Abstract: A sound collecting device includes a sound source position input interface that receives input of sound source position information indicating a sound source position, an audio interface that receives input of sound signals collected by two or more sound collecting units placed at predetermined positions in advance, a recording medium in which sound collecting unit placement information indicating placement information of the sound collecting units is stored, and a controller that selects one of the sound signals output from the sound collecting units, based on the sound source position information and the sound collecting unit placement information.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: August 28, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yuki Noda, Kou Watanabe, Takeshi Hatakeyama