Abstract: A method of processing a wafer includes a composite substrate forming step of joining a face side of a wafer and a surface of a support substrate to each other with a joint member interposed therebetween, a grinding step of grinding a reverse side of the wafer of the composite substrate to thin down the wafer to a finished thickness, a transfer member affixing step of affixing a transfer member to the reverse side of the wafer, a joint member breaking step of breaking the joint member by applying a laser beam having a wavelength transmittable through the support substrate and absorbable by the joint member to the composite substrate from another surface side of the support substrate, and a transferring step of peeling off the support substrate from the wafer and transferring the wafer to the transfer member.

Abstract: A lift-off method includes joining a transfer substrate to a face side of an optical device layer of an optical device wafer with a joining member interposed therebetween, thereby making up a composite substrate, applying a pulsed laser beam having a wavelength transmittable through the epitaxy substrate and absorbable by a buffer layer, from a reverse side of the epitaxy substrate of the optical device wafer, thereby breaking the buffer layer, and an optical device layer transferring step of peeling off the epitaxy substrate from the optical device layer and transferring the optical device layer to the transfer substrate. The optical device layer transferring step includes the step of applying a bending moment to an area of the composite substrate that includes an outer peripheral portion thereof while holding an area of the composite substrate that includes a central portion thereof.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a first phosphor sheet containing a first phosphor and a third phosphor, and covering a top face of the first light emitting element, and a second phosphor sheet containing a second phosphor and a fourth phosphor, and covering a top face of the second light emitting element, wherein a peak wavelength of light which is wavelength-converted by the first phosphor or the third phosphor is equal to or less than a peak wavelength of light which is wavelength-converted by the second phosphor or the fourth phosphor.

Abstract: An evaluation device includes a holder that holds the radio communication module, a measurement antenna that transmits and receives radio waves for measurement, and a temperature regulator that adjusts a temperature of the radio communication module. The temperature regulator is in direct or in indirect contact with the radio communication module so as to be capable of transferring heat.

Abstract: An evaluation device includes a radio communication module that contains a temperature regulator that adjusts a temperature of a radio communication module to be evaluated, a housing case that houses the radio communication module and the temperature regulator, a gas supplier that supplies dry gas inside the housing case, and a measurement antenna that is disposed so as to face the radio communication module, and that transmits and receives radio waves for measurement. The housing case includes a case main body and a shutter plate that closes an opening of the case main body. The shutter plate is formed of a dielectric foam material, and the shutter plate is capable of contacting and separating from an open edge of the case main body. At least a part of the shutter plate separates from the open edge of the case main body to release gas from inside the housing case when an inner pressure of the housing case is greater than or equal to a predetermined value.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a first phosphor sheet containing a first phosphor and a third phosphor, and covering a top face of the first light emitting element, and a second phosphor sheet containing a second phosphor and a fourth phosphor, and covering a top face of the second light emitting element, wherein a peak wavelength of light which is wavelength-converted by the first phosphor or the third phosphor is equal to or less than a peak wavelength of light which is wavelength-converted by the second phosphor or the fourth phosphor.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a first phosphor sheet containing a first phosphor and a third phosphor, and covering a top face of the first light emitting element, and a second phosphor sheet containing a second phosphor and a fourth phosphor, and covering a top face of the second light emitting element, wherein a peak wavelength of light which is wavelength-converted by the first phosphor or the third phosphor is equal to or less than a peak wavelength of light which is wavelength-converted by the second phosphor or the fourth phosphor.

Abstract: A pneumatic tire includes a carcass layer, a pair of cross belts disposed on an outer side in a radial direction of the carcass layer, and a tread rubber disposed on the outer side in the radial direction of the cross belts. A tread profile when the tire is mounted on a specified rim, inflated to a specified internal pressure, and in an unloaded state is defined by the following elliptic function ([Mathematical Formula 1]) having a center point on a tire equatorial plane. Here, “a” is the radius in a tire width direction and the major axis, “b” is the radius in the tire radial direction and the minor axis, and conditions of 0<b<a, 0<x, 0<y, 1.00<p, 1.00<q and p?q are satisfied.

Abstract: A mobile device including: at least an imaging element; and a light-emitting device that irradiates a subject in accordance with imaging of the imaging element, in which the light-emitting device includes a semiconductor light-emitting element, and the difference of the normalized spectral power distribution at a wavelength of 580 nm and a value B representing a difference between normalized spectral power distributions in a wavelength range from 540 nm to 610 nm and a wavelength range from 610 nm to 680 nm are appropriate values. By providing a wavelength control element, it is possible to improve the color reproducibility and the like of a captured image. The mobile device achieves both sensitivity improvement and color reproducibility in a trade-off relationship.

Abstract: A tip end of a substrate and a wall surface of a second support resin layer are separated from each other so that a terminal portion includes an exposed portion exposed from the second support resin layer and a conductive adhesive layer. A convex portion and a sealing resin are provided. The convex portion is disposed on an upper surface of the second support resin layer to contact the tip end of the substrate and to define a groove together with an upper surface of a first support resin layer and the wall surface of the second support resin layer. A sealing resin fills between the convex portion and the second support resin layer and covers the exposed portion of the terminal portion.

Abstract: A wiring body assembly includes: a first wiring body including a first insulating portion, a first lead wiring and a first terminal portion, the first lead wiring and the first terminal portion are disposed on a surface of the first insulating portion; a second wiring body including a second insulating portion, a second lead wiring and a second terminal portion, the second lead wiring and the second terminal portion are disposed on a surface of the second insulating portion that is oriented opposite to the surface of the first insulating portion; and a conductive adhering portion connecting the first terminal portion and the second terminal portion. The first wiring body and the second wiring body overlap each other so that the first terminal portion and the second terminal portion face each other through the conductive adhering portion.

Abstract: A wiring body includes: a first insulator; a conductor disposed on a first surface of the first insulator and that includes a terminal; and a second insulator disposed on the first surface to cover the conductor. The second insulator includes: an opening from which the terminal is exposed; and an end face that delimits the opening and that includes a first face, a second face that is farther away from the first insulator than the first face, and an edge that connects the first face and the second face.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a first phosphor sheet containing a first phosphor and a third phosphor, and covering a top face of the first light emitting element, and a second phosphor sheet containing a second phosphor and a fourth phosphor, and covering a top face of the second light emitting element, wherein a peak wavelength of light which is wavelength-converted by the first phosphor or the third phosphor is equal to or less than a peak wavelength of light which is wavelength-converted by the second phosphor or the fourth phosphor.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a first phosphor sheet containing a first phosphor and a third phosphor, and covering a top face of the first light emitting element, and a second phosphor sheet containing a second phosphor and a fourth phosphor, and covering a top face of the second light emitting element, wherein a peak wavelength of light which is wavelength-converted by the first phosphor or the third phosphor is equal to or less than a peak wavelength of light which is wavelength-converted by the second phosphor or the fourth phosphor.

Abstract: A mobile device including: at least an imaging element; and a light-emitting device that irradiates a subject in accordance with imaging of the imaging element, in which the light-emitting device includes a semiconductor light-emitting element, and the difference of the normalized spectral power distribution at a wavelength of 580 nm and a value B representing a difference between normalized spectral power distributions in a wavelength range from 540 nm to 610 nm and a wavelength range from 610 nm to 680 nm are appropriate values. By providing a wavelength control element, it is possible to improve the color reproducibility and the like of a captured image. The mobile device achieves both sensitivity improvement and color reproducibility in a trade-off relationship.

Abstract: A semiconductor pressure sensor of the invention, includes: a base body (1) including: a lead frame (4) having a first surface and a second surface; and a support (5) that supports the lead frame (4) and is made of a resin; a pressure sensor chip (2) provided on the first surface of the lead frame (4); and a controller (3) that is provided on the second surface of the lead frame (4), is implanted in the support (5), is formed in the shape having a plurality of surfaces, includes a stress relief layer (32, 33, 34, 35, 36) that is formed on at least one of the plurality of surfaces and has a Young's modulus lower than that of the support (5), and receives a sensor signal output from the pressure sensor chip (2) aid thereby outputs a pressure detection, the pressure sensor chip (2) at least partially overlapping the controller (3) in plan view.

Abstract: A wiring body assembly includes a first wiring body that includes a first resin layer serving as a support layer and a first conductor layer provided on the first resin layer that includes a first terminal, a second wiring body that includes a third terminal, and a connection body that includes a resin material and conductive particle dispersed in the resin material. The connection body is interposed between the first and third terminals such that the first wiring body and the second wiring body are electrically connected. The first terminal includes terminal conductor wires arranged in the shape of a mesh and the connection body is in a gap between the terminal conductor wires.

Abstract: A light emitting device includes a light emitting element including electrodes on its under face, a phosphor cover attached to the light emitting element so as to cover a top face and a side face of the light emitting element, and a reflection frame including a side face holding periphery of the phosphor cover and a tilted face tilting from the side face to the outside and upward.

Abstract: A wiring body assembly includes a first wiring body that includes a first resin layer serving as a support layer and a first conductor layer provided on the first resin layer that includes a first terminal, a second wiring body that includes a third terminal, and a connection body that includes a resin material and conductive particle dispersed in the resin material. The connection body is interposed between the first and third terminals such that the first wiring body and the second wiring body are electrically connected. The first terminal includes terminal conductor wires arranged in the shape of a mesh and the connection body is in a gap between the terminal conductor wires.

Abstract: A semiconductor pressure sensor of the invention, includes: a base body (1) including: a lead frame (4) having a first surface and a second surface; and a support (5) that supports the lead frame (4) and is made of a resin; a pressure sensor chip (2) provided on the first surface of the lead frame (4); and a controller (3) that is provided on the second surface of the lead frame (4), is implanted in the support (5), is formed in the shape having a plurality of surfaces, includes a stress relief layer (32, 33, 34, 35, 36) that is formed on at least one of the plurality of surfaces and has a Young's modulus lower than that of the support (5), and receives a sensor signal output from the pressure sensor chip (2) aid thereby outputs a pressure detection, the pressure sensor chip (2) at least partially overlapping the controller (3) in plan view.