Abstract: A transmission includes a first shaft unit connected to a drive shaft of a drive unit. The first shaft unit includes a first shaft having a first shaft raceway surface on an outer peripheral surface thereof, a first output gear provided on the first shaft, a first outer ring attached to a first support part, the first outer ring having a first outer ring raceway surface on an inner peripheral surface thereof, and a plurality of first rolling elements disposed between the first shaft raceway surface and the first outer ring raceway surface.

Abstract: A communication device includes: a transmission unit configured to transmit a connection request to a first communication device; a reception unit configured to receive connection permission from the first communication device; and a control unit configured to establish a first connection to the first communication device. The control unit controls a communication of a second communication device, and, in a case where a certain condition is satisfied, the control unit enables a function of controlling a wireless communication of the second communication device and performing the wireless communication of the second communication device, and autonomously establishes a second connection to the second communication device.

Abstract: A communication device includes: a transmission unit configured to transmit a connection request to a first communication device; a reception unit configured to receive connection permission from the first communication device; and a control unit configured to establish a first connection to the first communication device. The control unit controls a wireless communication of a second communication device, and, in a case where the connection to the first communication device is established, the reception unit receives, from the first communication device, a signal related to execution of a function of controlling the wireless communication of the second communication device and performing the wireless communication of the first communication device, and the control unit performs enabling or disabling of the function, based on the signal related to the execution of the function.

Abstract: A terminal according to one aspect of the present disclosure includes a control section that, when a physical uplink control channel (PUCCH) for transmission of hybrid automatic repeat reQuest acknowledgement (HARQ-ACK) information for a multicast physical downlink shared channel (PDSCH) overlaps with an uplink channel in a time domain, determines at least one channel of the PUCCH and the uplink channel, and a transmitting section that transmits the channel. According to one aspect of the present disclosure, it is possible to appropriately performs processing of the HARQ-ACK for multicast downlink data.

Abstract: A terminal receives a first downlink reference signal and a second downlink reference signal, and assumes that the first downlink reference signal is a quasi-colocation with the second downlink reference signal when receiving the first downlink reference signal in a state in which a connection at a given layer is not established.

Abstract: One aspect of a terminal according to the present disclosure includes a receiving section that receives downlink shared channel scheduled by downlink control information, and a control section that determines a feedback timing of transmission confirmation information responding to the downlink shared channel on the basis of information related to a feedback timing notified by at least one of the downlink control information and higher layer signaling, and a reference point configured in a slot where the downlink shared channel is transmitted or subsequent slots.

Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film 13 in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the plurality of lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the second thermoplastic resin is equal to or lower than the softening point of the first thermoplastic resin.

Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film (13) in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.

Abstract: A terminal includes: a reception unit configured to receive control information and data from a base station; a control unit configured to determine a carrier for transmitting an uplink control channel, based on the control information; and a transmission unit configured to transmit information related to retransmission control of the data in the determined carrier. The control unit configures an activation timing and a deactivation timing of the determined carrier.

Abstract: The radio relay device receives control information from a radio base station. The radio relay device controls based on the control information, the relay state of at least a beam in relaying radio waves from a radio base station or a terminal without signal interpretation.

Abstract: An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.

Abstract: A vehicle seat includes a support leg connected to a floor to be pivotable about a first axis extending in a horizontal direction; a seat cushion connected to the support leg to be pivotable about a second axis which is parallel to the first axis; a first coupling device provided on the support leg and configured to be detachably coupled with a first coupling part provided on the floor; and a second coupling device provided on the seat cushion and configured to be detachably coupled with a second coupling part provided on the floor. The seat cushion is movable between a stowed position in which the seat cushion is in a lowest position, a first use position in which the first coupling device is coupled with the first coupling part, and a second use position in which the second coupling device is coupled with the second coupling part.

Abstract: A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.

Abstract: To provide a mesh member such that a static charge can be suppressed. Provided is a mesh member including a mesh woven fabric and a coating layer that is formed on the surface of the mesh woven fabric and contains a carbon nanotube and/or graphene.

Abstract: To better fulfill a sleep-inducing function for a seated person, a seat device includes a pressing device provided in a seat back and configured to press a back or a waist of a seated person to induce breathing; at least one of a temperature adjusting device configured to change a temperature of a seat cushion and/or the seat back and a shape adjusting device configured to change a surface shape of the seat cushion and/or the seat back; and a controller configured to control the pressing device to press the back or the waist of the seated person at a set cycle corresponding to a breathing cycle of a person at a sleeping time, and control the at least one of the temperature adjusting device and the shape adjusting device.

Abstract: An object of the present invention is to suppress a crack in a sealing resin and a warpage in a semiconductor device in a power semiconductor device. A power semiconductor device includes: a semiconductor element; a terminal; a chassis; and a sealing resin sealing the semiconductor element and the terminal in the chassis. The sealing resin includes: a first sealing resin covering at least the semiconductor element; and a second sealing resin formed on an upper portion of the first sealing resin, and in an operation temperature of the semiconductor element, the first sealing resin has a smaller linear expansion coefficient than the second sealing resin, and a difference of a linear expansion coefficient between the first sealing resin and the terminal is smaller than a difference of a linear expansion coefficient between the second sealing resin and the terminal.

Abstract: The time required to complete current-to-target state transitions of a plurality of movable portions constituting a seat is shortened. A seat unit 1 includes an occupant support portion S1, a plurality of movable mechanisms respectively moving a plurality of parts constituting the occupant support portion S1, and an ECU 40 controlling respective operations of the plurality of movable mechanisms. The ECU 40 causes each of the plurality of movable mechanisms to undergo a transition from a current state to a target state and the plurality of movable mechanisms have a first movable mechanism requiring a longest time for the transition. The ECU 40 causes the transitions of the plurality of movable mechanisms other than the first movable mechanism to be completed by completion of the transition of the first movable mechanism from the current state to the target state.

Abstract: A semiconductor chip (6) is disposed on the insulation substrate (2). A lead frame (8) is bonded to an upper surface of the semiconductor chip (6). A sealing resin (12) covers the semiconductor chip (6), the insulation substrate (2), and the lead frame (8). A stress mitigation resin (13) having a lower elastic modulus than that of the sealing resin (12) is partially applied to an end of the lead frame (8).

Abstract: Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.

Abstract: To provide a mesh member such that a static charge can be suppressed. Provided is a mesh member including a mesh woven fabric and a coating layer that is formed on the surface of the mesh woven fabric and contains a carbon nanotube and/or graphene.