Abstract: A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.

Abstract: In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 ?m or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.

Abstract: A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.

Abstract: In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 ?m or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.

Abstract: An organic solvent alone or together with a rubber process oil is added to a powder of .mu.-sulfur, the mixture is granulated, and the granulation product is heated at a temperature lower than 120.degree. C. to evaporate the organic solvent, whereby granular .mu.-sulfur having an improved flowability is obtained. This granular .mu.-sulfur is valuable as a rubber-vulcanizing agent.

Abstract: There is disclosed an apparatus for bonding an adhesive rubber tape to both ends of a steel cord fabric. The apparatus comprises a unit for carrying the fabric, a unit for supplying the tape, and unit for folding and bonding the tape to both ends of the fabric. The folding/bonding unit includes a press rollers for bonding a widthwise half of the tape to upper end surfaces of the fabric, oblique rollers for folding an unbonded portion of the tape at both ends of the fabric, and taper rollers for bonding the folded tape to the fabric. The surfaces of oblique rollers are formed of transformable elastic materials, these rollers on each side of the steel cord fabric being disposed at different inclined angles.

Abstract: An improved automatic rim exchanger for use in a tire uniformity machine includes an upper spindle adapted to be rotated about the same axis as an axis of a tire, a fitting portion provided at the bottom of the upper spindle and associated with a chuck for detachably supporting upper rim structure of an upper rim holding member and upper rim, a lower spindle associated with a lock mechanism, which spindle is rotatably disposed on a lower spindle assembly mounted on an elevator member, has lower rim structure of a lower rim holding member and a lower rim detachably fitted therein, and is raised and lowered in the axial direction on the same axis, a jointly movable support member projecting from the lower rim means and adapted to be detachably fitted in a holding hole of the upper rim structure for supporting the upper rim structure, and a conveyor for supporting the vertically fitted upper and lower rim structure to feed and eject them.

Abstract: An unloader for a tire curing machine is improved in that a tire gripping device in the unloader is composed of a chuck base for depressing an upper bladder clamp ring upon lowering an arm which supports the tire gripping device to form a space for inserting chuck claws between inner circumferential portions of a bladder and a cured tire, chuck claws mounted on the chuck base so as to be expansible and contractible, and a chuck claw expansion/contraction hydraulic cylinder mounted on the chuck base.