Patents by Inventor Yukiko Wakino
Yukiko Wakino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10912222Abstract: A cooling system includes: a cooling device; a pump coupled to the cooling device; and a waste heat device coupled to the cooling device, wherein the cooling device includes: a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.Type: GrantFiled: September 4, 2019Date of Patent: February 2, 2021Assignee: FUJITSU LIMITEDInventors: Satoshi Inano, Hiroyuki Fukuda, Minoru Ishinabe, Yukiko Wakino
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Patent number: 10888032Abstract: An apparatus for liquid immersion cooling, the apparatus includes: a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component in a plurality of heat generating component; a liquid cooling jacket provided in contact with the first heat generating component placed in the casing, and configured to cool the first heat generating component; a first cooling device configured to dissipate heat of a second coolant sent out from the liquid cooling jacket through a first pipe, thereby cooling the second coolant; and a first pump configured to send out the second coolant cooled by the first cooling device to the liquid cooling jacket through a second pipe.Type: GrantFiled: June 11, 2019Date of Patent: January 5, 2021Assignee: FUJITSU LIMITEDInventors: Yukiko Wakino, Satoshi Inano, Hiroyuki Fukuda, Minoru Ishinabe
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Patent number: 10743438Abstract: An apparatus includes: a cooling medium bath configured to house a first refrigerant in which an electronic device is immersed; a liquid-cooling jacket configured to be provided to the electronic device and to cool the electronic device by a second refrigerant that flows in an internal section of the liquid-cooling jacket; a first pipe coupled to the cooling medium bath, to be immersed in the first refrigerant, and configured to supply the second refrigerant from an outside of the cooling medium bath to the liquid-cooling jacket; a second pipe coupled to the cooling medium bath, to be immersed in the first refrigerant, and configured to discharge the second refrigerant that flows in the internal section of the liquid-cooling jacket to the outside of the cooling medium bath; and a circulator configured to cause the first refrigerant in the cooling medium bath to stream.Type: GrantFiled: July 10, 2017Date of Patent: August 11, 2020Assignee: FUJITSU LIMITEDInventors: Yukiko Wakino, Satoshi Inano, Hiroyuki Fukuda, Hiroyoshi Kodama, Minoru Ishinabe
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Patent number: 10624236Abstract: A liquid immersion tank includes an outer-case to have a first hole in a side-wall of the outer-case and an opening at a top of the outer-case, an inner-case to have a second hole in a side-wall of the inner-case and an opening at a top of the inner-case, the inner-case being contained in the outer-case and containing an electronic device to be cooled by a coolant, and a spring to support the inner-case to be able to move between a first position and a second position disposed above the first position, cause, when the inner-case is at the first position, the second hole to communicate with the first hole so that the coolant flow into the inner-case, and cause, when the inner-case is at the second position, the second hole to face the side-wall of the outer-case so that the coolant is prevented to flow into the inner-case.Type: GrantFiled: July 8, 2019Date of Patent: April 14, 2020Assignee: FUJITSU LIMITEDInventors: Satoshi Inano, Hiroyuki Fukuda, Minoru Ishinabe, Yukiko Wakino
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Publication number: 20200029464Abstract: A liquid immersion tank includes an outer-case to have a first hole in a side-wall of the outer-case and an opening at a top of the outer-case, an inner-case to have a second hole in a side-wall of the inner-case and an opening at a top of the inner-case, the inner-case being contained in the outer-case and containing an electronic device to be cooled by a coolant, and a spring to support the inner-case to be able to move between a first position and a second position disposed above the first position, cause, when the inner-case is at the first position, the second hole to communicate with the first hole so that the coolant flow into the inner-case, and cause, when the inner-case is at the second position, the second hole to face the side-wall of the outer-case so that the coolant is prevented to flow into the inner-case.Type: ApplicationFiled: July 8, 2019Publication date: January 23, 2020Applicant: FUJITSU LIMITEDInventors: Satoshi INANO, Hiroyuki FUKUDA, Minoru Ishinabe, Yukiko Wakino
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Publication number: 20190394900Abstract: A cooling system includes: a cooling device; a pump coupled to the cooling device; and a waste heat device coupled to the cooling device, wherein the cooling device includes: a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.Type: ApplicationFiled: September 4, 2019Publication date: December 26, 2019Applicant: FUJITSU LIMITEDInventors: Satoshi INANO, Hiroyuki FUKUDA, Minoru Ishinabe, Yukiko Wakino
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Patent number: 10517191Abstract: A liquid immersion server includes a processor, a heat sink to which heat generated by the processor is transferred, a flow channel through which a first refrigerant liquid that has absorbed heat from the heat sink flows, and a cooling bath that stores a second refrigerant liquid that is inactive in a lower section thereof and that stores the first refrigerant liquid in an upper section thereof, wherein when the liquid immersion server is in operation, the processor, the heat sink, and the flow channel are immersed in the second refrigerant liquid, the flow channel has a supply port to which the first refrigerant liquid is supplied from a first pipe and a first discharge port that discharges the first refrigerant liquid that has absorbed heat into the cooling bath.Type: GrantFiled: September 14, 2018Date of Patent: December 24, 2019Assignee: FUJITSU LIMITEDInventors: Yukiko Wakino, Satoshi Inano, Hiroyuki Fukuda, Minoru Ishinabe
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Publication number: 20190297747Abstract: An apparatus for liquid immersion cooling, the apparatus includes: a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component in a plurality of heat generating component; a liquid cooling jacket provided in contact with the first heat generating component placed in the casing, and configured to cool the first heat generating component; a first cooling device configured to dissipate heat of a second coolant sent out from the liquid cooling jacket through a first pipe, thereby cooling the second coolant; and a first pump configured to send out the second coolant cooled by the first cooling device to the liquid cooling jacket through a second pipe.Type: ApplicationFiled: June 11, 2019Publication date: September 26, 2019Applicant: FUJITSU LIMITEDInventors: Yukiko Wakino, Satoshi INANO, Hiroyuki FUKUDA, Minoru Ishinabe
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Patent number: 10356958Abstract: An immersion cooling apparatus includes an immersion tank in which an electronic device is disposed and in which a secondary refrigerant is stored, the electronic device being dipped into and cooled down by the secondary refrigerant, a housing in which the immersion tank is disposed and in which a primary refrigerant is stored, the immersion tank being dipped into and cooled down by the primary refrigerant, and a driver that rotates the immersion tank, wherein the immersion tank being rotatably attached to an interior of the housing, the immersion tank having an inner circumferential surface and an outer circumferential surface, the inner circumferential surface being positioned facing the electronic device, the outer circumferential surface being positioned on an opposite side of the inner circumferential surface, each of the inner circumferential surface and the outer circumferential surface having a plurality of projections.Type: GrantFiled: August 28, 2018Date of Patent: July 16, 2019Assignee: FUJITSU LIMITEDInventors: Satoshi Inano, Minoru Ishinabe, Yukiko Wakino, Hiroyuki Fukuda
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Publication number: 20190098796Abstract: A liquid immersion server includes a processor, a heat sink to which heat generated by the processor is transferred, a flow channel through which a first refrigerant liquid that has absorbed heat from the heat sink flows, and a cooling bath that stores a second refrigerant liquid that is inactive in a lower section thereof and that stores the first refrigerant liquid in an upper section thereof, wherein when the liquid immersion server is in operation, the processor, the heat sink, and the flow channel are immersed in the second refrigerant liquid, the flow channel has a supply port to which the first refrigerant liquid is supplied from a first pipe and a first discharge port that discharges the first refrigerant liquid that has absorbed heat into the cooling bath.Type: ApplicationFiled: September 14, 2018Publication date: March 28, 2019Applicant: FUJITSU LIMITEDInventors: Yukiko Wakino, Satoshi INANO, Hiroyuki FUKUDA, Minoru Ishinabe
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Publication number: 20190082556Abstract: An immersion cooling apparatus includes an immersion tank in which an electronic device is disposed and in which a secondary refrigerant is stored, the electronic device being dipped into and cooled down by the secondary refrigerant, a housing in which the immersion tank is disposed and in which a primary refrigerant is stored, the immersion tank being dipped into and cooled down by the primary refrigerant, and a driver that rotates the immersion tank, wherein the immersion tank being rotatably attached to an interior of the housing, the immersion tank having an inner circumferential surface and an outer circumferential surface, the inner circumferential surface being positioned facing the electronic device, the outer circumferential surface being positioned on an opposite side of the inner circumferential surface, each of the inner circumferential surface and the outer circumferential surface having a plurality of projections.Type: ApplicationFiled: August 28, 2018Publication date: March 14, 2019Applicant: FUJITSU LIMITEDInventors: Satoshi INANO, Minoru Ishinabe, Yukiko Wakino, Hiroyuki FUKUDA
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Patent number: 10111367Abstract: A liquid immersion cooling apparatus that cools an electronic device including a heat generating element, the apparatus includes a liquid immersion tank that accommodates a cooling liquid and the electronic device to be immersed in the cooling liquid, a wall that is disposed within the liquid immersion tank, the wall having a protrusion protruding toward the electronic device, and a drive mechanism that moves a position of the protrusion along the electronic device.Type: GrantFiled: April 27, 2017Date of Patent: October 23, 2018Assignee: FUJITSU LIMITEDInventors: Hiroyoshi Kodama, Hiroshi Endo, Yukiko Wakino, Satoshi Inano, Hiroyuki Fukuda
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Patent number: 10015912Abstract: A data center includes: a liquid immersion tank that holds an information processing apparatus in a cooling liquid; a cooling apparatus that cools a pipe exposed to outside air and through which the cooling liquid flows from the liquid immersion tank; and a pump apparatus that delivers the cooling liquid from the cooling apparatus to the liquid immersion tank.Type: GrantFiled: February 15, 2017Date of Patent: July 3, 2018Assignee: FUJITSU LIMITEDInventors: Satoshi Inano, Hiroyuki Fukuda, Hiroyoshi Kodama, Hiroshi Endo, Yukiko Wakino
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Publication number: 20180027695Abstract: An apparatus includes: a cooling medium bath configured to house a first refrigerant in which an electronic device is immersed; a liquid-cooling jacket configured to be provided to the electronic device and to cool the electronic device by a second refrigerant that flows in an internal section of the liquid-cooling jacket; a first pipe coupled to the cooling medium bath, to be immersed in the first refrigerant, and configured to supply the second refrigerant from an outside of the cooling medium bath to the liquid-cooling jacket; a second pipe coupled to the cooling medium bath, to be immersed in the first refrigerant, and configured to discharge the second refrigerant that flows in the internal section of the liquid-cooling jacket to the outside of the cooling medium bath; and a circulator configured to cause the first refrigerant in the cooling medium bath to stream.Type: ApplicationFiled: July 10, 2017Publication date: January 25, 2018Applicant: FUJITSU LIMITEDInventors: Yukiko WAKINO, Satoshi INANO, Hiroyuki FUKUDA, Hiroyoshi KODAMA, Minoru ISHINABE
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Publication number: 20170354066Abstract: A liquid immersion cooling apparatus that cools an electronic device including a heat generating element, the apparatus includes a liquid immersion tank that accommodates a cooling liquid and the electronic device to be immersed in the cooling liquid, a wall that is disposed within the liquid immersion tank, the wall having a protrusion protruding toward the electronic device, and a drive mechanism that moves a position of the protrusion along the electronic device.Type: ApplicationFiled: April 27, 2017Publication date: December 7, 2017Applicant: FUJITSU LIMITEDInventors: Hiroyoshi KODAMA, Hiroshi ENDO, Yukiko WAKINO, Satoshi INANO, Hiroyuki FUKUDA
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Publication number: 20170303443Abstract: A data center includes: a liquid immersion tank that holds an information processing apparatus in a cooling liquid; a cooling apparatus that cools a pipe exposed to outside air and through which the cooling liquid flows from the liquid immersion tank; and a pump apparatus that delivers the cooling liquid from the cooling apparatus to the liquid immersion tank.Type: ApplicationFiled: February 15, 2017Publication date: October 19, 2017Applicant: FUJITSU LIMITEDInventors: Satoshi INANO, Hiroyuki FUKUDA, Hiroyoshi Kodama, Hiroshi ENDO, Yukiko Wakino
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Publication number: 20170194548Abstract: A semiconductor device includes: a board; an electronic element mounted over the board; a Peltier element placed over the electronic element; a first holding board placed over the Peltier element; a radiation member placed over the first holding board; and a first thermal conduction layer placed between the first holding board and the radiation member, the first thermal conduction layer being in close contact with the first holding board.Type: ApplicationFiled: December 6, 2016Publication date: July 6, 2017Applicant: FUJITSU LIMITEDInventor: Yukiko Wakino
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Patent number: 8378687Abstract: A measuring method of a battery includes the step of measuring frequency characteristics of an internal impedance of the battery by an AC impedance method, and determining a parameter of an element representing ease of mobility of charges on a surface of a positive electrode of the battery and that of an element representing the ease of mobility of charges on the surface of a negative electrode.Type: GrantFiled: October 8, 2008Date of Patent: February 19, 2013Assignee: Fujitsu LimitedInventors: Yasuhiro Yoneda, Katsusada Motoyoshi, Yukiko Wakino, Kensuke Yoshida
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Publication number: 20090096459Abstract: A measuring method of a battery includes the step of measuring frequency characteristics of an internal impedance of the battery by an AC impedance method, and determining a parameter of an element representing ease of mobility of charges on a surface of a positive electrode of the battery and that of an element representing the ease of mobility of charges on the surface of a negative electrode.Type: ApplicationFiled: October 8, 2008Publication date: April 16, 2009Applicant: FUJITSU LIMITEDInventors: Yasuhiro Yoneda, Katsusada Motoyoshi, Yukiko Wakino, Kensuke Yoshida