Abstract: A metal member-equipped circuit board 21 includes: a printed circuit board 22 including a through hole 25; a metal member 30 including a shaft portion 31 that is inserted into the through hole 25, and a head portion 32 that is arranged outside the through hole 25, the head portion 32 having a diameter larger than a diameter A1 of the through hole 25, and a conductive bonding material 35 for bonding the shaft portion 31 and an inner wall of the through hole 25 to each other.

Abstract: A metal member-equipped circuit board 21 includes: a printed circuit board 22 including a through hole 25; a metal member 30 including a shaft portion 31 that is inserted into the through hole 25, and a head portion 32 that is arranged outside the through hole 25, the head portion 32 having a diameter larger than a diameter A1 of the through hole 25, and a conductive bonding material 35 for bonding the shaft portion 31 and an inner wall of the through hole 25 to each other.

Abstract: A power conversion apparatus includes a first power conversion circuit board on which a first heat generating component is mounted, a second power conversion circuit board on which a second heat generating component is mounted, a first heat dissipation member that is overlaid on the first power conversion circuit board and dissipates heat of the first power conversion circuit board, and a second heat dissipation member that is overlaid on the second power conversion circuit board and dissipates heat of the second power conversion circuit board, and the first power conversion circuit board and the second power conversion circuit board are arranged opposite to each other with the first heat dissipation member and the second heat dissipation member arranged on the respective outer sides of the first and second power conversion circuit boards.

Abstract: A metal member-equipped circuit board includes: a printed circuit board including a through hole; a metal member including a shaft portion that is inserted into the through hole, and a head portion that is arranged outside the through hole, the head portion having a diameter larger than a diameter of the through hole, and a conductive bonding material for bonding the shaft portion and an inner wall of the through hole to each other.

Abstract: A circuit assembly includes a busbar substrate with busbars and a resin part that is in intimate contact with the busbars, a press-fit member that is made of metal with a thickness greater than the thickness of the busbars, and is press-fitted in the busbar substrate, an electronic component connected to the press-fit member, solder that connects the busbars and the press-fit member, and a solder accumulating portion that is formed with the resin part, and in which the solder is accumulated.

Abstract: An electrical junction box includes: a circuit board on which an electronic component having a main body is mounted on a mounting surface; a frame inside of which the circuit board is accommodated; a cover portion covering the circuit board from the mounting surface side; and a heat transfer member disposed between the main body and the cover portion, and the frame includes a heat transfer member holding portion holding the heat transfer member at a position where the heat transfer member is in heat conductive contact with both the main body and the cover portion.

Abstract: Provided is a conductive member including a busbar having a through hole, and a metal member fixed to the busbar, the metal member including a shaft portion passed through the through hole, and a first head portion at one end portion of the shaft portion, the first head portion having an outer diameter larger than the diameter of the through hole. Since the metal member includes the first head portion, it is possible to increase the heat capacity of the metal member as compared with that achieved with a conventional conductive member that does not include the first head portion. Accordingly, it is possible to further increase the heat dissipation of the conductive member using a simple configuration.

Abstract: A circuit assembly 1 includes a semiconductor switching element, a main substrate, a plurality of bus bars and a sub-substrate that are overlaid on the main substrate, and a jumper wire. The main substrate includes a first insulating substrate and a first conductive path. The sub-substrate includes a second insulating substrate and a second conductive path, and is overlaid on the main substrate and arranged in the same layer as the bus bars. The jumper wire connects the first conductive path with the second conductive path. A plurality of terminals of the semiconductor switching element include a drain terminal 42 and a source terminal that are connected to the bus bar and a gate terminal connected to the second conductive path. A noise reduction element is mounted on the sub-substrate.

Abstract: An electrical junction box includes: a connector housing that is to be fitted to a mating connector housing; a terminal held by a terminal holding portion provided in the connector housing; a first board connected to an end portion on an extension portion side of the terminal, the extension portion extending from the terminal holding portion toward a direction opposite to a fitting direction; a second board facing the first board; and a heat-generating component installed on the second board in the vicinity of the extension portion.

Abstract: A circuit assembly 1 includes a semiconductor switching element, a main substrate, a plurality of bus bars and a sub-substrate that are overlaid on the main substrate, and a jumper wire. The main substrate includes a first insulating substrate and a first conductive path. The sub-substrate includes a second insulating substrate and a second conductive path, and is overlaid on the main substrate and arranged in the same layer as the bus bars. The jumper wire connects the first conductive path with the second conductive path. A plurality of terminals of the semiconductor switching element include a drain terminal 42 and a source terminal that are connected to the bus bar and a gate terminal connected to the second conductive path. A noise reduction element is mounted on the sub-substrate.

Abstract: A circuit assembly includes a busbar substrate with busbars and a resin part that is in intimate contact with the busbars, a press-fit member that is made of metal with a thickness greater than the thickness of the busbars, and is press-fitted in the busbar substrate, an electronic component connected to the press-fit member, solder that connects the busbars and the press-fit member, and a solder accumulating portion that is formed with the resin part, and in which the solder is accumulated.

Abstract: An electrical junction box includes: a circuit board on which an electronic component having a main body is mounted on a mounting surface; a frame inside of which the circuit board is accommodated; a cover portion covering the circuit board from the mounting surface side; and a heat transfer member disposed between the main body and the cover portion, and the frame includes a heat transfer member holding portion holding the heat transfer member at a position where the heat transfer member is in heat conductive contact with both the main body and the cover portion.

Abstract: A circuit board includes: a bus bar; a first prepreg that is overlaid on the bus bar; and a sheet-like leakage prevention portion that is overlaid on the surface of the first prepreg and suppresses leakage of the first prepreg to the outside.

Abstract: An electrical junction box includes a first circuit portion in which a first heat-generating component is mounted, a second circuit portion in which a second heat-generating component is mounted, a first heat dissipation member that is overlaid on the first circuit portion and dissipates heat of the first circuit portion, a second heat dissipation member that is overlaid on the second circuit portion and dissipates heat of the second circuit portion, and a support member that is made of a metal, is disposed between the first heat dissipation member and the second heat dissipation member, and supports the first heat dissipation member and the second heat dissipation member. The support member includes a heat receiving portion that is disposed between the first circuit portion and the second circuit portion and receives heat of the first heat-generating component and the second heat-generating component.

Abstract: A circuit board includes: a bus bar; a first prepreg that is overlaid on the bus bar; and a sheet-like leakage prevention portion that is overlaid on the surface of the first prepreg and suppresses leakage of the first prepreg to the outside.

Abstract: A circuit assembly that includes a heat generator; a circuit board, which has a conduction path, and to which the heat generator is mounted, a heat dissipating member arranged facing the circuit board, an insulating film arranged in a region that is overlapped by the heat generator between the circuit board and the heat dissipating member, an adhesive or sticky first heat conductor that is arranged between the circuit board and the insulating film and is in contact with the circuit board and the insulating film, and an adhesive or sticky second heat conductor that is arranged between the insulating film and the heat dissipating member and is in contact with the insulating film and the heat dissipating member.

Abstract: A circuit structure disclosed in the present specification includes: a circuit board provided with a wiring portion; a conductor body (conductor plate) adhered to one side of the circuit board; and a terminal that electrically connects the wiring portion of the circuit board and the conductor body. The terminal includes a relay connection portion between a portion connected to the wiring portion and a portion connected to the conductor body, and the relay connection portion protrudes past the wiring portion, on the other side of the circuit board.

Abstract: Provided is a conductive member including a busbar having a through hole, and a metal member fixed to the busbar, the metal member including a shaft portion passed through the through hole, and a first head portion at one end portion of the shaft portion, the first head portion having an outer diameter larger than the diameter of the through hole. Since the metal member includes the first head portion, it is possible to increase the heat capacity of the metal member as compared with that achieved with a conventional conductive member that does not include the first head portion. Accordingly, it is possible to further increase the heat dissipation of the conductive member using a simple configuration.

Abstract: An electrical junction box includes: a connector housing that is to be fitted to a mating connector housing; a terminal held by a terminal holding portion provided in the connector housing; a first board connected to an end portion on an extension portion side of the terminal, the extension portion extending from the terminal holding portion toward a direction opposite to a fitting direction; a second board facing the first board; and a heat-generating component installed on the second board in the vicinity of the extension portion.

Abstract: A coil assembly includes a coil unit in which a coil obtained by winding a winding wire is disposed around a magnetic core, a coil case that accommodates the coil unit, and a potting material with which an inside of the coil case is filled, and the coil case has an elastic fixing portion that is attachable to a resin member to which the coil case is to be fixed. The above-described configuration makes it possible to provide a coil assembly that is unlikely to crack and generate abnormal noises.