Patents by Inventor Yukio Shimizu

Yukio Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200100637
    Abstract: A vacuum cleaner includes a main body case which includes a main body connection port at a front side, a pair of wheels provided on the left and right side portions of the main body case to support the main body case movably and conceals at least a back surface of the main body case when viewed in a rotation axis direction, and a secondary battery provided in an area sandwiched between the pair of wheels and arranged in conformity with the shape of the main body case.
    Type: Application
    Filed: December 5, 2019
    Publication date: April 2, 2020
    Applicant: Toshiba Lifestyle Products & Services Corporation
    Inventors: Masatoshi TANAKA, Takayoshi SHIMIZU, Yukio MACHIDA
  • Publication number: 20190376289
    Abstract: A binding beam includes a steel form having a bottom plate portion and a pair of side plate portions extending upward from both ends of the bottom plate portion and binding beam concrete placed in a groove portion configured by the bottom plate portion and the pair of side plate portions of the steel form.
    Type: Application
    Filed: August 23, 2019
    Publication date: December 12, 2019
    Applicants: TAKENAKA CORPORATION, JFE STEEL CORPORATION, JFE METAL PRODUCTS CORPORATION
    Inventors: Takayuki HIRAYAMA, Kazuto NAKAHIRA, Hirokazu NOZAWA, Yuuichirou OKUNO, Takahiro MACHINAGA, Naohiro FUJITA, Hiroto TAKATSU, Kenji YAMAZAKI, Yukio MURAKAMI, Tomohiro KINOSHITA, Takanori SHIMIZU, Seishi WATANABE, Hiroori YASUOKA
  • Publication number: 20190376283
    Abstract: A steel form is a steel form for forming a binding beam, including: a pair of Z-steels, wherein each of the pair of Z-steels is provided with a bottom plate portion and a side plate portion extending upward from the bottom plate portion, the bottom plate portion has a joining surface for joining the respective bottom plate portions of the pair of Z-steels to each other, and a groove portion allowing concrete placement is formed by the bottom plate portion and the side plate portion of each of the pair of Z-steels
    Type: Application
    Filed: August 23, 2019
    Publication date: December 12, 2019
    Applicants: TAKENAKA CORPORATION, JFE STEEL CORPORATION, JFE METAL PRODUCTS CORPORATION
    Inventors: Takayuki HIRAYAMA, Kazuto NAKAHIRA, Hirokazu NOZAWA, Yuuichirou OKUNO, Takahiro MACHINAGA, Naohiro FUJITA, Hiroto TAKATSU, Kenji YAMAZAKI, Yukio MURAKAMI, Tomohiro KINOSHITA, Takanori SHIMIZU, Seishi WATANABE, Hiroori YASUOKA
  • Publication number: 20190363153
    Abstract: A display device includes a TFT layer provided in a display area, a bending section and a terminal in a non-active area, and a terminal wiring line that connects to the terminal through the bending section, and the terminal wiring line includes a first wiring line and a second wiring line each positioned on both sides of the bending section and a third wiring line that passes through the bending section and is electrically connected with each of the first wiring line and the second wiring line and curved so as to have recesses and protrusions.
    Type: Application
    Filed: September 22, 2017
    Publication date: November 28, 2019
    Inventors: Takashi MATSUI, Yukio SHIMIZU, Gen NAGAOKA, Motoji SHIOTA
  • Publication number: 20190315094
    Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.
    Type: Application
    Filed: November 9, 2017
    Publication date: October 17, 2019
    Inventors: Takeshi SAITOH, Yukio NAKAMURA, Ryohta SASAKI, Junki SOMEKAWA, Yuji TOSAKA, Hiroshi SHIMIZU, Ryoichi UCHIMURA
  • Publication number: 20190295974
    Abstract: Provided is connection wiring capable of inhibiting connection defects between bumps and pads at the time of semiconductor chip mounting and also allowing an increase in the number of pads. In an area between a pad row in any stage and a pad row in an adjacent stage, a first line 31 is disposed so as to pass under an adjacent second line 32, or a second line 32 is disposed so as to pass over an adjacent first line 31. In this case, three lines are disposed in any area between pads 20 in each stage such that the three lines include a first line 31 situated in the middle, and second lines 32 are situated so as to have the first line 31 positioned therebetween. Thus, the pitch between the pads 20 can be further reduced without reducing the width of the pads 20.
    Type: Application
    Filed: November 24, 2017
    Publication date: September 26, 2019
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: SEIJI MURAOKA, YUKIO SHIMIZU, MOTOJI SHIOTA
  • Publication number: 20190296146
    Abstract: A semiconductor device of an embodiment includes a silicon carbide layer; a gate electrode; a gate insulating layer disposed between the silicon carbide layer and the gate electrode; a first region disposed in the silicon carbide layer and containing nitrogen (N); and a second region disposed between the first region and the gate insulating layer, and containing at least one element selected from the group consisting of nitrogen (N), phosphorus (P), arsenic (As), antimony (Sb), scandium (Sc), yttrium (Y), lanthanum (La), lanthanoids (Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu), hydrogen (H), deuterium (D), and fluorine (F).
    Type: Application
    Filed: August 27, 2018
    Publication date: September 26, 2019
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Tatsuo SHIMIZU, Ryosuke IIJIMA, Toshihide ITO, Shunsuke ASABA, Yukio NAKABAYASHI, Shigeto FUKATSU
  • Publication number: 20190204655
    Abstract: An array substrate includes at least: a glass substrate on which a driver is mounted; a panel side output terminal disposed in a mounting area of the glass substrate and connected to the driver; a first terminal portion; a gate insulation film including a first contact hole at a position overlapping a first terminal portion; a second terminal portion disposed to overlap at least a first contact hole and an opening edge of the first contact hole; a first interlayer insulation film including a second contact hole at a position overlapping a second terminal portion not to overlap the first contact hole; and a third terminal portion disposed to overlap at least the second contact hole and an opening edge of the second contact hole.
    Type: Application
    Filed: September 7, 2017
    Publication date: July 4, 2019
    Inventors: YUKIO SHIMIZU, SHINZOH MURAKAMI, TAKESHI HORIGUCHI
  • Publication number: 20190174984
    Abstract: Provided is a vacuum cleaner capable of efficiently utilizing exhaust of an electric blower when the vacuum cleaner is used as a blower. An exhaust air path (37) is arranged in a body portion (21) so as to communicate between an exhaust side of the electric blower and an exhaust port. A connecting port (34) is arranged on the body portion (21). A blower air path (38) is arranged in the body portion (21) so as to communicate between the exhaust side of the electric blower and the connecting port (34). A switching valve (39) is arranged capable of opening and closing the connecting port (34), so as to switch between the exhaust air path (37) and the blower air path (38) according to the opening and closing. An attachment (17), when being attached to the connecting port (34), communicates with the blower air path (38) upon switching by the switching valve (39).
    Type: Application
    Filed: July 28, 2017
    Publication date: June 13, 2019
    Applicant: TOSHIBA LIFESTYLE PRODUCTS & SERVICES CORPORATION
    Inventors: Yukio MACHIDA, Naoko SHINAGAWA, Yusuke ABE, Takayoshi SHIMIZU, Fumiki MANO
  • Publication number: 20190159643
    Abstract: A vacuum cleaner includes a main body portion, a secondary battery, an electric blower, a handle and a conductive member. The secondary battery is disposed in the main body portion. The electric blower operates by electric power supply from the secondary battery. The handle is one which a user contacts when the vacuum cleaner is used. At least a part of the conductive member is disposed at the handle and conducts static electricity generated due to operation of the electric blower.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Applicant: Toshiba Lifestyle Products & Services Corporation
    Inventors: Yukio Machida, Yusuke Abe, Naoko Shinagawa, Takayoshi Shimizu, Fumiki Mano
  • Publication number: 20190150685
    Abstract: A vacuum cleaner is provided with a cleaner main body having an electric blower and a handle. The handle is shaped such that a gravity center position of the cleaner main body remains substantially unchanged in a state in which any one region is gripped.
    Type: Application
    Filed: January 25, 2019
    Publication date: May 23, 2019
    Applicant: Toshiba Lifestyle Products & Services Corporation
    Inventors: Yusuke ABE, Yukio Machida, Fumiki Mano, Naoko Shinagawa, Takayoshi Shimizu
  • Publication number: 20190041685
    Abstract: The semiconductor device of the present invention includes: a first bump group including multiple first bumps aligned in a long side direction; a second bump group including multiple second bumps aligned in the long side direction; and a third bump group including multiple third bumps between the first bump group and the second bump group, wherein on the surface to be connected to the display device, in a short side direction perpendicular to the long side direction, no second bump is disposed or at least one of the multiple second bumps is disposed at least one of positions facing the multiple third bumps, the at least one of the multiple second bumps being a dummy bump.
    Type: Application
    Filed: February 3, 2017
    Publication date: February 7, 2019
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: SHINZOH MURAKAMI, YUKIO SHIMIZU, TAKESHI HORIGUCHI
  • Publication number: 20190033646
    Abstract: A terminal connection structure includes a large panel-side terminal (a high resistance terminal) 28 having relatively high electric resistance, and a large flexible board-side terminal (a low resistance terminal) 30 having relatively low electric resistance and connected to the large panel-side terminal 28. The large flexible board-side terminal 30 includes separated large flexible board-side terminals (separated low resistance terminals) 30a that are arranged at intervals and have a width relatively larger in a distal end side portion 30a2 with respect to a basal end side portion 30a1.
    Type: Application
    Filed: January 20, 2017
    Publication date: January 31, 2019
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Yukio SHIMIZU, Motoji SHIOTA, Keiji AOTA
  • Patent number: 9659880
    Abstract: A semiconductor device includes a wiring substrate, a semiconductor element mounted on an upper surface of a wiring substrate, and a magnetic shield arranged above the upper surface of the wiring substrate to cover an upper side of the semiconductor element. The magnetic shield is formed from a soft magnetic material and includes inclined faces that are inclined straight with respect to the upper surface of the wiring substrate at a portion overlapped with the semiconductor element in a plan view.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: May 23, 2017
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Manabu Nakamura, Yukio Shimizu, Nahomi Inoue
  • Publication number: 20160268215
    Abstract: A semiconductor device includes a wiring substrate, a semiconductor element mounted on an upper surface of a wiring substrate, and a magnetic shield arranged above the upper surface of the wiring substrate to cover an upper side of the semiconductor element. The magnetic shield is formed from a soft magnetic material and includes inclined faces that are inclined straight with respect to the upper surface of the wiring substrate at a portion overlapped with the semiconductor element in a plan view.
    Type: Application
    Filed: March 3, 2016
    Publication date: September 15, 2016
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: MANABU NAKAMURA, YUKIO SHIMIZU, NAHOMI INOUE
  • Patent number: 9217888
    Abstract: A liquid crystal display device includes: a liquid crystal panel having a display area and non-display area; a flexible substrate in the non-display area and connected to a control circuit substrate; a plurality of drivers in the non-display area; a plurality of connection wiring lines in the non-display area for connecting the flexible substrate to the plurality of drivers; a first driver; a second driver that is arranged further away from the flexible substrate than the first driver; a non-overlapping connection wiring line that connects the second driver to the flexible substrate and that does not overlap the first driver; and an overlapping connection wiring line that connects the second driver to the flexible substrate and that has a least a portion thereof overlapping the first driver.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: December 22, 2015
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yukio Shimizu, Seiji Muraoka, Motoji Shiota, Takeshi Horiguchi
  • Patent number: 9207477
    Abstract: A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: December 8, 2015
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Hiroki Miyazaki, Motoji Shiota, Takatoshi Kira, Gen Nagaoka, Seiji Muraoka, Makoto Tamaki, Keiji Aota, Yukio Shimizu, Takashi Matsui, Hiroki Nakahama, Hiroki Makino, Minoru Horino
  • Publication number: 20150319849
    Abstract: The present invention provides a component securing structure that forms a wiring unit on a TFT glass substrate that is capable of transmitting UV light. A component, such as a driver IC and/or an FPC, is electrically connected to the wiring unit and is secured to the TFT glass substrate by a UV-curable ACF. An opening for transmitting UV light is formed in a light shielding layer of the wiring unit. UV light irradiated from the back side of the TFT glass substrate passes through the opening and directly irradiates the UV-curable ACF.
    Type: Application
    Filed: December 9, 2013
    Publication date: November 5, 2015
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Yukio SHIMIZU, Motoji SHIOTA, Hiroki MIYAZAKI, Hiroki NAKAHAMA, Seiji MURAOKA, Takeshi HORIGUCHI
  • Patent number: 9117048
    Abstract: A layout pattern generating apparatus and a layout pattern generating method for an element used for layout design of a semiconductor integrated circuit (LSI) provide a reduction in time for generating a layout pattern with high versatility. The layout pattern generating apparatus for generating a layout pattern of each of elements included in a semiconductor integrated circuit, includes, for example, a storage, a basic figure generator, an additional figure generator, a display unit and an operation input unit. The apparatus and method also utilize at least terminal figure relative position information, figure adjustment value information, and additional figure relative position information, the additional figure being a figure other than the basic figure. The basic figure generator generates the effective area figure and the terminal figure of the layout pattern generation target element, and the additional figure generator generates the additional figure of the layout pattern generation target element.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: August 25, 2015
    Assignee: LAPIS Semiconductor Co., Ltd.
    Inventor: Yukio Shimizu
  • Publication number: 20150109550
    Abstract: A liquid crystal display device includes: a liquid crystal panel having a display area and non-display area; a flexible substrate (13) in the non-display area and connected to a control circuit substrate; a plurality of drivers (21) in the non-display area; a plurality of connection wiring lines (27) in the non-display area for connecting the flexible substrate to the plurality of drivers; a first driver (21A); a second driver (21B) that is arranged further away from the flexible substrate than the first driver; a non-overlapping connection wiring line (32) that connects the second driver to the flexible substrate and that does not overlap the first driver; and an overlapping connection wiring line (31) that connects the second driver to the flexible substrate and that has a least a portion thereof overlapping the first driver.
    Type: Application
    Filed: April 19, 2013
    Publication date: April 23, 2015
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Yukio Shimizu, Seiji Muraoka, Motoji Shiota, Takeshi Horiguchi