Abstract: A semiconductor chip (15) is bonded on a die pad (13) of a leadframe, and inner leads (12) are electrically connected to electrode pads of the semiconductor chip (15) with metal fine wires (16). The die pad (13), semiconductor chip (15) and inner leads are molded with a resin encapsulant (17). However, no resin encapsulant (17) exists on the respective back surfaces of the inner leads (12), which protrude downward from the back surface of the resin encapsulant (17) so as to be external electrodes (18). That is to say, since the external electrodes (18) protrude, a standoff height can be secured in advance for the external electrodes (18) in bonding the external electrodes (18) to electrodes of a motherboard. Thus, the external electrodes (18) may be used as external terminals as they are, and no ball electrodes of solder or the like need to be provided for the external electrodes (18). Accordingly, this process is advantageous in terms of the number of manufacturing process steps and the manufacturing costs.

Abstract: In a fuel injection valve, a cylindrical valve body has a valve seat protruding radially inward out of an inner wall thereof and a needle supporting cylindrical inner wall. A nozzle needle is fixed to the armature so as to move together with the armature, while being supported slidably by the needle supporting cylindrical inner wall. The nozzle needle is provided with a valve portion to be seated on the valve seat when a coil is de-energized and inside thereof with a cavity into which fuel is introduced. A fuel accumulation bore is provided between inner circumference of the cylindrical valve body and outer circumference of the nozzle needle. With the construction mentioned above, the nozzle needle is provided with an opening through which the cavity communicates with the fuel accumulation bore.

Abstract: A method for manufacturing a semiconductor chip (15) which is bonded on a die pad (13) of a leadframe, and inner leads (12) are electrically connected to electrode pads of the semiconductor chip (15) with metal fine wires (16). The die pad (13), semiconductor chip (15) and inner leads are molded with a resin encapsulant (17). However, no resin encapsulant (17) exists on the respective back surfaces of the inner leads (12), which protrude downward from the back surface of the resin encapsulant (17) so as to be external electrodes (18).

Abstract: Surface polishing system adapted to polish, lap or grind a surface of a workpiece in a plane such that the workpiece is held in sliding contact with a polishing face of a rotating polishing plate, wherein the workpiece is rotated by a work rotating device about an autorotation axis thereof which is parallel to an axis of rotation of the polishing plate and which lies within the surface of the workpiece, and the autorotation axis of the workpiece is revolved by a work revolving device about a revolving axis which is parallel to the axis of rotation of the polishing plate and which lies within a circumscribed circle of the surface of the workpiece.

Abstract: According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.

Abstract: In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead frame, a semiconductor chip is mounted on the insulator, and the semiconductor chip is connected with the inside inner leads and the outside inner leads through metal wires, and the resultant is sealed with a resin. Thus, projections provided on the bottoms of the inside inner leads and the outside inner leads can work as external terminals. Since the external terminals can be disposed two-dimensionally on the bottom the lead frame is applicable to high density packaging and multi-pin devices, and can additionally provide a so-called burr-less structure free from uncut waste of the resin.

Abstract: The lead frame of the present invention includes: an outer frame having an opening; a plurality of leads consisting of outer and signal-connecting leads and extending inside the opening from the outer frame toward a region in which the semiconductor chip is mounted; a die pad disposed inside the opening; and a plastic film adhered to respective lower surfaces of the die pad, the outer frame and the signal-connecting leads. This lead frame is not provided with support leads and the die pad is indirectly supported by the outer frame with the plastic film. Since no support leads are provided, the size of an installable semiconductor chip can be enlarged and the overall size of a semiconductor device can be reduced.

Abstract: According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.

Abstract: A lead frame including signal-connecting leads, a die pad and support leads is provided. A semiconductor chip is bonded to the die pad with an adhesive. The semiconductor chip, electrode pads and the signal-connecting leads are electrically connected to each other with metal fine wires. And these members are encapsulated in a resin encapsulant. The back surface of the die pad is subjected to half etching or the like to form a convex portion and a flange portion surrounding the convex portion. Since a thin layer of the resin encapsulant exists under the flange portion, the resin encapsulant can hold the die pad more strongly and the moisture resistance of the device can be improved with the lower surface of the die pad protruding from the resin encapsulant. As a result, the characteristics of a resin-molded semiconductor device having a die pad exposed on the back surface of a resin encapsulant can be improved.

Abstract: In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead frame, a semiconductor chip is mounted on the insulator, and the semiconductor chip is connected with the inside inner leads and the outside inner leads through metal wires, and the resultant is sealed with a resin. Thus, projections provided on the bottoms of the inside inner leads and the outside inner leads can work as external terminals. Since the external terminals can be disposed two-dimensionally on the bottom, the lead frame is applicable to high density packaging and multi-pin devices, and can additionally provide a so-called burr-less structure free from uncut waste of the resin.

Abstract: In a space surrounded by outer frames formed in the shape of as rectangle is disposed a die pad in the shape of a square for mounting a semiconductor chip having electrodes. Each of the outer frames is connected with a plurality of outer leads respectively continuous with inner leads which are used for electrical connection and extended toward the die pad. Each inner lead is extended to the vicinity of a position where each electrode of the semiconductor chip is to be formed. The corners of the die pad are respectively provided with support members extending to positions away from a dam bar by a predetermined distance. The support members are connected with the inner leads via a square ring-shaped insulating member. Thus, the die pad is supported by the outer frames via the support members. Since there is no need to provide a die pad lead, the space at the corner conventionally occupied by the die pad lead can be utilized for wiring, and the leads can be easily led in.

Abstract: A method of producing, in a workpiece such as a spiral member of a scroll element, a curved groove for receiving a mechanical seal by using a milling cutter, especially, an end mill. A relative feed in a given direction "A" is provided between the milling cutter and the work, and the milling cutter rotating in a predetermined direction "B" about an axis of rotation thereof is set so that the milling cutter provides an inner side wall of the curved groove with respect to a center of curvature of the curved groove with an up milling in which the direction "B" is directed against the direction "A", and that the milling cutter provides an outer side wall of the curved groove confronting the inner side wall with a down milling in which the direction "B" is directed toward the direction "A", in order to suppress formation of coarse and rough surface on both the inner and outer side wall of the curved groove. Thus, the width of the curved groove can be constantly accurate over an entire length of the groove.

Abstract: A method for machining a groove in a sealing member and the edges of the groove. A tool 24 is formed with a top portion 24 having cutter sections 23A, each defining a cutting edge 23 for machining a groove in a scroll wall of a scroll member, and a tapered part 25 having cutter sections 26A, each defining a cutting edge 26 for bevelling the edges of the groove and the edges of the scroll wall. The groove 9 and edges 11 are simultaneously machined.

Abstract: A plurality of identical images are formed in a single output image area in a partially superimposed relationship. The image data processing unit is provided with a memory unit for storing image data corresponding to the identical images. A reading signal generating unit generates a plurality of reading signals used for reading out the image data in the memory unit. Each of the reading signals provides information for an area in which one identical image is to be formed. A selecting unit selects one of the reading signals supplied by the reading signal generating unit. The selection being performed when the areas, in each of which one image is to be formed, the image being identical, are at least partially superimposed with each other. The memory unit outputs image data stored therein in accordance with the selected reading signal supplied by the selecting unit.

Abstract: A method for shaping a scroll member for a scroll compressor, capable of increasing a service life of a cutter tool, while reducing the cost. At the corner between the base plate 2 and a scroll wall, a roundness 3a of a small radius R1 of curvature is first machined along an entire length of the scroll wall in its spiral direction. Then, a roundness 3b of a large radius R2 of curvature is machined only at a spirally inner end of the scroll wall.

Abstract: A container filling apparatus makes it possible to discharge liquid stagnating within a filling valve. The filling valve is lowered towards a container being conveyed. Then a liquid passageway gating section is opened by pressing a bell-shaped member of the filling valve against the container, and liquid thus fills the container. The net amount of the contents to fill the container can be adjusted by vertically moving at least one of a filler liquid tank and a stopper member which limits the lower position of an intermediate spring bracket supporting a second elastic body for biasing a valve body upwardly with respect to a loading table on which the containers are supported. In addition, it is possible to open the liquid passageway gating section by lowering the filling valve with an external force. Therefore, liquid stagnating in the passageway of the filling valve can be discharged.

Abstract: In a chip-carrier provided with a chip-carrier substrate, a chip-carrier cover and an IC chip, said IC chip being arranged at a distance from a circuit surface of the IC chip being directed toward the chip-carrier substrate, an .alpha.-ray shielding film made of film material containing few radioactive elements, and adhered to a surface of the chip-carrier substrate facing the IC chip or to the circuit surface of the IC chip is provided for protecting the IC chip from the IC chip.

Abstract: A counterpressure type container filling apparatus typically includes a housing defining an annular liquid feed passageway therein, a valve for opening and closing the liquid feed passageway, a holding member externally fitted to the housing in a slidable manner and provided with a sealing element for sealing a container to be filled, and a gas pipe for introducing gas into the container or for allowing gas to escape from the container. The gas pipe is detachably mounted to the holding member and is projectable into the container in cooperation with the holding member. The improvements offered by the present invention act to apply an appropriate sealing pressure to the container, to facilitate the replacement of the holding member and the gas pipe, and to prevent the application of an excessively large pressure to the side wall of the container.

Abstract: This switch device for detecting an object comprises a transducer for emitting and receiving ultrasonic signals to and from an object, a transmitter for driving the transducer, a receiver for receiving a signal from the transducer, a gate for detecting a short-distant object, a gate for detecting a long-distant object, and a circuit for setting the timings of the gates in accordance with the detecting ranges of the object.

Abstract: The known liquid filling apparatus of the type including a housing, an annular liquid feed passageway, a liquid valve, a holding member and a gas pipe, is improved so as to facilitate cleaning of the interior of the apparatus, so as to be applicable to a container having a small mouth diameter, and so as to facilitate replacement of a gas pipe. The improvement resides in that, on the inner circumferential side of the holding member disposed slidably along the housing, are disposed a circular ring provided slidably along the same inner circumferential surface and a spring for normally biasing the circular ring in the downward direction.