Patents by Inventor Yuko Nakamata

Yuko Nakamata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11462450
    Abstract: A semiconductor device in which a semiconductor element mounted on a laminate substrate and an electrically conductive connection member are sealed with a sealing material, includes: a primer layer in an interface between the sealing material and sealed members including the laminate substrate, the semiconductor element, and the electrically conductive connection member, in which the sealing material includes a first sealing layer which is provided in contact with the primer layer; and a second sealing layer which covers the first sealing layer, the semiconductor device satisfies ?p??1>?2 in which ?p, ?1, and ?2 represent coefficients of linear thermal expansion of the primer layer, the first sealing layer, and the second sealing layer, respectively, ?c?15×10?6/° C. in which ?c represents a composite coefficient of linear thermal expansion of the sealing layers, and Ec?5 GPa or more in which Ec represents a composite Young's modulus of the sealing layers.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: October 4, 2022
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yuko Nakamata
  • Publication number: 20220310466
    Abstract: A semiconductor device in which even when cracks occur in a sealing material, the entry of moisture through the cracks can be prevented. A semiconductor device comprising a semiconductor element 11 mounted on a laminated substrate 12 and an electrically conductive connecting member, and a sealing material which seals the semiconductor element and the electrically conductive connecting member, wherein the sealing material includes a sealing layer 20 sealing members to be sealed including the laminated substrate 12, the semiconductor element 11, and the electrically conductive connecting member and including a thermosetting resin, and a protective layer 21 coating the sealing layer and including a silicone rubber, and wherein a value A1 of a tensile strength × elongation at break of the sealing layer 20 is less than a value A2 of a tensile strength × elongation at break of the protective layer 21, and the A2 is 1600 MPa or less.
    Type: Application
    Filed: February 1, 2022
    Publication date: September 29, 2022
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Yuko NAKAMATA
  • Publication number: 20210296190
    Abstract: A semiconductor device in which a semiconductor element mounted on a laminate substrate and an electrically conductive connection member are sealed with a sealing material, includes: a primer layer in an interface between the sealing material and sealed members including the laminate substrate, the semiconductor element, and the electrically conductive connection member, in which the sealing material includes a first sealing layer which is provided in contact with the primer layer; and a second sealing layer which covers the first sealing layer, the semiconductor device satisfies ?p??1>?2 in which ?p, ?1, and ?2 represent coefficients of linear thermal expansion of the primer layer, the first sealing layer, and the second sealing layer, respectively, ?c?15×10?6/° C. in which ?c represents a composite coefficient of linear thermal expansion of the sealing layers, and Ec?5 GPa or more in which Ec represents a composite Young's modulus of the sealing layers.
    Type: Application
    Filed: January 26, 2021
    Publication date: September 23, 2021
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Yuko NAKAMATA
  • Patent number: 10685903
    Abstract: A semiconductor device, including: a semiconductor module including a layered substrate on which a semiconductor element is mounted, and a sealing material; and a cooler provided on the semiconductor module via a thermal compound. The thermal compound includes a base oil, microfillers having a ceramic as a main component, and nanofillers having a resin as a main component.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: June 16, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yuko Nakamata
  • Patent number: 10597526
    Abstract: A resin composition is disclosed that includes a thermosetting base resin; a curing agent; an inorganic filler; and at least one fluorine resin powder selected from polyvinylidene fluoride, polychlorotrifluoroethylene, and a tetrafluoroethylene/perfluoro(alkyl vinyl ether)/chlorotrifluoroethylene copolymer, and a semiconductor device which is fabricated by being sealed using a sealant formed of the resin composition.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: March 24, 2020
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Yuko Nakamata, Yuji Ichimura
  • Publication number: 20190326196
    Abstract: A semiconductor device, including: a semiconductor module including a layered substrate on which a semiconductor element is mounted, and a sealing material; and a cooler provided on the semiconductor module via a thermal compound. The thermal compound includes a base oil, microfillers having a ceramic as a main component, and nanofillers having a resin as a main component.
    Type: Application
    Filed: March 7, 2019
    Publication date: October 24, 2019
    Applicant: Fuji Electric Co., Ltd.
    Inventor: Yuko NAKAMATA
  • Patent number: 10106683
    Abstract: A resin composite includes a maleimide resin powder and a resin having a glass transition point that is lower that the glass transition point of the maleimide resin. The resin having a glass transition point that is lower than that of the maleimide resin may be an epoxy resin. Then, the resin composite may be cured at the curing temperature of the epoxy resin. The maleimide resin powder is mixed in an amount ranging from 50 weight % to 80 weight % with respect to the epoxy resin.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: October 23, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yuko Nakamata, Yuji Ichimura
  • Patent number: 10077385
    Abstract: A resin composition has a high glass transition temperature and is highly adhesive to a member made of metal, ceramics, or the like. The resin composition includes a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler, a cured resin product formed by curing the resin composition, and an electrical member.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: September 18, 2018
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Kotomi Suzuki, Yuji Ichimura, Yuko Nakamata
  • Publication number: 20170275453
    Abstract: A resin composition is disclosed that includes a thermosetting base resin; a curing agent; an inorganic filler; and at least one fluorine resin powder selected from polyvinylidene fluoride, polychlorotetrafluoroethylene, and a tetrafluoroethylene/perfluoro(alkyl vinyl ether)/chlorotrifluoroethylene copolymer, and a semiconductor device which is fabricated by being sealed using a sealant formed of the resin composition.
    Type: Application
    Filed: February 28, 2017
    Publication date: September 28, 2017
    Applicant: Fuji Electric Co., Ltd.
    Inventors: Yuko Nakamata, Yuji Ichimura
  • Publication number: 20170240744
    Abstract: A resin composite includes a maleimide resin powder and a resin having a glass transition point that is lower that the glass transition point of the maleimide resin. The resin having a glass transition point that is lower than that of the maleimide resin may be an epoxy resin. Then, the resin composite may be cured at the curing temperature of the epoxy resin. The maleimide resin powder is mixed in an amount ranging from 50 weight % to 80 weight % with respect to the epoxy resin.
    Type: Application
    Filed: January 3, 2017
    Publication date: August 24, 2017
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yuko NAKAMATA, Yuji ICHIMURA
  • Publication number: 20170233620
    Abstract: A resin composition has a high glass transition temperature and is highly adhesive to a member made of metal, ceramics, or the like. The resin composition includes a thermosetting base resin, a thermoplastic resin powder, a curing agent, and an inorganic filler, a cured resin product formed by curing the resin composition, and an electrical member.
    Type: Application
    Filed: January 20, 2017
    Publication date: August 17, 2017
    Applicant: Fuji Electric Co., Ltd.
    Inventors: Kotomi Suzuki, Yuji Ichimura, Yuko Nakamata
  • Publication number: 20160211201
    Abstract: Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and having a wiring pattern, and a leadframe connected to the wiring pattern, the semiconductor chip, the wiring pattern and the leadframe being partially sealed with a sealing resin, wherein: an epoxy resin composition formed by adding 0.3 to 0.7 mass % of epoxysilane as a silane coupling agent to an epoxy resin is used as the sealing resin; and a copper member made of copper or a copper alloy and having an oxide film formed in the surface with a film thickness in a color indicated by an L* value in the range of 48 to 51, an a* value in the range of 40 to 49 and a b* value in the range of 24 to 40 is used as the leadframe and the wiring pattern.
    Type: Application
    Filed: March 28, 2016
    Publication date: July 21, 2016
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yuko NAKAMATA, Yuji ICHIMURA, Kei YAMAGUCHI
  • Patent number: 9355943
    Abstract: Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and having a wiring pattern, and a leadframe connected to the wiring pattern, the semiconductor chip, the wiring pattern and the leadframe being partially sealed with a sealing resin, wherein: an epoxy resin composition formed by adding 0.3 to 0.7 mass % of epoxysilane as a silane coupling agent to an epoxy resin is used as the sealing resin; and a copper member made of copper or a copper alloy and having an oxide film formed in the surface with a film thickness in a color indicated by an L* value in the range of 48 to 51, an a* value in the range of 40 to 49 and a b* value in the range of 24 to 40 is used as the leadframe and the wiring pattern.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: May 31, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yuko Nakamata, Yuji Ichimura, Kei Yamaguchi
  • Patent number: 9105292
    Abstract: A magnetic recording medium and related method of manufacturing a magnetic recording medium that has a protective layer for the magnetic recording medium and that exhibits excellent corrosion resistance in the protective layer. The magnetic recording medium includes on a nonmagnetic substrate a magnetic layer and a protective layer formed on the magnetic layer. The protective layer is formed of a lower layer in contact with the magnetic layer and an upper layer formed on the lower layer. The material used in the lower layer is a metal having a standard electrode potential of ?0.8 to 0.3 V.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: August 11, 2015
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yuko Nakamata
  • Patent number: 8847219
    Abstract: A color conversion film that absorbs light from an organic electroluminescent part emitting blue-green light and converts the light to visible light at a longer wavelength. The color conversion film includes two different dyes. A first dye is a polymer dye with an average molecular weight of 1000 to 1,000,000 that absorbs light incident on the color conversion film and transfers the energy of the light to a second dye. The second dye is a dye that receives the energy from the first dye and emits light. With a multicolor-emitting, organic electroluminescent device including the color conversion film, it is possible to achieve excellent conversion efficiency without increasing the thickness of the color conversion film as in a conventional device using a binder resin. Such an organic electroluminescent device may include as well a pair of electrodes at least one of which is a transparent electrode, and an organic electroluminescent layer sandwiched between the electrodes.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: September 30, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Toshio Hama, Masaru Nagai, Chong Li, Koji Kawaguchi, Yuko Nakamata, Naoyuki Kanai
  • Publication number: 20140210060
    Abstract: Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and having a wiring pattern, and a leadframe connected to the wiring pattern, the semiconductor chip, the wiring pattern and the leadframe being partially sealed with a sealing resin, wherein: an epoxy resin composition formed by adding 0.3 to 0.7 mass % of epoxysilane as a silane coupling agent to an epoxy resin is used as the sealing resin; and a copper member made of copper or a copper alloy and having an oxide film formed in the surface with a film thickness in a color indicated by an L* value in the range of 48 to 51, an a* value in the range of 40 to 49 and a b* value in the range of 24 to 40 is used as the leadframe and the wiring pattern.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 31, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yuko NAKAMATA, Yuji ICHIMURA, Kei YAMAGUCHI
  • Publication number: 20140014941
    Abstract: A color conversion film that absorbs light from an organic electroluminescent part emitting blue-green light and converts the light to visible light at a longer wavelength. The color conversion film includes two different dyes. A first dye is a polymer dye with an average molecular weight of 1000 to 1,000,000 that absorbs light incident on the color conversion film and transfers the energy of the light to a second dye. The second dye is a dye that receives the energy from the first dye and emits light. With a multicolor-emitting, organic electroluminescent device including the color conversion film, it is possible to achieve excellent conversion efficiency without increasing the thickness of the color conversion film as in a conventional device using a binder resin. Such an organic electroluminescent device may include as well a pair of electrodes at least one of which is a transparent electrode, and an organic electroluminescent layer sandwiched between the electrodes.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 16, 2014
    Applicant: SHARP KABUSHIKI KAISA
    Inventors: Toshio HAMA, Masaru NAGAI, Chong LI, Koji KAWAGUCHI, Yuko NAKAMATA, Naoyuki KANAI
  • Publication number: 20130337290
    Abstract: A magnetic recording medium and related method of manufacturing a magnetic recording medium that has a protective layer for the magnetic recording medium and that exhibits excellent corrosion resistance in the protective layer. The magnetic recording medium includes on a nonmagnetic substrate a magnetic layer and a protective layer formed on the magnetic layer. The protective layer is formed of a lower layer in contact with the magnetic layer and an upper layer formed on the lower layer. The material used in the lower layer is a metal having a standard electrode potential of ?0.8 to 0.3 V.
    Type: Application
    Filed: April 9, 2013
    Publication date: December 19, 2013
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Yuko NAKAMATA
  • Patent number: 8541777
    Abstract: A color conversion film is disclosed that absorbs light from an organic electroluminescent part emitting blue-green light and converts the light to visible light at a longer wavelength. The color conversion film includes two different dyes. A first dye is a polymer dye with an average molecular weight of 1000 to 1,000,000 that absorbs light incident on the color conversion film and transfers the energy of the light to a second dye. The second dye is a dye that receives the energy from the first dye and emits light. With a multicolor-emitting, organic electroluminescent device including the color conversion film, it is possible to achieve excellent conversion efficiency without increasing the thickness of the color conversion film as in a conventional device using a binder resin.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: September 24, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Toshio Hama, Masaru Nagai, Chong Li, Koji Kawaguchi, Yuko Nakamata, Naoyuki Kanai
  • Patent number: 8520331
    Abstract: A method for manufacturing a color filter includes obtaining a color filter, treating the color filter with oxygen plasma, treating the color filter with fluorine plasma and forming one or more color conversion layers. The color filter is obtained by forming on a transparent substrate, multiple color filter layers having respective colors, and banks. The color filter layers are composed of polysiloxane and pigments. The banks are composed of resin and formed at boundaries between color filter layers of different colors. The color conversion layers have respective colors and are formed on the color filter layers by an inkjet method.
    Type: Grant
    Filed: February 16, 2009
    Date of Patent: August 27, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Yuko Nakamata