Abstract: Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer. The first substrate includes a first metalized layer. The second substrate includes a second metalized layer which faces the first metalized layer. The thermoelectric element includes a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer. The bonding layer is composed of a sintered body of a metallic material of which the average crystal particle diameter is no greater than 20 ?m and bonds the first metalized layer and the second metalized layer with the thermoelectric element.

Abstract: A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.

Abstract: A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.

Abstract: Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer. The first substrate includes a first metalized layer. The second substrate includes a second metalized layer which faces the first metalized layer. The thermoelectric element includes a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer. The bonding layer is composed of a sintered body of a metallic material of which the average crystal particle diameter is no greater than 20 ?m and bonds the first metalized layer and the second metalized layer with the thermoelectric element.

Abstract: A heat exchange unit is constituted of a thermoelectric module and a heat exchanger. The thermoelectric module includes an upper electrode, a lower electrode, and a plurality of thermoelectric elements interposed between the upper electrode and the lower electrode, wherein the heat exchanger composed of aluminum or aluminum alloy having high thermal conductivity is attached to the upper electrode and/or the lower electrode via an insulating layer. The surface roughness of the heat exchanger adjoined to the insulating layer is controlled to be less than 4.7 ?m and greater than 0.1 ?m. This prevents cracks and fractures from being formed in the insulating layer, which is thus improved in adhesion with the heat exchanger. Thus, it is possible to demonstrate high heat-absorption/dissipation performance and high reliability in the heat exchange unit due to a reduced thermal resistance between the thermoelectric module and the heat exchanger.

Abstract: A thermoelectric module device absorbs heat from the hot side, and transfers the heat to the cold side; the thermoelectric module device is constituted by a heat sink on the hot side, another heat sink on the cold side and a series of Peltier elements, and the series of Peltier elements is formed from pairs of semiconductor elements of different conductivity types, endoergic metal electrodes and exoergic metal electrodes; since the entire major surfaces of heat sinks are not available for the endoergic metal electrodes and exoergic metal electrodes due to fitting holes and vapor-proof sealing walls, the ratio of area occupied with the metal electrodes to available area and the ratio of area not available for the metal electrodes to entire major surface are not less than 50% and not greater than 20%.

Abstract: A heat exchange device includes a heat exchanger disposed in connection with at least one of a heat-dissipation electrode and a heat-absorption electrode, between which a plurality of thermoelectric elements is connected in series, via an insulating resin layer, which is composed of an epoxy resin or polyimide resin doped with fillers having high thermal conductivity, without intervention of a substrate. The heat exchanger corresponds to a plurality of corrugated fins which are constituted of a plurality of joint regions joining with one of the heat-dissipation electrode and heat-absorption electrode and a plurality of non-joint regions projecting externally from a plurality of gaps formed between the joint regions adjacently aligned together, wherein the joint regions and non-joint regions are alternately aligned. Thus, it is possible to achieve high reliability by reducing thermal resistance and thermal stress while increasing the maximum heat absorption coefficient (Qmax).

Abstract: An artificial inner ear includes a speech processor that operates based on electricity generated by a thermoelectric transducer module, in which numerous thermoelectric elements join between oppositely arranged upper and lower substrates each having numerous electrodes. A heat absorption layer composed of a heat conductive material such as a resin, rubber, and metal is attached to the upper substrate of the thermoelectric transducer module. The heat absorption layer has deformability in shape in conformity with a prescribed part of the human body and is heated using human body temperature so as to cause a temperature difference between the upper and lower substrates, thus generating electricity in the thermoelectric transducer module. A heat-dissipation member composed of aluminum can be attached to the lower substrate so as to increase the temperature difference.

Abstract: To obtain a thermoelectric module substrate of which reliability such as stress relaxation is improved without damaging the performance as a thermoelectric module such as heat conductivity to provide a thermoelectric module excellent in reliability by using such a substrate. Thermoelectric module substrates of the present invention each comprises a synthetic resin layer including fillers having good thermal conductivity; and a copper-metalized layer or layers, or a copper layer at least including copper plate or copper layers which is or are formed on one face or both faces of the synthetic resin layer. Further, in the case where contents volume percentage of fillers within the synthetic resin layer is expressed as A (%), the thickness of the synthetic resin layer is expressed as B (?m) and the total thickness of the copper layer is expressed as C (?m), the thermoelectric module substrate is formed so as to have the relation expressed as (C/4)?B?65, A/B?3.5, A>0, C>50 and B?7.

Abstract: An illumination system includes an illumination unit and a thermoelectric conversion module. The illumination unit includes a light source, and a reflection plate capable of radiating heat from the light source to the outer circumference of the plate. The thermoelectric conversion module includes lower and upper substrates, lower and upper electrodes provided on the facing surfaces of the lower and upper substrates, and thermoelectric elements disposed between the lower and upper electrodes. The lower substrate of the thermoelectric conversion module is fixed to the reflection plate via a heat transfer member. The upper substrate of the thermoelectric conversion module is connected via a heat releasing path member to a support member (heat absorber) having a thermal conductivity higher than that of air.

Abstract: A method of forming thermoelectric elements includes introducing a molten thermoelectric-material in a plurality of holes of a mold, and solidifying the molten thermoelectric-material in the plurality of holes, thereby forming a plurality of thermoelectric elements in the plurality of holes without wafer-slicing process or chip-dicing process.

Abstract: A thermoelectric conversion unit can easily be attached to and detached from a heater, in which lower electrodes are formed on the upper surface of a lower substrate, placed in opposition to an upper substrate, on the lower surface of which are formed upper electrodes; end faces of thermoelectric elements are bonded to both the electrodes to form a thermoelectric conversion module. A heat-absorbing member having a protruding engagement portion is installed on one of the substrates of the thermoelectric conversion module, and a heat-releasing member is installed on the other substrate, to form a thermoelectric conversion portion. A heat-conducting portion having a engagement hole portion is installed on the outer peripheral surface of a lamp, to form the light-source lamp portion. By engaging the protruding engagement portion with the engagement hole portion, the light-source lamp portion can be detachably attached to the thermoelectric conversion portion.

Abstract: A thermoelectric module comprises a plurality of thermoelectric elements which are arranged between a pair of substrates having electrode patterns and which are bonded with the electrode patterns via solder in which at least one dispersion phase is dispersed into a matrix phase, wherein the melting temperature of the dispersion phase is higher than that of the matrix phase (i.e., 240° C. or over), and the dispersion phase comprises fine particles whose average diameter is 5 ?m or less. The solder is constituted by an alloy so as to realize a volume ratio of 40% or less, wherein it is composed of a Bi—Cu—X alloy or a Bi—Zn—X alloy (where ‘X’ represents at least one element selected in advance). Preferably, the solder is constituted by powder containing fine particles whose average diameter is 100 ?m or less or thin plates whose average thickness is 500 ?m or less.

Abstract: An artificial inner ear includes a speech processor that operates based on electricity generated by a thermoelectric transducer module, in which numerous thermoelectric elements join between oppositely arranged upper and lower substrates each having numerous electrodes. A heat absorption layer composed of a heat conductive material such as a resin, rubber, and metal is attached to the upper substrate of the thermoelectric transducer module. The heat absorption layer has deformability in shape in conformity with a prescribed part of the human body and is heated using human body temperature so as to cause a temperature difference between the upper and lower substrates, thus generating electricity in the thermoelectric transducer module. A heat-dissipation member composed of aluminum can be attached to the lower substrate so as to increase the temperature difference.

Abstract: Thermoelectric material is produced through a process sequence including a liquid quenching, a primary solidification such as a hot pressing or extrusion and an upset forging; although the C-planes of the crystal grains are directed in parallel to the direction in which the force is exerted on flakes during the hot pressing/extrusion, the a-axes are randomly directed; the a-axes are oriented in a predetermined direction through the upset forging; this results in improvement of electric resistivity without reduction in the figure of merit.

Abstract: Thermoelectric material is produced through a process sequence including a liquid quenching, a primary solidification such as a hot pressing or extrusion and an upset forging; although the C-planes of the crystal grains are directed in parallel to the direction in which the force is exerted on flakes during the hot pressing/extrusion, the a-axes are randomly directed; the a-axes are oriented in a predetermined direction through the upset forging; this results in improvement of electric resistivity without reduction in the figure of merit.

Abstract: A thermoelectric generator (e.g., a waste heat recovery apparatus) comprises a heat absorption member made of touch pitch copper and a thermoelectric module in which a plurality of thermoelectric elements are arranged to join electrodes between a pair of insulating substrates, thus utilizing waste heat emitted from a lamp having an exterior wall. One surface of the heat absorption member is formed to match the exterior wall of the lamp, and the other surface is formed to match the thermoelectric module, which is accompanied with a heat dissipating fin, which is further cooled by a cooling fan. At least a part of the heat absorption member can be arranged close to a light emitting tube of the lamp. The thermoelectric module generates electricity based on the heat transferred thereto from the lamp via the heat absorption member.

Abstract: Thermoelectric material of (Bi, Sb)(Te, Se) system is produced through a liquid quenching method and an extrusion from a die unit having an inlet portion and an outlet portion crossing each other at 30-150 degrees so that the crystal grains have an average grain size equal to or less than 30 microns and (001) planes mostly oriented in parallel to a direction in which electric current to flow, thereby achieving the figure of merit equal to or greater than 3.0×10−3/K.

Abstract: Thermoelectric material is produced through a process sequence including a liquid quenching, a primary solidification such as a hot pressing or extrusion and an upset forging; although the C-planes of the crystal grains are directed in parallel to the direction in which the force is exerted on flakes during the hot pressing/extrusion, the a-axes are randomly directed; the a-axes are oriented in a predetermined direction through the upset forging; this results in improvement of electric resistivity without reduction in the figure of merit.

Abstract: Thermoelectric material of (Bi, Sb)(Te, Se) system is produced through a liquid quenching method and an extrusion from a die unit having an inlet portion and an outlet portion crossing each other at 30-150 degrees so that the crystal grains have an average grain size equal to or less than 30 microns and (001) planes mostly oriented in parallel to a direction in which electric current to flow, thereby achieving the figure of merit equal to or greater than 3.0×10−3/K.