Patents by Inventor Yun-seok Choi

Yun-seok Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210102781
    Abstract: The present invention relates to a point-of-impact analysis apparatus for improving the accuracy of a ballistic trajectory and a point of impact by applying a shooting environment of a real personal firearm to virtual reality, and a virtual shooting training simulation system using same, the point-of-impact analysis apparatus including: a gun analysis module for generating gun information on a gun structure of a virtual gun which is a model possessed by a user in a real space; a bullet analysis module for generating bullet information on a structure of a bullet applied to the virtual gun; an environment analysis module for detecting an environmental state of a shooting training content output on a screen so as to generate environmental information on the environmental state; and a point-of-impact generation module for generating point-of-impact information related to a position, at which the bullet impacts a target displayed on the screen, by making reference to at least one piece of information among the gun
    Type: Application
    Filed: November 26, 2018
    Publication date: April 8, 2021
    Inventors: Byoung Hwak LEE, Suk Bong PARK, Won Woo LEE, Dong Wook KIM, Kyu Yong SHIN, Ju Hee KIM, Young Jun PARK, Hyun Ho CHOI, Jong Hwan KIM, Won Seok KANG, Yun Ki GWAK, Hong Cheol CHOI, Nam Hyuk KIM
  • Publication number: 20210086137
    Abstract: Provided is a separation membrane leaf and a spiral wound module and an apparatus including the same, the separation membrane leaf comprising a separator, a supply-side flow channel material, and a permeation-side flow channel material comprising a tricot, the tricot comprising an adhesive part, and at least a part of the adhesive part being a low density part of the tricot, compared to the rest, wherein the tricot comprises at least one wale, at least one course, and an intersection point at which the at least one wale and the at least one course intersect, and the average distance between two intersection points arranged in parallel in the direction in which the wale of the low-density part is arranged is at least 1.25 times the average distance between two intersection points arranged in parallel in the direction in which the wale of the part other than the low-density part is arranged.
    Type: Application
    Filed: July 24, 2019
    Publication date: March 25, 2021
    Inventors: Phill LEE, Yun Seok CHOE, Gwang Hun CHOI, Soo Hyun KIM, Dong Hyeok SHIN
  • Patent number: 10949546
    Abstract: A security device includes a secure processor, a mail box, a cryptographic intellectual property (IP), a secure direct memory access (DMA) circuit, and an internal memory. The secure processor provides an isolated execution environment. The mail box transfers a request from a CPU to the secure processor. The cryptographic IP performs one or more secure operations, including a signature certification operation, an encryption/decryption operation, and an integrity verification operation, on secure data within the isolated execution environment and without intervention of the CPU. The secure DMA circuit controls the one or more secure operations within the isolated execution environment, wherein only the secure processor is configured to control the secure DMA circuit. The internal memory stores the secure data on which the one or more secure operations are performed. The cryptographic IP includes a DMA circuit configured to control data access to an external storage.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Jin Chung, Jae-Chul Park, Ki-Seok Bae, Jong-Hoon Shin, Yun-Ho Youm, Hye-Soo Lee, Hong-Mook Choi, Jin-Su Hyun
  • Publication number: 20210072791
    Abstract: A display device is provided.
    Type: Application
    Filed: November 16, 2020
    Publication date: March 11, 2021
    Inventors: Jae Young YU, Yong Gi KO, Bon Joo KOO, Yun Ha KIM, Jae Chun PARK, Nam Seok BAIK, Mikiya ITAKURA, Hyoung Jin LEE, Dae Guen CHOI, Sung Chul CHOI
  • Publication number: 20210050326
    Abstract: Disclosed is a semiconductor package comprising a first semiconductor chip, a second semiconductor chip on a first surface of the first semiconductor chip, and a plurality of conductive pillars on the first surface of the first semiconductor chip and adjacent to at least one side of the second semiconductor chip. The first semiconductor chip includes a first circuit layer adjacent to the first surface of the first semiconductor chip. The second semiconductor chip and the plurality of conductive pillars are connected to the first surface of the first semiconductor chip.
    Type: Application
    Filed: April 6, 2020
    Publication date: February 18, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Yun Seok CHOI
  • Publication number: 20200395346
    Abstract: A semiconductor package includes a substrate and an interposer disposed on the substrate. The interposer comprises a first surface facing the substrate and a second surface facing away from the substrate. A first logic semiconductor chip is disposed on the first surface of the interposer and is spaced apart from the substrate in a first direction orthogonal to an upper surface of the substrate. A first memory package is disposed on the second surface of the interposer. A second memory package is disposed on the second surface of the interposer and is spaced apart from the first memory package in a second direction that is parallel to the upper surface of the substrate. A first heat transfer unit is disposed on a surface of the substrate facing the first logic semiconductor chip. The first heat transfer unit is spaced apart from the first logic semiconductor chip in the first direction.
    Type: Application
    Filed: January 21, 2020
    Publication date: December 17, 2020
    Inventors: Yang Gyoo JUNG, Chul Woo KIM, Hyo-Chang RYU, Seung-Kwan RYU, Yun Seok CHOI
  • Publication number: 20200369156
    Abstract: A braking control system for a vehicle is provided. The system includes a motor providing rotational force to wheels of the vehicle and a first battery storing electric energy for driving the motor. An inverter is connected to the first battery via a DC link terminal and performs a bidirectional power conversion between the DC link terminal and the motor. A DC converter is connected to the DC link terminal to down-convert a voltage of the DC link terminal and output the down-converted voltage. A second battery is supplied with the voltage converted by the DC converter and has a voltage lower than that of the first battery. A controller operates the inverter and the DC converter to charge regenerative braking energy generated from the motor during braking of the vehicle in the first battery and the second battery.
    Type: Application
    Filed: October 1, 2019
    Publication date: November 26, 2020
    Inventors: Hyo Sik Moon, Jae Hoon Choi, Hee Sung Moon, Yun Ho Kim, Sung Keun Song, Kyung In Min, Yu Seok Kim
  • Publication number: 20200373624
    Abstract: In manufacturing an all-solid-state battery, a cell assembly is pressurized rather than pressurizing each cell unit, and the structure of the battery is simplified by using a reduced number of first electrode current collectors and second electrode current collectors. In particular, the all-solid-state battery includes: first units each including a first electrode current collector and a first electrode active material layer provided on each of opposite surfaces of the first electrode current collector; second units each including a second electrode current collector and a second electrode active material layer provided on each of opposite surfaces of the second electrode current collector; and a solid electrolyte layer disposed between a corresponding first unit and a corresponding second unit.
    Type: Application
    Filed: October 11, 2019
    Publication date: November 26, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Yong Seok CHOI, Jae Min LIM, Soon Chul BYUN, In Woo SONG, Yun Sung KIM
  • Patent number: 10838457
    Abstract: A display device is provided.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: November 17, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jae Young Yu, Yong Gi Ko, Bon Joo Koo, Yun Ha Kim, Jae Chun Park, Nam Seok Baik, Mikiya Itakura, Hyoung Jin Lee, Dae Guen Choi, Sung Chul Choi
  • Publication number: 20200350611
    Abstract: Disclosed are an all-solid-state battery having high energy density and a method for manufacturing the same. One battery structure is pressed instead of pressing each cell unit, an amount of first or second electrode current collectors consumed is reduced, and insulating members are used, thereby simplifying a manufacturing process of the all-solid-state battery and allowing the all-solid-state battery to have high energy density and a stable structure.
    Type: Application
    Filed: December 5, 2019
    Publication date: November 5, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Yong Seok CHOI, Hong Seok MIN, Soon Chul BYUN, Yun Sung KIM, Yong Gu KIM, Jae Min LIM
  • Publication number: 20200335480
    Abstract: A semiconductor package includes: a first thermal pillar disposed on a package substrate, and having an opening; a first chip stack disposed on the package substrate and in the opening of the first thermal pillar, and including a first lateral surface; a semiconductor chip disposed on the package substrate and in the opening, wherein the semiconductor chip is spaced apart from the first chip stack; and a first heat transfer film disposed between the first thermal pillar and the first lateral surface of the first chip stack.
    Type: Application
    Filed: December 23, 2019
    Publication date: October 22, 2020
    Inventors: HEEJUNG HWANG, JAE CHOON KIM, YUN SEOK CHOI
  • Publication number: 20200312826
    Abstract: A semiconductor package may include a package substrate, a first interposer substrate mounted on the package substrate, and a first semiconductor chip disposed on the first interposer substrate. The first interposer substrate may include a first base layer, a second base layer disposed on the first base layer, circuit patterns provided in each of the first base layer and the second base layer, and an integrated device embedded in the first base layer and connected to at least one of the circuit patterns. A top surface of the first base layer may contact a bottom surface of the second base layer.
    Type: Application
    Filed: September 25, 2019
    Publication date: October 1, 2020
    Inventors: YANGGYOO JUNG, CHULWOO KIM, HYO-CHANG RYU, YUN SEOK CHOI
  • Publication number: 20200312760
    Abstract: An interposer includes: a base substrate; an interconnection structure on a top surface of the base substrate and including a metal interconnection pattern; an upper passivation layer on the interconnection structure and having compressive stress; a lower passivation layer under a bottom surface of base substrate, the lower passivation layer having compressive stress that is less than the compressive stress of the upper passivation layer; a lower conductive layer under the lower passivation layer; and a through electrode penetrating the base substrate and the lower passivation layer. The through electrode electrically connects the lower conductive layer to the metal interconnection pattern of the interconnection structure.
    Type: Application
    Filed: September 6, 2019
    Publication date: October 1, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yu-Kyung PARK, Seung-kwan RYU, Min-seung YOON, Yun-seok CHOI
  • Publication number: 20200312755
    Abstract: A semiconductor package includes a package substrate, an interposer on the package substrate, and a first semiconductor device and a second semiconductor device on the interposer, the first and second semiconductor devices connected to each other by the interposer, wherein at least one of the first semiconductor device and the second semiconductor device includes an overhang portion protruding from a sidewall of the interposer.
    Type: Application
    Filed: August 1, 2019
    Publication date: October 1, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Yun-Seok CHOI
  • Publication number: 20200290934
    Abstract: Provided are an additive composition for a tile cement mortar and a tile cement mortar including the additive composition for a tile cement mortar. The provided additive composition for a tile cement mortar includes cellulose ether and urea, wherein the amount of the urea is from 5 parts by weight to 43 parts by weight based on 100 parts by weight of the cellulose ether.
    Type: Application
    Filed: March 23, 2018
    Publication date: September 17, 2020
    Applicant: LOTTE FINE CHEMICAL CO., LTD.
    Inventors: Yun Na Kim, Nak Woon Choi, Bong Jin Kwon, Min Seok Kang, Hyun Ji Jeong
  • Patent number: D895863
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 8, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Da Young Jeong, Jae Min Choi, Oh Young Kwon, Yu Ra Cha, Yun Seok Oh, Hyeong Seon Kim
  • Patent number: D895864
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 8, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Da Young Jeong, Yu Ra Cha, Yun Seok Oh, Oh Young Kwon, Hyeong Seon Kim, Jae Min Choi
  • Patent number: D895865
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 8, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Yu Ra Cha, Da Young Jeong, Yun Seok Oh, Hyeong Seon Kim, Oh Young Kwon, Jae Min Choi
  • Patent number: D895866
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 8, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Da Young Jeong, Yu Ra Cha, Yun Seok Oh, Hyeong Seon Kim, Oh Young Kwon, Jae Min Choi
  • Patent number: D895867
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 8, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Da Young Jeong, Yu Ra Cha, Yun Seok Oh, Oh Young Kwon, Hyeong Seon Kim, Jae Min Choi