Patents by Inventor Yun-seok Choi

Yun-seok Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10444948
    Abstract: Provided is a method of displaying web pages, performed by an electronic apparatus including a display displaying a first web page in a display region. The method includes receiving, from a user, an input for selecting a first link included in the first web page; and splitting the display region into a plurality of section regions, displaying the first web page in a first section region from among the plurality of section regions, and displaying a second web page corresponding to the first link in a second section region different from the first section region.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: October 15, 2019
    Assignee: NAVER Corporation
    Inventors: Hyo Kim, Min Chul Jeong, Myeong Jin Cho, Ji Ho Choi, Yun Seok Lee
  • Publication number: 20190312211
    Abstract: The present application relates to a hetero-cyclic compound represented by Chemical Formula 1, and an organic light emitting device comprising the same.
    Type: Application
    Filed: July 11, 2017
    Publication date: October 10, 2019
    Applicant: HEESUNG MATERIAL LTD.
    Inventors: Yun-Ji LEE, Jun-Tae MO, Yong-Geun JUNG, Won-Jang JEONG, Jin-Seok CHOI, Dae-Hyuk CHOI, Joo-Dong LEE
  • Publication number: 20190308745
    Abstract: The present invention provides a method of controlling an unmanned aerial vehicle by a system for controlling a mission of the unmanned aerial vehicle on the basis of a user position. Herein the method includes acquiring information related to a position of the terminal; performing authentication for the unmanned aerial vehicle on the basis of the information related to the position of the terminal; and, when the authentication is completed, transmitting the information related to the position of the terminal to the unmanned aerial vehicle.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 10, 2019
    Applicant: Electronics and Telecommunications Research Instit ute
    Inventors: Myung Seok KI, Sang Hyouk CHOI, Yun Su BOK, Ji Hwan SON, Jeong Hwan LEE, Ji Hun CHA, Jae Young AHN
  • Patent number: 10424571
    Abstract: An electronic device package includes a package substrate, an interposer located above the package substrate and electrically connected to the package substrate, a processing device located above the interposer and electrically connected to the interposer, at least one high bandwidth memory device located above the interposer and electrically connected to the interposer and the processing device, a power management integrated circuit device located above the interposer and electrically connected to the interposer and the processing device, and a passive device located on or inside the interposer and electrically connected to the power management integrated circuit device.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: September 24, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ju-Youn Choi, Eun-Seok Song, Seung-Yong Cha, Yun-Hee Lee
  • Patent number: 10414451
    Abstract: An air passage type wheel deflector applied to a vehicle may include a deflector body 10 fastened to the floor panel by screws 40 and mounted at the rear wheel 120 side, an air duct 20 forming an air passage 20-1 for forcing the air introduced externally to flow downward and discharge in a state of being covered by the deflector body 10 coupled to the air duct, and a plurality of ribs 30 disposed in the deflector body 10 at a certain rib spacing and positioned in the space of the air passage 20-1 so that robustness against strike by chipping is maintained and at the same time aerodynamic performance is improved resulting from improvement of the kick-up function by the air passage 20-1.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: September 17, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Cheol-O Kim, Jae-Young Kang, Hyun-Seok Jung, Jeong-Ho Lee, Ho-Jeong Choi, Jun-Young Ahn, Hyun-Ah Kim, Byung-Hoon Kang, Yun-Woo Chung
  • Publication number: 20190263834
    Abstract: The present application relates to a hetero-cyclic compound represented by Chemical Formula 1, and an organic light emitting device comprising the same.
    Type: Application
    Filed: November 24, 2017
    Publication date: August 29, 2019
    Applicant: HEESUNG MATERIAL LTD.
    Inventors: Won-Jang JEONG, Yun-Ji LEE, Gi-Back LEE, Jin-Seok CHOI, Dae-Hyuk CHOI, Joo-Dong LEE
  • Patent number: 10381577
    Abstract: The present application provides a hetero-cyclic compound which may significantly improve the lifetime, efficiency, electrochemical stability, and thermal stability of an organic light emitting device, and an organic light emitting device in which the hetero-cyclic compound is contained in an organic compound layer.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: August 13, 2019
    Assignee: HEESUNG MATERIAL LTD.
    Inventors: Geon-Yu Park, Han-Kook Oh, Yun-Ji Lee, Jae-Yeol Ma, Dong-Jun Kim, Jin-Seok Choi, Dae-Hyuk Choi, Joo-Dong Lee
  • Patent number: 10340158
    Abstract: Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: July 2, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-Seok Lee, Chang-Gil Ryu, Geun-Young Song, Jae-Chang Lee, Yun-Seok Choi, Jin-Suk Hong
  • Publication number: 20190164942
    Abstract: A semiconductor package includes upper and lower semiconductor chip packages, and a redistribution wiring layer pattern interposed between the packages. The lower package includes a molding layer in which at least one chip is embedded, and has a top surface and an inclined sidewall surface along which the redistribution wiring layer pattern is formed. The upper and lower packages are electrically connected to through the redistribution wiring layer pattern. A first package may be formed by a wafer level packaging technique and may include a redistribution wiring layer as a substrate, a semiconductor chip disposed on the redistribution wiring layer, and a molding layer on which the lower package, redistribution wiring layer pattern and upper package are disposed.
    Type: Application
    Filed: December 26, 2018
    Publication date: May 30, 2019
    Inventors: SEUNG-KWAN RYU, YONGHWAN KWON, YUN SEOK CHOI, CHAJEA JO, TAEJE CHO
  • Patent number: 10295869
    Abstract: A display device is provided. The display device includes: a first substrate that comprises a first base substrate, an insulating layer located on the first base substrate, and a barrier layer located on the insulating layer; a second substrate that faces the first substrate; a liquid crystal layer that is located between the first substrate and the second substrate; and a first spacer that is located between the first substrate and the second substrate and is in contact with the first substrate, wherein the first substrate further comprises a second spacer that is located on the barrier layer and overlaps with the first spacer.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: May 21, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyun Kim, Seul Ki Kim, Seung Ha Choi, Yun Seok Han, Kap Soo Yoon, Jeong Uk Heo
  • Patent number: 10292603
    Abstract: A method of measuring blood pressure, including: sensing an atmospheric pressure, an applied pressure, and a blood pressure of a blood vessel delivered to a skin and outputting an electrical signal indicating a result of sensing the pressures; dividing the electrical signal into a divided electrical signal which includes a direct current (DC) signal and an alternating current (AC) signal; processing the divided electrical signal; calculating the applied pressure using the processed electrical signal; and calculating a blood pressure average using the calculated applied pressure and a swing value of the processed electrical signal.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: May 21, 2019
    Assignee: UMEDIX CORPORATION LIMITED
    Inventors: Sung Hun Woo, Yun Young Choi, Yun Seok Chang
  • Patent number: 10234459
    Abstract: The present invention provides compositions comprising chimeric polypeptides that bind to free ubiquitin proteins or free ubiquitin-like proteins with high affinity, as well as chimeric polypeptides that bind to both free and conjugated ubiquitin proteins or free and conjugated ubiquitin-like proteins, and methods of using the chimeric polypeptides to determine the amount of free or total ubiquitin or free or total ubiquitin-like proteins in various types of samples.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: March 19, 2019
    Assignee: COLORADO STATE UNIVERSITY RESEARCH FOUNDATION
    Inventors: Robert E. Cohen, Yun-Seok Choi
  • Patent number: 10236185
    Abstract: A method of forming patterns for a semiconductor device includes preparing a hardmask composition including a carbon allotrope, a spin-on hardmask (SOH) material, an aromatic ring-containing polymer, and a solvent, applying the hardmask composition to an etching target layer, forming a hardmask by heat-treating the applied hardmask composition, forming a photoresist pattern on the hardmask, forming a hardmask pattern by etching the hardmask using the photoresist pattern as an etching mask, and forming an etched pattern by etching the etching target layer using the hardmask pattern as an etching mask.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: March 19, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yool Kang, Kyoung-sil Park, Yun-seok Choi, Boo-deuk Kim, Ye-hwan Kim
  • Patent number: 10225495
    Abstract: A crosstalk processing module configured to process a crosstalk of an image signal includes a correction element generation unit, a storage, and a crosstalk correction check unit. The correction element generation unit receives the image signal and input information associated with at least a size of the image signal and generates seed values and correction parameters which are used to correct the crosstalk, based on the input information and a representative channel image signal obtained by separating the image signal with respect to color. The storage stores the seed values and the correction parameters. The crosstalk correction check unit receives the image signal, receives the seed values and the correction parameters from the storage, corrects the crosstalk, and outputs a final image signal and pass/fail information indicating a pass or fail of the correction of the crosstalk based on a plurality of reference values.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: March 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Da-Hee Lee, Dae-Kwan Kim, Yo-Hwan Noh, Kyung-Ho Kim, Chae-Sung Kim, Dong-Ki Min, Seong-Won Jo, Yun-Seok Choi
  • Publication number: 20190068311
    Abstract: A method and apparatus are provided for controlling a data rate in a mobile communication system. The method includes changing an offset from a first offset used in a previous packet to a second offset determined based on whether or not the previous packet is successfully received by a second apparatus; determining whether or not a second channel quality in which the second offset is applied is within a range from a minimum quality to a maximum quality; if it is determined that the second channel quality is not within the range, determining that the offset is maintained as the first offset in a current packet; and transmitting, to the second apparatus, the current packet according to a first channel quality in which the first offset is applied.
    Type: Application
    Filed: October 29, 2018
    Publication date: February 28, 2019
    Inventors: Hyo-Yol PARK, Yun-Seok CHOI
  • Patent number: 10199319
    Abstract: A printed circuit board (PCB) includes a substrate base including at least two chip attach regions spaced apart from one another, a plurality of upper pads disposed in the at least two chip attach regions of the substrate base, an accommodation cavity overlapping a part of each of the at least two chip attach regions and recessed in an upper surface of the substrate base, and at least one spacing groove recessed in the upper surface of the substrate base. The at least one spacing groove is connected to the accommodation cavity, and extends in a region between the at least two chip attach regions.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Bo Shim, Sang-Uk Han, Yun-Seok Choi, Ji-Hwang Kim
  • Patent number: 10186500
    Abstract: A semiconductor package includes upper and lower semiconductor chip packages, and a redistribution wiring layer pattern interposed between the packages. The lower package includes a molding layer in which at least one chip is embedded, and has a top surface and an inclined sidewall surface along which the redistribution wiring layer pattern is formed. The upper and lower packages are electrically connected to through the redistribution wiring layer pattern. A first package may be formed by a wafer level packaging technique and may include a redistribution wiring layer as a substrate, a semiconductor chip disposed on the redistribution wiring layer, and a molding layer on which the lower package, redistribution wiring layer pattern and upper package are disposed.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: January 22, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Kwan Ryu, Yonghwan Kwon, Yun Seok Choi, Chajea Jo, Taeje Cho
  • Patent number: 10163942
    Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: December 25, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ye-chung Chung, Hee-seok Lee, Yun-seok Choi, Keung-beum Kim
  • Publication number: 20180364250
    Abstract: The present invention provides compositions comprising chimeric polypeptides that bind to free ubiquitin proteins or free ubiquitin-like proteins with high affinity, as well as chimeric polypeptides that bind to both free and conjugated ubiquitin proteins or free and conjugated ubiquitin-like proteins, and methods of using the chimeric polypeptides to determine the amount of free or toal ubiquitin or free or total ubiquitin-like proteins in various types of samples.
    Type: Application
    Filed: May 11, 2018
    Publication date: December 20, 2018
    Inventors: Robert E. Cohen, Yun-Seok Choi
  • Patent number: 10132713
    Abstract: Provided herein is an active joint module, and a robot for inspecting pipelines having the active joint module, the active joint module including a frame unit; a first bracket connected to one side of the frame unit in a rotatable manner, and to which a first module is coupled; a second bracket connected to another side of the frame unit in a rotatable manner, and to which a second module is coupled; and a bracket rotating unit supported to the frame unit, and is configured to rotate the first bracket and second bracket independently from each other in response to receiving an operating signal, and to unconstrain rotation of the first bracket and second bracket in response to there being no operating signal received.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: November 20, 2018
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Hyouk Ryeol Choi, Homoon Kim, Hyeong Min Moon, Chanmin Park, Seung Ung Yang, Yun Seok Choi