Patents by Inventor Yung-Hsiang Chen

Yung-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11207289
    Abstract: A method for suppressing tumor metastasis, in which an effective amount of a compound of formula (I) is administered to a subject in need thereof. Also disclosed is a method of treating cancer, in which an effective amount of a chemotherapy agent and an effective amount of a compound of formula (I) is administered to a subject in need thereof. Further disclosed are pharmaceutical compositions for suppressing tumor metastasis and for treating cancer, each of the compositions containing a compound of formula (I).
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: December 28, 2021
    Assignee: ACADEMIA SINICA
    Inventors: Ning-Sun Yang, Yueh-Hsiung Kuo, Shu-Yi Yin, Yung-Hsiang Chen
  • Publication number: 20210388523
    Abstract: A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 16, 2021
    Inventors: Yung-Hsiang Chen, Hung-San Lu, Ting-Ying Wu, Chuang Chihchous, Yu-Lung Yeh
  • Publication number: 20210366954
    Abstract: A semiconductor device is provided. The semiconductor device includes a first deep trench isolation (DTI) structure within a substrate. The first DTI structure includes a barrier structure, a dielectric structure, and a copper structure. The dielectric structure is between the barrier structure and the copper structure. The barrier structure is between the substrate and the dielectric structure.
    Type: Application
    Filed: March 4, 2021
    Publication date: November 25, 2021
    Inventors: Yung-Hsiang CHEN, Yu-Lung YEH, Yen-Hsiu CHEN, Bo-Chang SU, Cheng-Hsien CHEN
  • Publication number: 20210273038
    Abstract: A semiconductor processing system is provided to form a capacitor dielectric layer in a metal-insulator-metal capacitor. The semiconductor processing system includes a precursor tank configured to generate a precursor gas from a metal organic solid precursor, a processing chamber configured to perform a plasma enhanced chemical vapor deposition, and at least one buffer tank between the precursor tank and the processing chamber. The at least one buffer tank is coupled to the precursor tank via a first pipe and coupled to the processing chamber via a second pipe.
    Type: Application
    Filed: March 2, 2020
    Publication date: September 2, 2021
    Inventors: Wei-Liang Chen, Yu-Lung Yeh, Chihchous Chuang, Yen-Hsiu Chen, Tsai-Ji Liou, Yung-Hsiang Chen, Ching-Hung Huang
  • Patent number: 11103039
    Abstract: A protective case adapted for an electronic device is provided. The protective case includes a plurality of plates, at least one pivot module, an outer covering layer, and an inner covering layer. Each plate includes an inner surface and an outer surface, and at least one recess is defined between the plates. The pivot module is disposed in the recess and is connected to the plates. The outer covering layer is bonded to the outer surface of each plate and covers the recess. The inner covering layer is bonded to the inner surface of each plate and covers the recess. A side edge of the outer surface adjacent to the recess includes a chamfer.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: August 31, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yi-Chen Yen, Shih-Wei Chiou, Yung-Hsiang Chen
  • Publication number: 20210231753
    Abstract: A magnetoresistive device includes a magnetoresistor disposed over a substrate, a stress release structure covering a side surface of the magnetoresistor, an electrical connection structure disposed over the magnetoresistor, and a passivation layer disposed over the electrical connection structure and the stress release structure.
    Type: Application
    Filed: January 24, 2020
    Publication date: July 29, 2021
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hsun WU, Cheng-Ping CHANG, Chien-Hui LI, Tai-I YANG, Yung-Hsiang CHEN
  • Patent number: 11049249
    Abstract: A method, an apparatus and a system for cell detection are provided. In the apparatus, a hyperspectrum module is used to capture information across electromagnetic spectrums from an image, a stereo camera module is used to capture three-dimensional image information, and the hyperspectrum module and the stereo camera module form a trinocular micro spectrometer. A microscopic optical module is provided for the two modules to form hyperspectrum and three-dimensional image information from a cell and its split cells via a lens. In the method, a series of continuous images are obtained within a time period. An observation image array with a plurality of observation image zones are provided to retrieve coordinates of a plurality of feature points at different times. Finally, a holistic cellular activity can be obtained by analyzing continuous hyperspectrum and 3D image information from the images over time.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: June 29, 2021
    Assignees: PROVIDENCE UNIVERSITY, NATIONAL TSING HUA UNIVERSITY
    Inventors: Wei-Chung Wang, Yung-Hsiang Chen, Chuan-Yi Tang, Ching-Huan Kuo
  • Patent number: 10886405
    Abstract: A semiconductor structure includes a first source/drain region, a second source/drain region, a channel doping region, a gate structure, a first well and a second well. The second source/drain region is disposed opposite to the first source/drain region. The channel doping region is disposed between the first source/drain region and the second source/drain region. The gate structure is disposed on the channel doping region. The first well has a first portion disposed under the first source/drain region. The second well is disposed opposite to the first well and separated from the second source/drain region. The first source/drain region, the second source/drain region and the channel doping region have a first conductive type. The first well and the second well have a second conductive type different from the first conductive type.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: January 5, 2021
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Yung-Hsiang Chen, Yao-Wen Chang, Chu-Yung Liu, I-Chen Yang, Hsin-Wen Chang
  • Patent number: 10847712
    Abstract: A magnetoresistor device includes a magnetoresistor, a protection layer, a first conductive structure, and a second conductive structure. The magnetoresistor is disposed over a substrate. The protection layer is formed over a portion of the magnetoresistor. The first conductive structure is disposed over the protection layer and includes a lower barrier layer and a metal layer disposed over the lower barrier layer. The second conductive structure is disposed over the substrate and partially covers the magnetoresistor. The second conductive structure includes the lower barrier layer and the metal layer disposed over the lower barrier layer.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: November 24, 2020
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hsun Wu, Chien-Hui Li, Chih-Jen Hsiao, Yung-Hsiang Chen
  • Publication number: 20200297089
    Abstract: A protective case adapted for an electronic device is provided. The protective case includes a plurality of plates, at least one pivot module, an outer covering layer, and an inner covering layer. Each plate includes an inner surface and an outer surface, and at least one recess is defined between the plates. The pivot module is disposed in the recess and is connected to the plates. The outer covering layer is bonded to the outer surface of each plate and covers the recess. The inner covering layer is bonded to the inner surface of each plate and covers the recess. A side edge of the outer surface adjacent to the recess includes a chamfer.
    Type: Application
    Filed: March 17, 2020
    Publication date: September 24, 2020
    Inventors: Yi-Chen YEN, Shih-Wei CHIOU, Yung-Hsiang CHEN
  • Publication number: 20200289454
    Abstract: A method for suppressing tumor metastasis, in which an effective amount of a compound of formula (I) is administered to a subject in need thereof. Also disclosed is a method of treating cancer, in which an effective amount of a chemotherapy agent and an effective amount of a compound of formula (I) is administered to a subject in need thereof. Further disclosed are pharmaceutical compositions for suppressing tumor metastasis and for treating cancer, each of the compositions containing a compound of formula (I).
    Type: Application
    Filed: March 17, 2017
    Publication date: September 17, 2020
    Applicants: ACADEMIA, Sinica
    Inventors: Ning-Sun Yang, Yueh-Hsiung Kuo, Shu-Yi Yin, Yung-Hsiang Chen
  • Publication number: 20200243121
    Abstract: A non-volatile memory and a program method thereof are provided. The program method includes: selecting a programmed word line, where the programmed word line has a plurality of segments respectively corresponding to a plurality of bit lines; providing a program voltage to a voltage receiving end of the programmed word line, and sequentially transmitting the program voltage to the segments; respectively providing a plurality of bit line voltages to the bit lines at a plurality of enable time points and turning on a string selection switch at a setting time point; and setting voltage values of the bit line voltages according to the segments corresponding to the bit lines, respectively, or setting the enable time points according to the segments corresponding to the bit lines, or setting the setting time point according to a voltage transmission delay of the programmed word line.
    Type: Application
    Filed: January 30, 2019
    Publication date: July 30, 2020
    Applicant: MACRONIX International Co., Ltd.
    Inventors: Chu-Yung Liu, Hsing-Wen Chang, Yung-Hsiang Chen, Yao-Wen Chang
  • Publication number: 20200235287
    Abstract: An electrical contact structure and a method for forming the electrical contact structure are provided. The method includes forming a thin film material layer on a substrate, forming a first barrier layer on the thin film material layer and forming a metal layer on the first barrier layer. The method further includes patterning the metal layer to form a metal pattern, forming a spacer on a sidewall of the metal pattern and covering a portion of the first barrier layer. The method further includes etching the first barrier layer, wherein the portion of the first barrier layer located under the spacer is not completely etched. The method further includes removing the spacer and exposing the sidewall of the metal pattern to form an electrical contact structure on the thin film material layer, wherein the first barrier layer has a protrusion part exceeding the sidewall of the metal pattern.
    Type: Application
    Filed: April 1, 2020
    Publication date: July 23, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hui LI, Chien-Hsun WU, Yung-Hsiang CHEN
  • Publication number: 20200167924
    Abstract: A method, an apparatus and a system for cell detection are provided. In the apparatus, a hyperspectrum module is used to capture information across electromagnetic spectrums from an image, a stereo camera module is used to capture three-dimensional image information, and the hyperspectrum module and the stereo camera module form a trinocular micro spectrometer. A microscopic optical module is provided for the two modules to form hyperspectrum and three-dimensional image information from a cell and its split cells via a lens. In the method, a series of continuous images are obtained within a time period. An observation image array with a plurality of observation image zones are provided to retrieve coordinates of a plurality of feature points at different times. Finally, a holistic cellular activity can be obtained by analyzing continuous hyperspectrum and 3D image information from the images over time.
    Type: Application
    Filed: November 14, 2019
    Publication date: May 28, 2020
    Inventors: WEI-CHUNG WANG, YUNG-HSIANG CHEN, CHUAN-YI TANG, CHING-HUAN KUO
  • Patent number: 10656129
    Abstract: The present invention provides a miniature gas sensor, which comprises a gas sensor chip. The gas sensor chip includes a hollow structure on the back. An insulating layer is disposed below the sensing material. A miniature heating device is disposed surrounding the sensing material. The sensing material is adhered to the sensing electrodes. The sensing material includes two metal oxide semiconductors or a compound structure of the sensing layer having a metal oxide semiconductor and a reaction layer with a rough surface. An interface layer is sandwiched between the two metal oxide layers for increasing the efficiency in sensing gas. The gas sensor according to the present invention can be implemented on silicon substrate with hollow structures. In addition, the size of the chip can be miniaturized.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: May 19, 2020
    Assignee: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Ting-Jen Hsueh, Yu-Jen Hsiao, Yu-Te Lin, Yen-Hsi Li, Yung-Hsiang Chen, Jia-Min Shieh
  • Patent number: 10651365
    Abstract: An electrical contact structure and a method for forming the electrical contact structure are provided. The method includes forming a thin film material layer on a substrate, forming a first barrier layer on the thin film material layer and forming a metal layer on the first barrier layer. The method further includes patterning the metal layer to form a metal pattern, forming a spacer on a sidewall of the metal pattern and covering a portion of the first barrier layer. The method further includes etching the first barrier layer, wherein the portion of the first barrier layer located under the spacer is not completely etched. The method further includes removing the spacer and exposing the sidewall of the metal pattern to form an electrical contact structure on the thin film material layer, wherein the first barrier layer has a protrusion part exceeding the sidewall of the metal pattern.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: May 12, 2020
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hui Li, Chien-Hsun Wu, Yung-Hsiang Chen
  • Publication number: 20200044146
    Abstract: A magnetoresistor device includes a magnetoresistor, a protection layer, a first conductive structure, and a second conductive structure. The magnetoresistor is disposed over a substrate. The protection layer is formed over a portion of the magnetoresistor. The first conductive structure is disposed over the protection layer and includes a lower barrier layer and a metal layer disposed over the lower barrier layer. The second conductive structure is disposed over the substrate and partially covers the magnetoresistor. The second conductive structure includes the lower barrier layer and the metal layer disposed over the lower barrier layer.
    Type: Application
    Filed: January 31, 2019
    Publication date: February 6, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hsun WU, Chien-Hui LI, Chih-Jen HSIAO, Yung-Hsiang CHEN
  • Publication number: 20190178860
    Abstract: The present invention provides a miniature gas sensor, which comprises a gas sensor chip. The gas sensor chip includes a hollow structure on the back. An insulating layer is disposed below the sensing material. A miniature heating device is disposed surrounding the sensing material. The sensing material is adhered to the sensing electrodes. The sensing material includes two metal oxide semiconductors or a compound structure of the sensing layer having a metal oxide semiconductor and a reaction layer with a rough surface. An interface layer is sandwiched between the two metal oxide layers for increasing the efficiency in sensing gas. The gas sensor according to the present invention can be implemented on silicon substrate with hollow structures. In addition, the size of the chip can be miniaturized.
    Type: Application
    Filed: December 11, 2017
    Publication date: June 13, 2019
    Inventors: TING-JEN HSUEH, YU-JEN HSIAO, YU-TE LIN, YEN-HSI LI, YUNG-HSIANG CHEN, JIA-MIN SHIEH
  • Patent number: 10310390
    Abstract: An apparatus for a chuck having particle recesses is provided. In some embodiments, the chuck includes a plurality of impressions and a particle recess. The impressions of the plurality of impressions are laterally spaced and extend into the chuck from a top surface of the chuck to a base surface of the chuck. The base surface of the chuck defines bottom surfaces respectively of the impressions and is spaced between the top surface of the chuck and a bottom surface of the chuck. The particle recess extends in to the chuck from the top surface of the chuck to a location spaced between the base surface of the chuck and the bottom surface of the chuck. In particular, the particle recess is configured to underlie a workpiece alignment mark of a workpiece.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: June 4, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Hsiang Chen, Chung-Yi Ho, David Zhou
  • Patent number: D932464
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: October 5, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yi-Chen Yen, Yung-Hsiang Chen, Hsi-Tan Huang, Chien-Li Wang