Abstract: A memory chip, a memory device and an operation method are disclosed. The memory chip includes a number of memory units and a control logic circuit. The memory units could be configured as TLC, MLC or SLC. The control logic circuit is configured to use TLC programming approach to program MLC and SLC.

Abstract: A method of forming the semiconductor device is provided. The method includes following steps. A memory structure is formed over a first conductive line over a substrate and is electrically connected to the first conductive line. A sacrificial layer is formed on the memory structure. A spacer layer is formed to cover the memory structure and the sacrificial layer. A first dielectric layer is formed to cover the spacer layer. A planarization process is performed to remove a portion of the first dielectric layer. A second dielectric layer is formed on the spacer layer and the first dielectric layer. A patterning process is performed to form an opening exposing a portion of the top surface of the sacrificial layer. The sacrificial layer is removed to form a recess. A second conductive line is formed in the opening and the recess to be electrically coupled to the memory structure.

Abstract: A projector includes a casing, an optical engine module, and a heat dissipation module. The optical engine module is disposed in the casing. The heat dissipation module is disposed in the casing and includes a heat dissipation fin set. The heat dissipation fin set includes at least one heat dissipation fin and at least one turbulent structure. The heat dissipation fin has a surface. The surface includes a first turbulent region and a second turbulent region. The first turbulent region is adjacent to the second turbulent region. The turbulent structure is disposed at least one of the first turbulent region and the second turbulent region, and the turbulent structure protrudes from the surface. An opening is formed between a top end of the turbulent structure and the surface.

Abstract: A projector includes a casing, an optical engine module, and a heat dissipation module. The optical engine module is disposed in the casing. The heat dissipation module is disposed in the casing and includes a heat dissipation fin set. The heat dissipation fin set includes at least one heat dissipation fin and at least one turbulent structure. The heat dissipation fin has a surface. The surface includes a first turbulent region and a second turbulent region. The first turbulent region is adjacent to the second turbulent region. The turbulent structure is disposed at least one of the first turbulent region and the second turbulent region, and the turbulent structure protrudes from the surface. An opening is formed between a top end of the turbulent structure and the surface.