Patents by Inventor Yunguk JANG

Yunguk JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor
    Patent number: 11493469
    Abstract: A sensor is disclosed.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: November 8, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Insung Hwang, Byungkee Lee, Yunguk Jang, Sunjung Kim
  • SENSOR
    Publication number: 20200041435
    Abstract: A sensor is disclosed.
    Type: Application
    Filed: November 18, 2016
    Publication date: February 6, 2020
    Applicant: LG ELECTRONICS INC.
    Inventors: Insung HWANG, Byungkee LEE, Yunguk JANG, Sunjung KIM
  • Sensor
    Patent number: 10388593
    Abstract: A sensor is disclosed. The sensor comprises a first substrate; a second substrate positioned relative to the first substrate; a first electrode located between the first substrate and the second substrate, the first electrode formed on the second substrate; a sensing portion covering at least a part of the first electrode and further covering at least a portion of the second substrate; a pad electrode located between the first substrate and the second substrate, wherein the pad electrode is formed on the second substrate and is electrically coupled to the first electrode; and a bonding pad located between the first substrate and the second substrate, wherein the bonding pad is formed on the first substrate and is electrically coupled to the pad electrode.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 20, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Insung Hwang, Wonhyeog Jin, Moosub Kim, Yunguk Jang
  • SENSOR
    Publication number: 20170316995
    Abstract: A sensor is disclosed. The sensor comprises a first substrate; a second substrate positioned relative to the first substrate; a first electrode located between the first substrate and the second substrate, the first electrode formed on the second substrate; a sensing portion covering at least a part of the first electrode and further covering at least a portion of the second substrate; a pad electrode located between the first substrate and the second substrate, wherein the pad electrode is formed on the second substrate and is electrically coupled to the first electrode; and a bonding pad located between the first substrate and the second substrate, wherein the bonding pad is formed on the first substrate and is electrically coupled to the pad electrode.
    Type: Application
    Filed: April 26, 2017
    Publication date: November 2, 2017
    Applicant: LG ELECTRONICS INC.
    Inventors: Insung HWANG, Wonhyeog JIN, Moosub KIM, Yunguk JANG