Patents by Inventor Yuri KAJIHARA

Yuri KAJIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190202959
    Abstract: In a conventional self-healing material, although the resin properties after self-healing are restored to the same level as the initial refractoriness and strength of the resin, no further extension of life can be expected. A resin cured product according to the present invention includes: a first vinyl monomer having an ester bond; a second vinyl monomer having a hydroxyl group; a transesterification reaction catalyst; and a boron compound.
    Type: Application
    Filed: July 7, 2017
    Publication date: July 4, 2019
    Applicant: HITACHI, LTD.
    Inventors: Yuri KAJIHARA, Takahito MURAKI, Yasuhiko TADA, Jun NUNOSHIGE, Takeshi KONDO
  • Publication number: 20180215129
    Abstract: A functionally graded material according to the present invention adopts, for example, the following configuration. A functionally graded material is constituted by laminating a plurality of resin compositions. Among the plurality of resin compositions, a first resin composition has a different property from a second resin composition adjacent to the first resin composition. An interface between the first resin composition and the second resin composition is joined by a dynamic covalent bond.
    Type: Application
    Filed: July 31, 2015
    Publication date: August 2, 2018
    Applicant: HITACHI, LTD.
    Inventors: Yasuhiko TADA, Takahito MURAKI, Yuri KAJIHARA, Takeshi KONDO, Tadashi ARAI
  • Patent number: 9944732
    Abstract: This invention is intended to synthesize a multi-branched polymer, which has an uniform molecular chain lengths and is free from branch defects, without the need for purification. This invention is also intended to synthesize a polyfunctional radical polymerization initiator represented by Formula 1: wherein n is an integer of 1 or larger; Y is a polyfunctional unsaturated compound; R1 is a hydrocarbon group; R2 is a structure in which one molecule of a radically polymerizable unsaturated hydrocarbon compound is bound to R1 and the oxygen atom; X1 of B—X1 (boron-X1) bond is an alkoxy or phenyl group; and X2 of B—X2 (boron-X2) bond is an alkoxy or phenyl group.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: April 17, 2018
    Assignee: Hitachi, Ltd.
    Inventors: Yuri Kajihara, Takahito Muraki, Jun Nunoshige
  • Publication number: 20180086876
    Abstract: It is an object of the present invention to provide a thermosetting resin composition which allows stress relaxation in an ester exchange reaction and the long-term use of the thermosetting resin composition having such a structure. A thermosetting resin composition of the present invention contains: an ester bond; and a functional group protected by a protecting group. The functional group is deprotected by external stimulus. The functional group and the ester bond can be subjected to an ester exchange reaction.
    Type: Application
    Filed: January 26, 2015
    Publication date: March 29, 2018
    Applicant: HITACHI, LTD.
    Inventors: Yasuhiko TADA, Takahito MURAKI, Yuri KAJIHARA
  • Publication number: 20180009955
    Abstract: A resin produced by a conventional technique has a weak nature in terms of hydrolysis resistance. For example, in a case where the resin produced by a conventional technique is used in an area with a highly humid climate such as Japan for a long period of time, deterioration of the resin due to hydrolysis becomes a concern. A resin composition is described that is optimized in the molecular structure design of the resin and in the catalyst in order to improve the hydrolysis resistance. Specifically, the resin composition contains (1) a copolymer of a vinyl compound having two or more epoxy groups, a carboxylic acid anhydride, and a transesterification reaction catalyst, or (2) a copolymer of a vinyl compound having two or more carboxylic acid anhydride groups, an epoxy, and a transesterification reaction catalyst.
    Type: Application
    Filed: January 12, 2016
    Publication date: January 11, 2018
    Applicant: HITACHI, LTD.
    Inventors: Yuri KAJIHARA, Takahito MURAKI, Tadashi ARAI, Yasuhiko TADA
  • Publication number: 20170145209
    Abstract: It is an object of the present invention to provide an excellent thermosetting resin that achieves both higher heat resistance and higher toughness and mechanical strength for improving cracking resistance and lower viscosity which are conventionally in a trade-off relationship. It is also an object of the present invention to provide an electronic•electrical device using a cured product of the thermosetting resin as an insulating material or a structural material. The present invention includes a plurality of means for achieving the above objects, and one of the means is a thermosetting resin composition comprising: a three-dimensional copolymer obtained by copolymerizing a maleimide derivative and a styrene derivative with use of an alkyl borane or a boron compound as a polymerization initiator; and a thermosetting resin composition.
    Type: Application
    Filed: May 18, 2015
    Publication date: May 25, 2017
    Applicant: HITACHI, LTD.
    Inventors: Yuri KAJIHARA, Satoru AMOU, Takahito MURAKI
  • Publication number: 20160319056
    Abstract: This invention is intended to synthesize a multi-branched polymer, which has an uniform molecular chain lengths and is free from branch defects, without the need for purification. This invention is also intended to synthesize a polyfunctional radical polymerization initiator represented by Formula 1: wherein n is an integer of 1 or larger; Y is a polyfunctional unsaturated compound; R1 is a hydrocarbon group; R2 is a structure in which one molecule of a radically polymerizable unsaturated hydrocarbon compound is bound to R1 and the oxygen atom; X1 of B—X1 (boron-X1) bond is an alkoxy or phenyl group; and X2 of B—X2 (boron-X2) bond is an alkoxy or phenyl group.
    Type: Application
    Filed: December 27, 2013
    Publication date: November 3, 2016
    Inventors: Yuri KAJIHARA, Takahito MURAKI, Jun NUNOSHIGE
  • Publication number: 20150337106
    Abstract: The purpose of the present invention is to provide a low-melting-point glass resin composite material with which the heat resistance and heat conductivity of an insulating resin can be improved. The low-melting-point glass resin composite material includes: a lead-free low-melting-point glass composition that contains Ag2O, V2O5, and TeO2, and in which the total content of Ag2O, V2O5, and TeO2 is 75 mass % or more; and a resin composition having a 5% thermal weight reduction temperature equal to or greater than a softening point temperature of the low-melting-point glass composition.
    Type: Application
    Filed: December 26, 2012
    Publication date: November 26, 2015
    Inventors: Yuri KAJIHARA, Satoru AMOU, Takashi NAITO, Yuichi SAWAI, Motomune KODAMA