Abstract: A memory device includes a memory cell array, a voltage generation circuit generating one or more voltages supplied to the memory cell array, an input/output circuit receiving an address indicating a region in the memory cell array, and a control circuit controlling operations of the memory cell array. The control circuit supplies a non-selection voltage of the voltages before a ready/busy signal changes from a ready state to a busy state.

Abstract: A memory device includes a memory cell array, a voltage generation circuit generating one or more voltages supplied to the memory cell array, an input/output circuit receiving an address indicating a region in the memory cell array, and a control circuit controlling operations of the memory cell array. The control circuit supplies a non-selection voltage of the voltages before a ready/busy signal changes from a ready state to a busy state.

Abstract: A memory device includes a memory cell array, a voltage generation circuit generating one or more voltages supplied to the memory cell array, an input/output circuit receiving an address indicating a region in the memory cell array and a control circuit controlling operations of the memory cell array. The voltage generation circuit generates the voltages before a ready/busy signal changing from a ready state to a busy state.

Abstract: A memory device includes a memory cell array, a voltage generation circuit generating one or more voltages supplied to the memory cell array, an input/output circuit receiving an address indicating a region in the memory cell array and a control circuit controlling operations of the memory cell array. The voltage generation circuit generates the voltages before a ready/busy signal changing from a ready state to a busy state.

Abstract: A method of controlling a memory device includes receiving an address indicating a region in a memory cell array and generating one or more voltages supplied to the memory cell array in parallel with receiving the address.

Abstract: A method of controlling a memory device includes receiving an address indicating a region in a memory cell array and generating one or more voltages supplied to the memory cell array in parallel with receiving the address.

Abstract: According one embodiment, a memory device includes: a memory cell array; a voltage generation circuit generating one or more voltages supplied to the memory cell array; an input/output circuit receiving an address indicating a region in the memory cell array; and a control circuit controlling operations of the memory cell array. The voltage generation circuit generates the voltages during reception of the address.

Abstract: A semiconductor storage device includes a memory cell array, a temperature sensor configured to generate a first temperature signal corresponding to a temperature of the memory cell array in response to a first command periodically generated during a waiting period of the memory cell array, a storage circuit configured to store the first temperature signal and update the first temperature signal each time the first command is generated during the waiting period, and a voltage generation circuit configured to generate a voltage to be applied to the memory cell array based on the first temperature signal stored in the storage circuit.

Abstract: A semiconductor storage device includes a memory cell array, a temperature sensor configured to generate a first temperature signal corresponding to a temperature of the memory cell array in response to a first command periodically generated during a waiting period of the memory cell array, a storage circuit configured to store the first temperature signal and update the first temperature signal each time the first command is generated during the waiting period, and a voltage generation circuit configured to generate a voltage to be applied to the memory cell array based on the first temperature signal stored in the storage circuit.

Abstract: According one embodiment, a memory device includes: a memory cell array; a voltage generation circuit generating one or more voltages supplied to the memory cell array; an input/output circuit receiving an address indicating a region in the memory cell array; and a control circuit controlling operations of the memory cell array. The voltage generation circuit generates the voltages during reception of the address.

Abstract: According to one embodiment, a semiconductor storage device includes a three-dimensional memory cell array, write drivers, and a program voltage control circuit. In the three-dimensional memory cell array, memory cells are three-dimensionally arranged. The write drivers are arranged to be distributed under the three-dimensional memory cell array and apply a program voltage to the memory cells during writing in the memory cells. The program voltage control circuit is arranged around the three-dimensional memory cell array and performs control for making the write drivers to generate the program voltage.

Abstract: A semiconductor storage device includes a memory cell array including memory cells arranged at respective intersections between first wirings and second wirings. Each of the memory cells includes a rectifier element and a variable resistance element connected in series. A control circuit is configured to apply a first voltage to a selected first wiring and a second voltage lower than the first voltage to a selected second wiring so that a certain potential difference is applied to a selected memory cell positioned at an intersection between the selected first wiring and the selected second wiring. The control circuit performs a concurrent read operation to perform a read operation from plural memory cells concurrently by applying the first voltage to a plurality of the first wirings concurrently. It is possible to switch the number of the first wirings to be applied with the first voltage concurrently in the concurrent read operation.

Abstract: According to one embodiment, a semiconductor memory device includes memory cells storing data based on respective threshold voltages, having a positive threshold voltage in a data erased state, and includes respective control electrodes. Word lines are selectively electrically connected to the control electrodes of the memory cells, and charged to a potential before writing data to the memory cells. A voltage generator outputs a voltage at an output and includes a first path which discharges the output. A connection circuit is selectively electrically connected to the output of the voltage generator and a first word line, and selectively electrically connects the first word line to a first node which supplies a potential.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes: a memory cell array including a plurality of first lines and second lines intersecting each other and a plurality of memory cells connected at intersections of the plurality of first lines and second lines; and a first line control circuit and a second line control circuit configured to select the first lines and the second lines respectively to supply a voltage or current necessary for a resetting operation or a setting operation on the memory cells. The first line control circuit supplies unselected ones of the first lines with an unselecting voltage corresponding to the distance between the unselected first lines and the second line control circuit.

Abstract: According to one embodiment, a semiconductor storage device includes a three-dimensional memory cell array, write drivers, and a program voltage control circuit. In the three-dimensional memory cell array, memory cells are three-dimensionally arranged. The write drivers are arranged to be distributed under the three-dimensional memory cell array and apply a program voltage to the memory cells during writing in the memory cells. The program voltage control circuit is arranged around the three-dimensional memory cell array and performs control for making the write drivers to generate the program voltage.

Abstract: The semiconductor storage apparatus includes a memory cell array including memory cells each having a rectifying element and a variable resistive element connected in series, the memory cells being arranged in crossing portions of a plurality of first wires and a plurality of second wires, and a control circuit configured to control charging to the first wire. The control circuit charges the first wire connected to a selected memory cell up to a first potential, and then set the first wire in a floating state. Then it charges another first wire adjacent to the first wire connected to the selected memory cell to a second potential. The potential of the first wire connected to the selected memory cell is thereby caused to rise to a third potential by coupling.

Abstract: A semiconductor storage device includes a memory cell array including memory cells arranged at respective intersections between first wirings and second wirings. Each of the memory cells includes a rectifier element and a variable resistance element connected in series. A control circuit is configured to apply a first voltage to a selected first wiring and a second voltage lower than the first voltage to a selected second wiring so that a certain potential difference is applied to a selected memory cell positioned at an intersection between the selected first wiring and the selected second wiring. The control circuit performs a concurrent read operation to perform a read operation from plural memory cells concurrently by applying the first voltage to a plurality of the first wirings concurrently. It is possible to switch the number of the first wirings to be applied with the first voltage concurrently in the concurrent read operation.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes: a memory cell array including a plurality of first lines and second lines intersecting each other and a plurality of memory cells connected at intersections of the plurality of first lines and second lines; and a first line control circuit and a second line control circuit configured to select the first lines and the second lines respectively to supply a voltage or current necessary for a resetting operation or a setting operation on the memory cells. The first line control circuit supplies unselected ones of the first lines with an unselecting voltage corresponding to the distance between the unselected first lines and the second line control circuit.

Abstract: The semiconductor storage apparatus includes a memory cell array including memory cells each having a rectifying element and a variable resistive element connected in series, the memory cells being arranged in crossing portions of a plurality of first wires and a plurality of second wires, and a control circuit configured to control charging to the first wire. The control circuit charges the first wire connected to a selected memory cell up to a first potential, and then set the first wire in a floating state. Then it charges another first wire adjacent to the first wire connected to the selected memory cell to a second potential. The potential of the first wire connected to the selected memory cell is thereby caused to rise to a third potential by coupling.