Abstract: A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location.

Abstract: A system for creating a learned model for component image recognition, the learned model being used when performing image recognition of a component that is picked up by a suction nozzle of a component mounter or a component that is mounted on a circuit board, serving as an imaging target, by imaging the imaging target with a camera, and the system includes a computer configured to acquire a reference-learned model to be used for image recognition of a reference component. The computer collects sample component images for each type of a component having a predetermined similarity with the reference component, and creates a component-by-component learned model to be used for image recognition of the component for each type of the component by adding the sample component image for each type of the component, as teacher data of the reference-learned model, and re-learning the added sample component image.

Abstract: A representation of the electronic component to be mounted according to a production program is displayed so as to be superimposed on the image of the mounting area on the display device, and the production program is edited so that a mounting orientation of the electronic component matches an orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the representation of the electronic component displayed so as to be superimposed on the image of the mounting area on the display device.

Abstract: A mounting device is provided with a mechanical chuck that picks up a component housed in a tray by gripping the component in a state with a cam follower contacting tray housing the component at a predetermined height. The mechanical chuck is provided with a first holding member including a first gripping member, and a second holding member including a second gripping member. The cam follower is a rotatable roller, and when the first holding member moves when picking up the component from tray, the cam follower rotates according to this movement in a state contacting tray.

Abstract: A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location.

Abstract: A coordinate data generation device is used in a component mounter configured to perform processing for mounting electronic components on boards of different dimensions by imaging the board that is controlled to be conveyed and stopped at a target position and performing the mounting of the electronic components after correcting for a deviation between a stopping position of the board identified from an image captured by the imaging and a target position, and specifies an imaging region for imaging the board stopped at the stopping position.

Abstract: A mounting device is provided with a mechanical chuck that picks up a component housed in a tray by gripping the component in a state with a cam follower contacting tray housing the component at a predetermined height. The mechanical chuck is provided with a first holding member including a first gripping member, and a second holding member including a second gripping member. The cam follower is a rotatable roller, and when the first holding member moves when picking up the component from tray, the cam follower rotates according to this movement in a state contacting tray.