Abstract: A fiber-reinforced resin material includes a thermoplastic resin and a bundle of reinforced fibers arranged in one direction, the thermoplastic resin being a reactive resin. The thermoplastic resin may be an epoxy resin. The reinforced fibers may be carbon fibers. A molded fiber-reinforced resin body is obtained using the fiber-reinforced resin material. The molded fiber-reinforced resin body may be formed by the application of heat and pressure.

Abstract: A porous ceramic for which any decrease in water permeability can be suppressed over a long period of time. A porous ceramic is composed of a porous ceramic sintered body produced by molding and sintering a mixture containing a clay, wherein a surface portion of the porous ceramic sintered body has been removed by grinding. The mixture preferably contains a foaming agent.

Abstract: A biochip support member is provided that comprises a base material, and a columnar member different member from the base material having a support area that can support a biochip formed of a biomolecule provided at one end, and is attached to the base material through an attaching part at the other end.

Abstract: The invention relates to a semiconductor device having a vertical transistor bipolar structure of emitter, base, and collector formed in this order from a semiconductor substrate surface in a depth direction. The semiconductor device includes an electrode embedded from the semiconductor substrate surface into the inside and insulated by an oxide film. In the surface of the substrate, a first-conductivity-type first semiconductor region, a second-conductivity-type second semiconductor region, and a first-conductivity-type third semiconductor region are arranged, from the surface side, inside a semiconductor device region surrounded by the electrode and along the electrode with the oxide film interposed therebetween, the second semiconductor region located below the first semiconductor region, the third semiconductor region located below the second semiconductor region.

Abstract: This plate (100) is provided with a board (130) having a first surface, and partitioned member (120) in which a plurality of partitions are formed by dividing walls (22). Gaps (28) are formed to the first surface side between neighboring dividing walls (22). The ends of the dividing walls (22) at the gap (28) side have welded portions welded to the first surface of the board (130), the board (130) and the partitioned member (120) being welded at the welded portions.

Abstract: Provided is a separator for non-aqueous batteries, capable of being usefully used in non-aqueous batteries, and a non-aqueous battery equipped with this separator. The separator for non-aqueous batteries includes: a base layer comprising a fiber aggregate, and an electrolyte-swellable resin layer formed on at least one surface of the base layer, the resin layer comprising a urethane resin (C) obtained by reacting a polyol (A) including a vinyl polymer (a1) and a polyether polyol (a2) with a polyisocyanate (B). The vinyl polymer (a1) has as a main chain a vinyl polymer (a1?) having two hydroxyl groups at one of the termini of the main chain, and a polyoxyethylene chain having a number average molecular weight of 200 to 800 as a side chain, the percentage of the polyoxyethylene chain based on the vinyl polymer (a1) being within the range of 70 mass % to 98 mass %.

Abstract: A photoelectric converter includes a first pn junction comprised of at least two semiconductor regions of different conductivity types, and a first field-effect transistor including a first source connected with one of the semiconductor regions, a first drain, a first insulated gate and a same conductivity type channel as that of the one of the semiconductor regions. The first drain is supplied with a second potential at which the first pn junction becomes zero-biased or reverse-biased relative to a potential of the other of the semiconductor regions. When the first source turns to a first potential and the one of the semiconductor regions becomes zero-biased or reverse-biased relative to the other semiconductor regions, the first pn junction is controlled not to be biased by a deep forward voltage by supplying a first gate potential to the first insulated gate, even when either of the semiconductor regions is exposed to light.

Abstract: A biochip fixing method includes: arranging a biochip on an object with a predetermined material interposed therebetween; and irradiating the predetermined material with energy waves via the object to fix the biochip to the object.

Abstract: A storage element includes a first electrode and a second electrode separated by a gap and a dielectric layer provided between the first electrode and the second electrode to fill the gap. A separation distance of the gap changes in response to application of a voltage to a space between the first electrode and the second electrode, such that a switching phenomenon is produced which switches a resistance state between the first electrode and the second electrode between a high resistance state in which it is difficult for tunnel current to flow and a low resistance state in which it is easy for tunnel current to flow.

Abstract: A reset method of an photoelectric conversion device at least including a phototransistor having a first collector, a first base, and a first emitter, and a first field-effect transistor having a first source, a first drain, and a first gate, includes: connecting the first base, and one of the first source and the first drain of the first field-effect transistor by having a common region, or a continuous region, without a base electrode; supplying a base reset potential to the other of the first source and the first drain; and overlapping a time in which a first emitter potential is supplied to the first emitter and a time in which a first ON-potential that turns on the first field-effect transistor is supplied to the first gate.

Abstract: In a drive method for a memory element that includes an insulating substrate, a first electrode and a second electrode provided on the insulating substrate, and an inter-electrode gap portion provided between the first electrode and the second electrode and having a gap of the order of nanometers where a phenomenon of a change in resistance value between the first and second electrodes occurs, and that can perform a transition from a predetermined low-resistance state to a predetermined high-resistance state and a transition from the high-resistance state to the low-resistance state, a current pulse is applied to the memory element by a constant current circuit upon the transition from the high-resistance state to the low-resistance state.

Abstract: In order to achieve a photoelectric conversion cell and an array of high sensitivity and high dynamic range, there is a need for a photoelectric conversion cell and an array in which combination of an amplified photoelectric conversion element and a selection element are resistant to external noise, and the combination is resistant to effects from address selection pulse noise at array readout time. In the present invention, in order to solve the problem, a photoelectric conversion cell has been configured with a combination of an amplified photoelectric conversion element (100) and a selection element (10 and the like) which are resistant to external noise, and various means of solution of the combination are provided which are resistant to the effects of address selection pulse noise at array readout time. As a result, a dynamic range of 6 to 7 orders of magnitude for light detection has become possible.

Abstract: A memory element includes an insulating substrate; a first electrode and a second electrode on the insulating substrate; and an inter-electrode gap portion that causes a change in resistance value between the first and second electrodes. Applied to the memory element from a pulse generating source is a first voltage pulse for shifting from a predetermined low-resistance state to a predetermined high-resistance state, and a second voltage pulse for shifting from the high-resistance state to the low-resistance state through a series-connected resistor, by which current flowing to the memory element after the change to a low resistance value is reduced. When shifting from the high to the low-resistance state, a voltage pulse is applied such that an electrical resistance between the pulse generating source and the memory element becomes higher than the electrical resistance shifting from the low to the high-resistance state.

Abstract: Disclosed is a fabrication method of an element with nanogap electrodes including a first electrode, a second electrode provided above the first electrode, and a gap provided between the first electrode and the second electrode, the gap being in an order of nanometer to allow resistive state to be switched by applying a predetermined voltage between the first electrode and the second electrode, the method comprising: forming the first electrode; forming a spacer on an upper surface of the first electrode; forming the second electrode in contact with an upper surface of the spacer; and removing the spacer to form the gap.

Abstract: A semiconductor integrated circuit that is used for a stabilizing power supply circuit which supplies an output power supply voltage to a parallel connection of a smoothing capacitor and a load, from an input power supply voltage, includes an error amplifier that detects an error of the output power supply voltage, an output control circuit that is connected between the input terminal and the output terminal, a phase compensation circuit that is connected to the error amplifier, and a detection control circuit that is connected to the phase compensation circuit.

Abstract: Provided is a method of varying the gain of an amplifying photoelectric conversion device and a variable gain photoelectric conversion device which are capable of achieving both signal processing under low illuminance and high-current processing under high light intensity, and thereby capable of securing a wide dynamic range. An amplifying photoelectric conversion part includes a photoelectric conversion element and amplification transistors forming a Darlington circuit. The sources and the drains of field-effect transistors are connected to the bases and the emitters of the amplification transistors, respectively. The gates of the field-effect transistors each function as a gain control part.

Abstract: The semiconductor device includes a power transistor that is disposed between a first signal line, which is coupled to a first external terminal, and a second signal line, which is coupled to a second external terminal. A gate electrode of the power transistor is coupled to a third signal line. The semiconductor device further includes a clamp circuit that clamps a voltage between the first signal line and the third signal line, a first resistive element that is disposed between the third signal line and the second signal line, and a monitoring section that monitors a voltage between the third signal line and the second signal line. The clamp circuit is configured so that a clamp voltage can be changed. The monitoring section exercises control to decrease the clamp voltage when the voltage between the third signal line and the second signal line exceeds a predefined threshold value.

Abstract: A storage element includes a first electrode and a second electrode separated by a gap and a dielectric layer provided between the first electrode and the second electrode to fill the gap. A separation distance of the gap changes in response to application of a voltage to a space between the first electrode and the second electrode, such that a switching phenomenon is produced which switches a resistance state between the first electrode and the second electrode between a high resistance state in which it is difficult for tunnel current to flow and a low resistance state in which it is easy for tunnel current to flow.

Abstract: The invention provides a processing method for upgrading an organic phase substance by removing heavy element species from the organic phase substance originating from a resource substance in mild environmental conditions, and further provides a method for collecting removed heavy element species and a method for collecting other substances.

Abstract: The semiconductor device includes a power transistor that is disposed between a first signal line, which is coupled to a first external terminal, and a second signal line, which is coupled to a second external terminal. A gate electrode of the power transistor is coupled to a third signal line. The semiconductor device further includes a clamp circuit that clamps a voltage between the first signal line and the third signal line, a first resistive element that is disposed between the third signal line and the second signal line, and a monitoring section that monitors a voltage between the third signal line and the second signal line. The clamp circuit is configured so that a clamp voltage can be changed. The monitoring section exercises control to decrease the clamp voltage when the voltage between the third signal line and the second signal line exceeds a predefined threshold value.