Abstract: The loop material sewing method includes: sewing one end of a loop material on a fabric in a state where a front side of the loop material faces the fabric; arranging a fork member including a pair of fork pins so as to arrange the loop material between the pair of fork pins; folding an opposite end of the loop material to a back side of the loop material by rotating the fork member around an axial line parallel to an extending direction of the pair of fork pins; relatively moving the fabric and the fork member in a length direction of the loop material; arranging the folded opposite end on the fabric, pulling out the fork pins from a folded portion at the opposite end by moving the fork member in a width direction of the loop material and sewing the folded opposite end on the fabric.

Abstract: The loop material sewing method includes: sewing one end of a loop material on a fabric in a state where a front side of the loop material faces the fabric; arranging a fork member including a pair of fork pins so as to arrange the loop material between the pair of fork pins; folding an opposite end of the loop material to a back side of the loop material by rotating the fork member around an axial line parallel to an extending direction of the pair of fork pins; relatively moving the fabric and the fork member in a length direction of the loop material; arranging the folded opposite end on the fabric, pulling out the fork pins from a folded portion at the opposite end by moving the fork member in a width direction of the loop material and sewing the folded opposite end on the fabric.

Abstract: This invention provides a metal foil and an etching process which overcomes the problem of etching of the copper foil layer and the plating copper layer formed on a metal clad laminate during the conventional semi-additive process for producing printed wire boards. In the present invention, the metal foil and the metal foil with carrier foil include a nickel or tin layer 0.5 to 3 ?m thick formed on the external surface of a metal clad laminate which protects the surface of the plated layer during the final flash etching of the copper foil layer.

Abstract: A printed wiring board manufacturing method is provided which is so consitituted that when a carbon dioxide leaser is used to form holes such as via holes in a copper clad laminate, copper foils and resin layers may be processed at the same time, without having to perform an etching treatment on the cooper foil. Namely, a carbon dioxide laser is used to form recess portions such as via holes in a copper clad laminate, followed by plating to form interlayer electrical connections, forming etching resist layers, and exposing and developing the etching resist layers, thereby effecting a circuit etching treatment. In particular, the copper clad laminate is a laminate formed by using waved copper foils to form external copper foils.

Abstract: It is an object to provide a manufacturing process for a printed wiring board in which a copper foil and resin as a substrate material of a copper clad laminate are irradiated with carbon dioxide gas laser light to drill in both of them simultaneously. In forming a through hole or a hole such as IVH, BVH or the like in the copper clad laminate using carbon dioxide gas laser light, one of a nickel layer of 0.08 to 2 &mgr;m in thickness, a cobalt layer of 0.05 to 3 &mgr;m in thickness and a zinc layer of 0.03 to 2 &mgr;m in thickness is formed as an additional metal layer on a surface of the copper foil residing in an external layer of the copper clad laminate and thereafter, by performing laser drilling, the copper foil layer and the resin layer as a substrate material of the copper clad laminate are enabled to drill simultaneously.

Abstract: The present invention provides a filtration method of copper electrolyte that can remove minute electrolytic by-products and dirt and may improve filtration efficiency by improving a conventional filtration method, the so-called precoating method. In a filtration method of copper electrolyte for removing electrolytic by-products and dirt which affect copper electrolysis, by passing copper electrolyte through a filter element precoated with a filtering aid, in the present invention, a precoated layer of a filtering aid is formed on a filter element in advance. Activated carbon preliminary treatment solution containing powdery activated carbon is passed through the filter element formed with the precoated layer, and is also circulated until no powdery activated carbon leaks from an outlet of the filter element, thus forming a powdery activated carbon layer on the precoated layer. Subsequently, the copper electrolyte is passed through for filtration.

Abstract: The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.

Abstract: The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.

Abstract: The purpose is to provide a surface treated copper foil and an electrodeposited copper foil with carrier to be employed for a copper clad laminate capable to be processed for simultaneous hole formation in the copper foil layer and a substrate resin layer using carbon dioxide gas laser. The purpose can be achieved by using a surface treated copper foil bearing a nickel layer or a cobalt layer with a prescribed thickness in one side of a copper foil or an electrodeposited copper foil with carrier provided with a nickel layer or a cobalt layer with a prescribed thickness between a carrier foil and an electrode posited copper foil layer. When a copper clad laminate is manufactured using these foils, the copper clad laminate is capable to be processed to easily and simultaneously form a hole in the copper foil layer and the substrate resin layer using carbon dioxide gas laser.

Abstract: A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.

Abstract: The present invention provides an electrodeposited copper foil which solves problems of electrodeposited-copper-clad laminates to which the foil has been incorporated, such as bow, twist, and poor dimensional stability, and a method of inspecting an electrodeposited copper foil so as to assure the quality of the foil. In the invention, there is employed an electrodeposited copper foil which recrystallizes by heating at low temperature during production of a copper-clad laminate employing an electrodeposited copper foil and which exhibits an elongation as high as 18% or more in an atmosphere of 180° C., wherein the maximum rate of decrease in maximum tensile strength falls within the aging time ranging from 5 to 10 minutes in a process in which tensile strength decreases as time elapses during aging in an atmosphere at 170° C., and the change in tensile strength in a knick portion shown in a {tensile strength} vs.

Abstract: A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate dissolved therein, in which said electrolyte contains a small amount of lead (Pb) ions, which comprises adding a salt of a metal of Group IIA of the periodic table to the electrolyte in an amount of 10 to 150 mols per mol of lead (Pb) ions contained in the electrolyte so that the lead (Pb) ions contained in the electrolyte react with the metal of Group IIA of the periodic table to thereby form an insoluble composite substance to precipitate, the insoluble composite substance followed by removing it from the electrolyte and forming an electrodeposited copper foil in the electrolyte having the lead (Pb) ions removed therefrom.

Abstract: A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.