Abstract: An electronic apparatus, includes: a housing; a panel; a first bonding agent disposed along an edge of the housing and configured to join the housing and the panel to each other; and a joining member disposed at part of the edge of the housing and having a joining strength lower than a joining strength of the first bonding agent.

Abstract: An electronic apparatus, includes: a housing; a panel; a first bonding agent disposed along an edge of the housing and configured to join the housing and the panel to each other; and a joining member disposed at part of the edge of the housing and having a joining strength lower than a joining strength of the first bonding agent.

Abstract: An electrical device includes a first unit including an electrode; a second unit having a hole at a position corresponding to the electrode of the first unit; a probe pin having a smaller diameter than the hole and configured to be elastically deformed, the probe pin being disposed in the hole such that a front end thereof is in contact with the electrode of the first unit; and an adhesive connecting the first unit and the second unit to each other and filling the hole so as to fix the probe pin.

Abstract: A component assembly manufacturing method includes positioning a first component to a jig, applying an adhesive to at least one of an adhesion surface of the first component and an adhesion surface of a second component, positioning the second component to the first component by a magnetic force that acts between the second component and the jig, in a state in which the adhesive in an uncured state is arranged between the adhesion surface of the first component and the adhesion surface of the second component, and fixing the first component and the second component by the adhesive.

Abstract: A configuration includes the adhesive member to adhesively bond components together and a thermo-expandable material to expand upon being heated in the way of being disposed between at least one of the components adhesively bonded together by the adhesive member and the adhesive member and to push the adhesive member in a direction of getting apart from at least one of the components.

Abstract: A method of forming an image on a transfer sheet based on electronic data uses an image forming device and an ink ribbon cartridge. An ink ribbon of the ink ribbon cartridge has a plurality of ink films formed thereon with boundary lines being provided between the ink films. In the image forming method, the ink ribbon of the ink ribbon cartridge is conveyed when the power to the image forming device is turned on and the ink ribbon cartridge is installed in the image forming device and before the user inputs the image forming instruction. While the ink ribbon of the ink ribbon cartridge is conveyed, it is determined with a boundary line detecting unit whether at least one of the boundary lines formed on the ink ribbon has reached a predetermined position in the image forming device.

Abstract: An apparatus for forming a solder dam on a lead of an electronic component is disclosed. The apparatus for forming a solder dam includes a wire material that transfers an ink that prevents adhesion of a solder to the lead; a wire material conveying device that conveys the wire material along a surface of the lead; and an ink supply device that supplies the ink to the wire material.

Abstract: An apparatus for forming a solder dam on each lead of an electronic device includes a mask having one or more slits; and forming means that forms the solder dam made of non-metal material on the lead of the electronic device through the slits of the mask.

Abstract: A method of forming a solder dam on a lead of an electronic component includes forming the looped solder dam surrounding a target lead, to which the solder dam is to be formed, of a plurality of leads connected to the electronic component, by fitting a C-shaped fitted member to the target lead at a predetermined location.

Abstract: This image generating apparatus comprises an ink sheet cartridge storing an ink sheet. When sensing arrival of the rear end of the ink sheet, the image generating apparatus cleans the print head by rotating the print head between a printing position and a nonprinting position (separate position) thereby dropping foreign matter adhering to the print head onto the ink sheet.

Abstract: An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.

Abstract: The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.

Abstract: A polishing apparatus includes a cyclic mechanism moving cyclically in a certain direction, a holder moving cyclically by the cyclic mechanism in a direction parallel to an object to be polished, a plurality of polishing pins held on the holder, a magnet member including a first part which is exposed on a front face side of the polishing pin and a second part which is not exposed on the front face side of the polishing pin, a part of the second part being covered with a non-magnetic material, and a polishing member held on the polishing pin by magnetic force of the magnet member and polishing a tip of the object to be polished by the cyclic motion of the cyclic mechanism, wherein a contact area of the polishing member and the polishing pin includes a contact area of the magnet member and the polishing member.

Abstract: An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.

Abstract: When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment.

Abstract: A processing head is supported for pivotal movement around a pivot point in a processing apparatus. An urging member applies an urging force to the processing head at the pivot point. The processing apparatus allows establishment of point contact between the urging member and the processing head. When the surface of an object inclines from a predetermined attitude, the processing head is allowed to follow the inclination of the surface. The processing head is allowed to establish a predetermined attitude relative to the surface of the object. The processing head thus reliably enables a predetermined action to the object as desired.

Abstract: A thermal printer includes a control part; a thermal head that is heated upon a heating instruction from the control part and stops heating upon a heating-ending instruction from the control part; a temperature detector that detects a temperature of the thermal head upon a temperature detection instruction from the control part; and a feed motor that is driven upon a conveyance instruction from the control part and stops the conveyance upon a conveyance-ending instruction from the control part. The control part issues, prior to printing, the heating instruction and the conveyance instruction such that the heating of the thermal head and the conveyance of the paper are performed in parallel. The control part issues the temperature detection instruction as an interrupt every predetermined period of time after the heating instruction is issued, and issues the heating-ending instruction when the temperature of the thermal head reaches a predetermined preheat-ending temperature.

Abstract: An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.

Abstract: Metallic powder particles disperse in paste matrix made of resin material. The metallic powder particles each defines a dissolved surface layer having reacted with acid solution. The metallic powder particles having reacted with acid solution is allowed to have a high electrical conductivity. The electrically conductive paste containing the mentioned metallic powder particles is also allowed to exhibit a sufficiently high electrical conductivity. The electrically conductive paste can thus be used for establishment of a fine wiring pattern and establishment of a wiring pattern for a high speed signal, for example. Moreover, the electrically conductive paste can easily be applied to a resin sheet in a predetermined pattern based on silk-screen printing, for example. The electrically conductive paste can be employed in various applications.

Abstract: An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.