Patents by Inventor Yutaka ONEZAWA

Yutaka ONEZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220157684
    Abstract: A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 19, 2022
    Applicant: Schott AG
    Inventors: Thomas Zetterer, Robert Hettler, Antti Määttänen, Jens Ulrich Thomas, Yutaka Onezawa, Frank Gindele
  • Publication number: 20220144627
    Abstract: A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.
    Type: Application
    Filed: January 24, 2022
    Publication date: May 12, 2022
    Applicant: Schott AG
    Inventors: Jens Ulrich Thomas, Thomas Zetterer, Yutaka Onezawa, Antti Määttänen, Kurt Nattermann, Robert Hettler
  • Publication number: 20220135398
    Abstract: A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 5, 2022
    Applicant: Schott AG
    Inventors: Jens Ulrich Thomas, Thomas Zetterer, Antti Määttänen, Robert Hettler, Yutaka Onezawa
  • Publication number: 20220089474
    Abstract: A biocompatible glass substrate with through electrodes includes a glass plate of a biocompatible glass, and through electrodes made of a biocompatible metal that are provided by penetrating the glass plate. A biocompatible electronic device using this is the biocompatible electronic device including a biocompatible glass substrate with through electrode having a glass plate of a biocompatible glass, and through electrodes made of a biocompatible metal provided by penetrating the glass plate, and an electric/electronic device sealed onto the above described glass plate and is electrically connected to the above described through electrodes, and has bumps for connection on the through electrodes of the biocompatible electronic device.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 24, 2022
    Applicant: Schott Japan Corporation
    Inventors: Yutaka ONEZAWA, Akira OKUNO, Kazuhito MIYAWAKI
  • Publication number: 20210296053
    Abstract: Provided is an airtight terminal that is designed to enable implementation of a method for sealing a can case with the airtight terminal with improved readiness and at a reasonable price, as well as an electrical device package and a method for manufacturing an electrical device package. Provided is an airtight terminal that includes a lid composed of a dish-shaped thin metal sheet having a through hole in a surface of the sheet, a lead passing through the through hole in the lid, and an insulating material to hermetically seal a gap between the lead and the lid, wherein the lid has an engagement portion along an edge of the lid to seal a can case by seaming.
    Type: Application
    Filed: July 30, 2019
    Publication date: September 23, 2021
    Applicant: Schott Japan Corporation
    Inventors: Yutaka ONEZAWA, Naoki BOKUDA
  • Patent number: 10580602
    Abstract: A hermetic terminal for a high-capacity relay includes: a metal container provided with a through hole; a pipe lead inserted through the through hole; an insulating glass hermetically sealing the metal container and the pipe lead; and a terminal base passing through and hermetically secured to the pipe lead and made of a low-resistance metal.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: March 3, 2020
    Assignee: SCHOTT Japan Corporation
    Inventors: Tetsushi Morikawa, Akira Okuno, Susumu Nishiwaki, Yutaka Onezawa
  • Publication number: 20180286614
    Abstract: A hermetic terminal for a high-capacity relay includes: a metal container provided with a through hole; a pipe lead inserted through the through hole; an insulating glass hermetically sealing the metal container and the pipe lead; and a terminal base passing through and hermetically secured to the pipe lead and made of a low-resistance metal.
    Type: Application
    Filed: September 29, 2016
    Publication date: October 4, 2018
    Inventors: Tetsushi MORIKAWA, Akira OKUNO, Susumu NISHIWAKI, Yutaka ONEZAWA