Patents by Inventor Yutaka Taguchi

Yutaka Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10453951
    Abstract: A trench-gate semiconductor device including an outside trench, increases reliability of an insulating film at a corner of an open end of the outside trench. The semiconductor device includes: a gate trench reaching an inner part of an n-type drift layer in a cell region; an outside trench outside the cell region; a gate electrode formed inside the gate trench through a gate insulating film; a gate line formed inside the outside trench through an insulating film; and a gate line leading portion formed through the insulating film to cover a corner of an open end of the outside trench closer to the cell region, and electrically connecting the gate electrode to the gate line, and the surface layer of the drift layer in contact with the corner has a second impurity region of p-type that is a part of the well region.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: October 22, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yutaka Fukui, Yasuhiro Kagawa, Kensuke Taguchi, Nobuo Fujiwara, Katsutoshi Sugawara, Rina Tanaka
  • Patent number: 10351092
    Abstract: An airbag apparatus capable of protecting an occupant by restraining movement of the occupant in an obliquely forward direction and towards a far side during a collision. A far side airbag apparatus (102), which is an airbag apparatus, deploys between a driver seat (106) and a front passenger seat (108) arranged side by side in a vehicle width direction of a vehicle cabin (100). The apparatus (102) includes a cushion (120) which is embedded in a floor of the vehicle cabin (100) and reaches a height at least equal to that of a pelvis region (160) of an occupant (156) seated in either one of the driver seat (106) and the front passenger seat (108) during inflation and deployment.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: July 16, 2019
    Assignee: AUTOLIV DEVELOPMENT AB
    Inventors: Hiroyuki Taguchi, Yutaka Nakajima, Hideho Fukuda, Mitsuo Nogami, Yuto Kobayashi, Makoto Fuma
  • Patent number: 9627600
    Abstract: Provided are: an Mg—Si system thermoelectric conversion material which exhibits stably high thermoelectric conversion performance; a sintered body for thermoelectric conversion, which uses this Mg—Si system thermoelectric conversion material; a thermoelectric conversion element having excellent durability; and a thermoelectric conversion module. A method for producing an Mg—Si system thermoelectric conversion material according to the present invention comprises a step for heating and melting a starting material composition that contains Mg, Si, Sb and Zn. It is preferable that the contents of Sb and Zn in the starting material composition are respectively 0.1-3.0 at % in terms of atomic weight ratio.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: April 18, 2017
    Assignee: YASUNAGA CORPORATION
    Inventors: Tsutomu Iida, Yumiko Oto, Ryosuke Miyahara, Yutaka Taguchi
  • Publication number: 20150311419
    Abstract: Provided are: an Mg—Si system thermoelectric conversion material which exhibits stably high thermoelectric conversion performance; a sintered body for thermoelectric conversion, which uses this Mg—Si system thermoelectric conversion material; a thermoelectric conversion element having excellent durability; and a thermoelectric conversion module. A method for producing an Mg—Si system thermoelectric conversion material according to the present invention comprises a step for heating and melting a starting material composition that contains Mg, Si, Sb and Zn. It is preferable that the contents of Sb and Zn in the starting material composition are respectively 0.1-3.0 at % in terms of atomic weight ratio.
    Type: Application
    Filed: November 25, 2013
    Publication date: October 29, 2015
    Inventors: Tsutomu IIDA, Yumiko OTO, Ryosuke MIYAHARA, Yutaka TAGUCHI
  • Patent number: 9093733
    Abstract: A signal transmission device includes a differential driver, a first single-ended driver circuit block, a second single-ended driver circuit block, a control circuit, and a common-mode filter. In the case where two-channel single-ended transmission is performed by using the first and second single-ended driver circuit blocks, the control circuit controls a driving capability of the first single-ended driver circuit block and a driving capability of the second single-ended driver circuit block in accordance with a combination of a change in a logical value of an output signal of the first single-ended driver circuit block and a change in a logical value of an output signal of the second single-ended driver circuit block.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: July 28, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi Suenaga, Yutaka Taguchi, Atsushi Shinkai, Takaharu Yoshida, Osamu Shibata, Chie Sasaki
  • Publication number: 20150207056
    Abstract: Disclosed is an aluminum-magnesium-silicon composite material that contains an alloy comprising Al, Mg, and Si and can be used favorably as a material for a thermoelectric conversion module, and that has excellent thermoelectric conversion properties. The aluminum-magnesium-silicon composite material contains an alloy comprising Al, Mg and Si, and has an electrical conductivity (?) of 1000-3000 S/cm at 300 K. This aluminum-magnesium-silicon composite material is favorable in the production of a thermoelectric exchange element as a result of having excellent thermoelectric conversion properties.
    Type: Application
    Filed: March 27, 2015
    Publication date: July 23, 2015
    Applicant: Tokyo University of Science Educational Foundation Administrative Organization
    Inventors: Tsutomu IIDA, Naoki FUKUSHIMA, Tatsuya SAKAMOTO, Yohiko MITO, Hirokuni NANBA, Yutaka TAGUCHI, Masayasu AKASAKA, Mamoru TACHIKAWA, Takakazu HINO
  • Publication number: 20150162654
    Abstract: A signal transmission device includes a differential driver, a first single-ended driver circuit block, a second single-ended driver circuit block, a control circuit, and a common-mode filter. In the case where two-channel single-ended transmission is performed by using the first and second single-ended driver circuit blocks, the control circuit controls a driving capability of the first single-ended driver circuit block and a driving capability of the second single-ended driver circuit block in accordance with a combination of a change in a logical value of an output signal of the first single-ended driver circuit block and a change in a logical value of an output signal of the second single-ended driver circuit block.
    Type: Application
    Filed: February 16, 2015
    Publication date: June 11, 2015
    Inventors: HIROSHI SUENAGA, YUTAKA TAGUCHI, ATSUSHI SHINKAI, TAKAHARU YOSHIDA, OSAMU SHIBATA, CHIE SASAKI
  • Publication number: 20120118343
    Abstract: Disclosed is an aluminum-magnesium-silicon composite material that contains an alloy comprising Al, Mg, and Si and can be used favorably as a material for a thermoelectric conversion module, and that has excellent thermoelectric conversion properties. The aluminum-magnesium-silicon composite material contains an alloy comprising Al, Mg and Si, and has an electrical conductivity (?) of 1000-3000 S/cm at 300 K. This aluminum-magnesium-silicon composite material is favorable in the production of a thermoelectric exchange element as a result of having excellent thermoelectric conversion properties.
    Type: Application
    Filed: July 26, 2010
    Publication date: May 17, 2012
    Inventors: Tsutomu Iida, Naoki Fikushima, Tatsuya Sakamoto, Yohiko Mito, Hirokuni Nanba, Yutaka Taguchi, Masayasu Akasaka, Mamoru Tachikawa, Takakazu Hino
  • Publication number: 20120097205
    Abstract: Provided is a magnesium-silicon composite material which contains Mg2Si as an intermetallic compound imposing no burden on the environment, is suitable for use as a material for thermoelectric conversion modules, and has excellent thermoelectric conversion performance. The magnesium-silicon composite material has a dimensionless figure-of-merit parameter at 866K of 0.665 or larger. This magnesium-silicon composite material can have high thermoelectric conversion performance when used in, for example, a thermoelectric conversion module.
    Type: Application
    Filed: June 30, 2010
    Publication date: April 26, 2012
    Applicant: Tokyo University of Science Educational Foundation Administrative Organization
    Inventors: Tsutomu Iida, Yasuhiko Honda, Naoki Fukushima, Tatsuya Sakamoto, Yohiko Mito, Hirokuni Nanba, Yutaka Taguchi
  • Patent number: 7385286
    Abstract: At least four terminal electrodes are provided on a surface of multi-layer substrate main body. An electric functional layer is selectively provided at an internal area of said multi-layer substrate placed at a downward position of all terminal electrodes in a substrate thickness direction. A semiconductor device is flip-chip-bonded to the terminal electrodes. Thus, the semiconductor device is electrically connected to the electric functional layer at a short distance. As a result, a reduction in parasitic inductance and an improvement in high frequency characteristic can be accomplished. Generation of height variations between the terminal electrodes can be prevented, and the semiconductor device is stably flip-chip-bonded to the multi-layer substrate.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: June 10, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Iwaki, Tetsuyoshi Ogura, Yutaka Taguchi
  • Patent number: 7336234
    Abstract: An antenna apparatus includes a monopole antenna forming an antenna element having a metal shell body, and the antenna element has an approximately conical part, a vertex of which is on the side of a power supply part.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: February 26, 2008
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yutaka Taguchi, Hideki Kusunoki, Toshiyasu Tanaka
  • Patent number: 7248482
    Abstract: A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: July 24, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Asahi, Yutaka Taguchi, Yasuhiro Sugaya, Seiichi Nakatani, Toshio Fujii
  • Publication number: 20070137890
    Abstract: A signal transmitting lead 105 is provided on an electrically insulating layer 103. Auxiliary leads 104A and 104B are provided while the auxiliary leads 104A and 104B are not in electrical contact with the signal transmitting lead 105. At least a part of the auxiliary leads 104A and 104B is covered with an electromagnetic shielding layer 106. Consequently, radiant noise from the inside or the outside of a printed wiring board can be suppressed without degrading characteristics of a signal which is transmitted through the signal transmitting lead 105.
    Type: Application
    Filed: January 29, 2007
    Publication date: June 21, 2007
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyoshi Tagi, Tetsuyoshi Ogura, Yutaka Taguchi, Toshiyuki Asahi, Tatsuo Ogawa
  • Publication number: 20060139225
    Abstract: An antenna apparatus includes a monopole antenna forming an antenna element having a metal shell body, and the antenna element has an approximately conical part, a vertex of which is on the side of a power supply part.
    Type: Application
    Filed: December 23, 2005
    Publication date: June 29, 2006
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yutaka Taguchi, Hideki Kusunoki, Toshiyasu Tanaka
  • Patent number: 7061100
    Abstract: A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element.
    Type: Grant
    Filed: April 2, 2003
    Date of Patent: June 13, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Iwaki, Yutaka Taguchi, Tetsuyosi Ogura, Yasuhiro Sugaya, Toshiyuki Asahi, Tousaku Nishiyama, Yoshinobu Idogawa
  • Patent number: 6998932
    Abstract: A high-frequency switch having two input terminals and two output terminals of which a broad pass band is required has (i) a circuit board that has two input electrodes along one side and two output electrodes along another side, and (ii) four PIN diodes mounted on this circuit board. Each side of the quadrangle made by connecting the input electrodes and the output electrodes is not parallel to the corresponding side of the quadrangle made by connecting electrodes for mounting the PIN diodes. Each side and the corresponding side form an angle other than 180°. This structure can provide a high-frequency switch capable of reducing a transmission loss in the paths and facilitating impedance matching.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: February 14, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yutaka Taguchi, Yuki Satoh
  • Patent number: 6885788
    Abstract: A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: April 26, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Iwaki, Yutaka Taguchi, Tetsuyoshi Ogura, Yasuhiro Sugaya, Toshiyuki Asahi, Tousaku Nishiyama, Yoshinobu Idogawa
  • Patent number: 6870264
    Abstract: An insulator is provided between interconnect layers oppositely placed. The interconnect layers are connected between by connection members provided through the insulator. The connection members at one and the other ends are connected between in their center positions. A shield layer is provided spaced from the intermediate connection layer generally on a same plane as the intermediate connection layer. A condition of (R·r)/(2·h)?L?(5·R·r)/h is satisfied, provided that a connection distance between the interconnect layers through the connection members and the intermediate connection layer is h, the connection members where considered generally as a circular cylinder have a diameter R, the intermediate connection layer where considered generally as circular has a diameter r, and a spaced distance between the intermediate connection layer and the shield layer is L. Thus, characteristic impedance is stabilized.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: March 22, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Iwaki, Yutaka Taguchi, Tetsuyoshi Ogura
  • Publication number: 20040226744
    Abstract: A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.
    Type: Application
    Filed: May 12, 2004
    Publication date: November 18, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshiyuki Asahi, Yutaka Taguchi, Yasuhiro Sugaya, Seiichi Nakatani, Toshio Fujii
  • Publication number: 20040189420
    Abstract: A high-frequency switch having two input terminals and two output terminals of which a broad pass band is required has (i) a circuit board that has two input electrodes along one side and two output electrodes along another side, and (ii) four PIN diodes mounted on this circuit board. Each side of the quadrangle made by connecting the input electrodes and the output electrodes is not parallel to the corresponding side of the quadrangle made by connecting electrodes for mounting the PIN diodes. Each side and the corresponding side form an angle other than 180°. This structure can provide a high-frequency switch capable of reducing a transmission loss in the paths and facilitating impedance matching.
    Type: Application
    Filed: March 24, 2004
    Publication date: September 30, 2004
    Inventors: Yutaka Taguchi, Yuki Satoh