Patents by Inventor Yuto Oyama

Yuto Oyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper plating bath containing a tertiary amine compound and use thereof
    Patent number: 9321741
    Abstract: Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: April 26, 2016
    Assignee: JCU CORPORATION
    Inventors: Hiroki Yasuda, Ryoichi Kimizuka, Tatsuji Takasu, Takuro Sato, Hiroshi Ishizuka, Yasuhiro Ogo, Yuto Oyama, Yu Tonooka, Mikiko Kosaka, Aya Shimomura, Yumiko Shimizu
  • NOVEL COMPOUND AND USE THEREOF
    Publication number: 20130043137
    Abstract: Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.
    Type: Application
    Filed: April 30, 2010
    Publication date: February 21, 2013
    Applicant: JCU CORPORATION
    Inventors: Hiroki Yasuda, Ryoichi Kimizuka, Tatsuji Takasu, Takuro Sato, Hiroshi Ishizuka, Yasuhiro Ogo, Yuto Oyama, Yu Tonooka, Mikiko Kosaka, Aya Shimomura, Yumiko Shimizu