Abstract: A thin display device includes a display unit and an outer casing accommodating a device component constituting a display unit together with the display unit. Upper corner regions and lower corner regions of the outer casing are held by upper corner shock-absorbing members and lower corner shock-absorbing members disposed separately at upper corners and lower corners of a packing box when the thin display device is accommodated in the packing box. The device component is accommodated in a peripheral portion in the outer casing. A center of gravity of the device component is positioned within a region of the outer casing where the upper corner shock-absorbing member holds the outer casing and a region of the outer casing where the lower shock-absorbing member holds the outer casing.

Abstract: A flat display device includes a display unit and an outer casing accommodating the display unit. Upper corner regions and lower corner regions of the outer casing are held by upper corner shock-absorbing members and lower corner shock-absorbing members disposed separately at upper corners and lower corners of a packing box when the flat display device is accommodated in the packing box. The outer casing includes a front cabinet disposed on a side of a display surface of the display unit and a back cabinet covering a rear surface of the display unit. The back cabinet is attached to the front cabinet by screw fastening portions at a peripheral portion of the back cabinet. In the upper and lower corner regions of the outer casing, the screw fastening portions of the back cabinet are positioned within regions held by the shock-absorbing members.

Abstract: A DC/AC inverter substrate includes a voltage abnormality detector circuit. All of a high voltage side detection sensor, a low voltage side detection sensor, and a high-voltage and low-voltage detection sensor in the voltage abnormality detector circuit are disposed without being electrically connected to a secondary side of a transformer or to a connection point. Those detection sensors are not damaged since overvoltage is not applied to the voltage abnormality detector circuit when abnormal discharge occurs because the detection sensors are not electrically connected.

Abstract: A thin display device includes a display unit and an outer casing accommodating a device component constituting a display unit together with the display unit. Upper corner regions and lower corner regions of the outer casing are held by upper corner shock-absorbing members and lower corner shock-absorbing members disposed separately at upper corners and lower corners of a packing box when the thin display device is accommodated in the packing box. The device component is accommodated in a peripheral portion in the outer casing. A center of gravity of the device component is positioned within a region of the outer casing where the upper corner shock-absorbing member holds the outer casing and a region of the outer casing where the lower shock-absorbing member holds the outer casing.

Abstract: A thin flat display includes a display unit and an outer casing accommodating the display unit. Upper corner regions and lower corner regions of the outer casing are held by upper corner shock-absorbing members and lower corner shock-absorbing members disposed separately at upper corners and lower corners of a packing box when the flat display device is accommodated in the packing box. The outer casing includes a front cabinet disposed on a side of a display surface of the display unit and a back cabinet covering a rear surface of the display unit. The back cabinet is attached to the front cabinet by screw fastening portions at a peripheral portion of the back cabinet. In the upper and lower corner regions of the outer casing, the screw fastening portions of the back cabinet are positioned within regions held by the shock-absorbing members. Damages caused by a mechanical impact suffered during transportation can be prevented.

Abstract: A DC/AC inverter substrate includes a voltage abnormality detector circuit. All of a high voltage side detection sensor, a low voltage side detection sensor, and a high-voltage and low-voltage detection sensor in the voltage abnormality detector circuit are disposed without being electrically connected to a secondary side of a transformer or to a connection point. Those detection sensors are not damaged since overvoltage is not applied to the voltage abnormality detector circuit when abnormal discharge occurs because the detection sensors are not electrically connected.

Abstract: A DC/AC inverter substrate includes a voltage abnormality detector circuit. All of a high voltage side detection sensor, a low voltage side detection sensor, and a high-voltage and low-voltage detection sensor in the voltage abnormality detector circuit are disposed without being electrically connected to a secondary side of a transformer or to a connection point. Those detection sensors are not damaged since overvoltage is not applied to the voltage abnormality detector circuit when abnormal discharge occurs because the detection sensors are not electrically connected.

Abstract: A DC/AC inverter substrate includes a voltage abnormality detector circuit. All of a high voltage side detection sensor, a low voltage side detection sensor, and a high-voltage and low-voltage detection sensor in the voltage abnormality detector circuit are disposed without being electrically connected to a secondary side of a transformer or to a connection point. Those detection sensors are not damaged since overvoltage is not applied to the voltage abnormality detector circuit when abnormal discharge occurs because the detection sensors are not electrically connected.

Abstract: A plurality of individually retractable racks on which a single module is mounted on each rack is disposed on the upper and middle tiers of a portable carriage main body. Provided to the lower tier of the carriage main body are a operating panel for setting work content and conditions; a signal source for selectively outputting a circuit adjustment signal, an aging testing signal, and a display inspection signal; a power supply for circuit adjustment, a power supply for aging testing, and a power supply for display inspection; and an output unit for selecting an operation from circuit adjustment, aging testing, and display inspection on the basis of the work content and work conditions that have been input in the operating panel, and feeding the power and signals for the selected operation to the modules.

Abstract: A plurality of individually retractable racks on which a single module is mounted on each rack is disposed on the upper and middle tiers of a portable carriage main body. Provided to the lower tier of the carriage main body are a operating panel for setting work content and conditions; a signal source for selectively outputting a circuit adjustment signal, an aging testing signal, and a display inspection signal; a power supply for circuit adjustment, a power supply for aging testing, and a power supply for display inspection; and an output unit for selecting an operation from circuit adjustment, aging testing, and display inspection on the basis of the work content and work conditions that have been input in the operating panel, and feeding the power and signals for the selected operation to the modules.

Abstract: A thermo-compression bonding apparatus is for thermo-compressing a TCP and a substrate layer to connect electrode terminals. The thermo-compression bonding apparatus has a heating unit 1 for auxiliary heating a laminate which is heated by a compression bonding head whose temperature is kept at a predetermined temperature.

Abstract: A field effect transistor including a gate electrode divided into a plurality of parts in the gate-length direction. The gate electrode makes Schottky-contacts with a semiconductor layer or is formed on the semiconductor layer through a gate insulating film.

Abstract: A field effect semiconductor device which restricts current flow through a drain-gate path, but allows current to easily flow through a gate-source path. A high potential barrier layer is formed on the drain side of an active layer. The potential barrier layer has a wider energy band gap than the active layer. A source electrode and a drain electrode make ohmic contact with the active layer and a gate electrode exists between the source electrode and the drain electrode. The gate electrode is partially formed on the potential barrier layer and makes Schottky contact with the active layer on the source side of the semiconductor device and makes Schottky contact with the potential barrier layer on the drain side of the semiconductor device.

Abstract: A method of producing a compound semiconductor device comprises the steps of: forming a recess portion on a compound semiconductor substrate; forming an ion penetrating mask on the recess portion in such a manner that the surfaces of the compound semiconductor substrate and the ion penetrating mask are level; forming an active layer having a substantially uniform depth is the compound semiconductor by implanting impurity ions into the entire exposed surface and, removing the ion penetrating mask and forming a gate electrode at the recess portion.