Patents by Inventor Yuuichi Yamagishi

Yuuichi Yamagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6400168
    Abstract: In a tip portion structure basically having a substrate, a plate spring, and a ground block, the substrate is attached to a signal line on a back surface of the substrate and is contacted on the tip with the signal electrode of the DUT placed on a device stage. The plate spring is made of a resilient material, placed on the front side of the substrate, and positioned to apply a pressure to the substrate. The ground block is positioned between the signal line and the device stage functioned as a ground electrode of the DUT. Alternatively, the tip portion structure further may have a ground plate or a ground surface formed of a conductive thin plate covering entirely the front surface of the substrate, and shaped to surround the signal line in cooperation with the ground block. A plurality of the signal lines may be arranged in parallel on the same plane of the substrate.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: June 4, 2002
    Assignees: NEC Corporation, Anritsu Corporation
    Inventors: Kouji Matsunaga, Hirobumi Inoue, Masao Tanehashi, Toru Taura, Masahiko Nikaidou, Yuuichi Yamagishi, Satoshi Hayakawa
  • Publication number: 20010038294
    Abstract: In a tip portion structure basically having a substrate, a plate spring, and a ground block, the substrate is attached to a signal line on a back surface of the substrate and is contacted on the tip with the signal electrode of the DUT placed on a device stage. The plate spring is made of a resilient material, placed on the front side of the substrate, and positioned to apply a pressure to the substrate. The ground block is positioned between the signal line and the device stage functioned as a ground electrode of the DUT. Alternatively, the tip portion structure further may have a ground plate or a ground surface formed of a conductive thin plate covering entirely the front surface of the substrate, and shaped to surround the signal line in cooperation with the ground block. A plurality of the signal lines may be arranged in parallel on the same plane of the substrate.
    Type: Application
    Filed: June 22, 2001
    Publication date: November 8, 2001
    Inventors: Kouji Matsunaga, Hirobumi Inoue, Masao Tanehashi, Toru Taura, Masahiko Nikaidou, Yuuichi Yamagishi, Satoshi Hayakawa
  • Patent number: 6310483
    Abstract: A high-frequency probe according to the present invention comprises a probe chip that has an end part that is pressed to an electrode and is covered by a electrically conductive outer enclosure, and slides in a vertical direction by an inner surface of this electrically conductive outer enclosure inside this electrically conductive outer enclosure. A signal conductive pattern is fixed inside this probe chip and is connected with a inner conductor having elasticity. The inner conductor can be bent in the vertical direction at a central part of a hole having an opening, which is sufficiently long in the vertical direction, in the center space of a ground conductor, which is fixed to an end part of the main block, when the inner conductor is pressed due to contact of the end part. In addition, the high-frequency probe has a thin shape of a maximum thickness in a transverse direction which is perpendicular to the vertical direction that is a direction of the probe being pressed to a device electrode.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: October 30, 2001
    Assignees: NEC Corporation, Anritsu Corporation
    Inventors: Toru Taura, Hirobumi Inoue, Masao Tanehashi, Kouji Matsunaga, Yuuichi Yamagishi, Satoshi Hayakawa, Hironori Tsugane
  • Patent number: 6281691
    Abstract: In a tip portion structure basically having a substrate, a plate spring, and a ground block, the substrate is attached to a signal line on a back surface of the substrate and is contacted on the tip with the signal electrode of the DUT placed on a device stage. The plate spring is made of a resilient material, placed on the front side of the substrate, and positioned to apply a pressure to the substrate. The ground block is positioned between the signal line and the device stage functioned as a ground electrode of the DUT. Alternatively, the tip portion structure further may have a ground plate or a ground surface formed of a conductive thin plate covering entirely the front surface of the substrate, and shaped to surround the signal line in cooperation with the ground block . A plurality of the signal lines may be arranged in parallel on the same plane of the substrate.
    Type: Grant
    Filed: June 9, 1999
    Date of Patent: August 28, 2001
    Assignees: NEC Corporation, Amritsu Corporation
    Inventors: Kouji Matsunaga, Hirobumi Inoue, Masao Tanehashi, Toru Taura, Masahiko Nikaidou, Yuuichi Yamagishi, Satoshi Hayakawa
  • Patent number: 6242930
    Abstract: In a high-frequency probe having a detachable end according to the present invention, parts relating to replacement of an end unit are three parts, that is, an end unit, a probe body, and a pressure block. The end unit comprises a coaxial cable, two slender plate-like ground plates. The coaxial cable is linear in the direction of the end of the high-frequency probe. The ground plates sandwich the coaxial cable. The probe body has an end unit support surface, a circuit board, an end unit arrangement surface and an end part guide. The end unit support surface forms a perpendicular surface used for fixing the end unit to a predetermined position in the end side of the central block in a central part of a surface of the body block. The circuit board connects the end unit to a coaxial connector. The end unit arrangement surface forms a plane in an end side of the body block. And further the guide groove positions and fixes the ground plate in the end part.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: June 5, 2001
    Assignees: NEC Corporation, Antritsu Corporation
    Inventors: Kouji Matsunaga, Hirobumi Inoue, Masao Tanehashi, Toru Taura, Masahiko Nikaidou, Yuuichi Yamagishi, Satoshi Hayakawa, Hironori Tsugane
  • Patent number: 6229321
    Abstract: A process for manufacturing a high frequency multichip module includes a reception inspection step which includes steps of preparing a vertical-type probe, setting the high frequency bare chip on a device stage, and measuring high frequency characteristics of the high frequency bare chip using the vertical-type probe. The prepared vertical-type probe has a center conductor and ground conductors arranged at both sides of the tip portion of the center conductor in the vertical direction in which the probe is pressed to electrodes of the high frequency bare chip. The high frequency bare chip has a ground electrode disposed at the opposite side of the chip from the signal electrodes on the upper surface of a device stage. Then, only a good product is fed to the next step. After the reception inspection, the process goes to a component mounting step.
    Type: Grant
    Filed: January 27, 1999
    Date of Patent: May 8, 2001
    Assignees: NEC Corporation, Anritsu Corporation
    Inventors: Kouji Matsunaga, Hirobumi Inoue, Masao Tanehashi, Masahiko Nikaidou, Toru Taura, Yuuichi Yamagishi, Satoshi Hayakawa