Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: There is provided a solid-state imaging device including: a pixel region that includes a plurality of pixels arranged in a two-dimensional matrix pattern. Some of the plurality of pixels are configured to be phase difference detection pixels that include a photoelectric conversion section disposed on a semiconductor substrate and a light blocking film disposed above a portion of the photoelectric conversion section. In particular a location of the light blocking film for the phase difference detection pixels varies according to a location of the phase difference detection pixel. For example, the location of the light blocking film for a phase difference detection pixel positioned at a periphery of the pixel region is different than a location of the light blocking film for a phase difference detection pixel positioned in a center portion of the pixel region.

Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.

Abstract: There is provided a solid-state imaging device including: a pixel region that includes a plurality of pixels arranged in a two-dimensional matrix pattern. Some of the plurality of pixels are configured to be phase difference detection pixels that include a photoelectric conversion section disposed on a semiconductor substrate and a light blocking film disposed above a portion of the photoelectric conversion section. In particular a location of the light blocking film for the phase difference detection pixels varies according to a location of the phase difference detection pixel. For example, the location of the light blocking film for a phase difference detection pixel positioned at a periphery of the pixel region is different than a location of the light blocking film for a phase difference detection pixel positioned in a center portion of the pixel region.

Abstract: According to the present invention, in the field of packaging the chip component, increase in speed and stability in packaging the chip component is achieved without significantly increasing the cost of the device. The size of the suction face of the suction nozzle is set so as to be larger than the relevant chip component. Near the inserting position P of the chip component, a push cover is provided in close proximity to the upper surface of the carrier tape. A hole is provided in the push cover at the inserting position P, and the size of the hole is slightly larger than the size of the tip face of the suction nozzle. After the chip component held to the suction nozzle enters the component-accommodating recess of the carrier tape, the suction of the suction nozzle is released and the carrier tape starts to move in the direction shown with an arrow, orthogonal to the suction nozzle. The suction nozzle is raised after the opening of the component-accommodating recess is completely under the push cover.

Abstract: According to the present invention, in the field of packaging the chip component, increase in speed and stability in packaging the chip component is achieved without significantly increasing the cost of the device. The size of the suction face of the suction nozzle is set so as to be larger than the relevant chip component. Near the inserting position P of the chip component, a push cover is provided in close proximity to the upper surface of the carrier tape. A hole is provided in the push cover at the inserting position P, and the size of the hole is slightly larger than the size of the tip face of the suction nozzle. After the chip component held to the suction nozzle enters the component-accommodating recess of the carrier tape, the suction of the suction nozzle is released and the carrier tape starts to move in the direction shown with an arrow, orthogonal to the suction nozzle. The suction nozzle is raised after the opening of the component-accommodating recess is completely under the push cover.

Abstract: A roller assembly which can be arranged in the guide path of a continuous casting machine for casting beam blanks, comprising first roller means for rotationally abutting against outer flange faces of the beam blank and second roller means for rotationally abutting against each pair of flange tips on either side of the beam blank. The rotational axes of the second roller means extending substantially perpendicular to the rotational axes of the first roller means. Third roller means rotationally abut against each web part of the beam blank. The rotational axes of the third roller means extend substantially coaxially with respect to the corresponding rotational axes of the second roller means. A second roller means and a third roller means on one side of the beam blank can rotate relative to one another.