Patents by Inventor Yuuji Toshaka

Yuuji Toshaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive for printed wiring board and production thereof
    Patent number: 5419946
    Abstract: An adhesive composition containing a special internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester, said alkyl moiety having 6 to 18 carbon atoms, and an amine in addition to major components of an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler is suitable for producing printed wiring boards by an additive process excellent in adhesiveness to plated copper.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: May 30, 1995
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shin Takanezawa, Teturou Irino, Yuuji Toshaka, Takashi Kagaya