Patents by Inventor Yuuki Fukuda

Yuuki Fukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11476226
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: October 18, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takanori Uejima, Yuji Takematsu, Naoya Matsumoto, Shou Matsumoto, Tetsuro Harada, Dai Nakagawa, Yutaka Sasaki, Yuuki Fukuda
  • Publication number: 20220213269
    Abstract: A polyimide resin composition includes a polyimide resin (A) including a repeating structural units of formulas (1) and (2). The content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural units of the formulas (1) and (2) is 20 to 70 mol %. The polyimide resin composition further includes a fatty acid metal salt (B) including a fatty acid having 12 to 36 carbon atoms and optionally having a hydroxy group and at least one of an alkali metal, an alkaline earth metal, and a transition metal: wherein R1 represents a divalent group having 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having 6 to 22 carbon atoms containing at least one aromatic ring.
    Type: Application
    Filed: May 7, 2020
    Publication date: July 7, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi SAKAI, Yuuki SATO, Fumihiro FUKUDA
  • Patent number: 11309925
    Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: April 19, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Sho Matsumoto, Takanori Uejima, Yuji Takematsu, Tetsuro Harada, Dai Nakagawa, Naoya Matsumoto, Yutaka Sasaki, Yuuki Fukuda
  • Publication number: 20210226652
    Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.
    Type: Application
    Filed: April 7, 2021
    Publication date: July 22, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Sho MATSUMOTO, Takanori UEJIMA, Yuji TAKEMATSU, Tetsuro HARADA, Dai NAKAGAWA, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20210219419
    Abstract: A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.
    Type: Application
    Filed: March 30, 2021
    Publication date: July 15, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yuji TAKEMATSU, Takanori UEJIMA, Sho MATSUMOTO, Tetsuro HARADA, Dai NAKAGAWA, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Patent number: 10971466
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: April 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsunari Nakazawa, Takanori Uejima, Motoji Tsuda, Yuji Takematsu, Dai Nakagawa, Tetsuro Harada, Masahide Takebe, Naoya Matsumoto, Yoshiaki Sukemori, Mitsunori Samata, Yutaka Sasaki, Yuuki Fukuda
  • Publication number: 20200251459
    Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.
    Type: Application
    Filed: February 3, 2020
    Publication date: August 6, 2020
    Inventors: Motoji TSUDA, Takanori UEJIMA, Yuji TAKEMATSU, Katsunari NAKAZAWA, Masahide TAKEBE, Shou MATSUMOTO, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20200211998
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Inventors: Takanori UEJIMA, Yuji TAKEMATSU, Naoya MATSUMOTO, Shou MATSUMOTO, Tetsuro HARADA, Dai NAKAGAWA, Yutaka SASAKI, Yuuki FUKUDA
  • Patent number: 10607810
    Abstract: The vibration control system configured to control vibration of a vibration-controlled object is disclosed. The vibration control system comprises: (i) actuator units each including a piezoelectric element configured to expand and contract; (ii) a drive power source configured to supply drive voltages to the piezoelectric elements of the actuator units for causing the piezoelectric elements to expand and contract; (iii) a vibration detector configured to detect a status of vibration of the vibration-controlled object; and (iv) a vibration controller configured to control the vibration of the vibration-controlled object by controlling the voltages supplied by the drive power source to the piezoelectric elements of the actuator units based on the status of vibration detected by the vibration detector, respectively.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: March 31, 2020
    Assignee: NuFlare Technology, Inc.
    Inventors: Michihiro Kawaguchi, Kiminobu Akeno, Kiyoshi Nakaso, Keita Ideno, Shintaro Yamamoto, Keisuke Goto, Hitoshi Matsushita, Hirokazu Yoshioka, Ryouta Inoue, Yuuki Fukuda
  • Publication number: 20200051943
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20190214224
    Abstract: The vibration control system configured to control vibration of a vibration-controlled object is disclosed. The vibration control system comprises: (i) actuator units each including a piezoelectric element configured to expand and contract; (ii) a drive power source configured to supply drive voltages to the piezoelectric elements of the actuator units for causing the piezoelectric elements to expand and contract; (iii) a vibration detector configured to detect a status of vibration of the vibration-controlled object; and (iv) a vibration controller configured to control the vibration of the vibration-controlled object by controlling the voltages supplied by the drive power source to the piezoelectric elements of the actuator units based on the status of vibration detected by the vibration detector, respectively.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 11, 2019
    Applicant: NuFlare Technology, Inc.
    Inventors: Michihiro Kawaguchi, Kiminobu Akeno, Kiyoshi Nakaso, Keita Ideno, Shintaro Yamamoto, Keisuke Goto, Hitoshi Matsushita, Hirokazu Yoshioka, Ryouta Inoue, Yuuki Fukuda
  • Publication number: 20160222182
    Abstract: An ethylene-propylene-diene rubber foamed material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber and a thermoplastic resin having a melting point of 60 to 140° C. The thermoplastic resin content with respect to 100 parts by mass of the ethylene-propylene-diene rubber is 5 to 50 parts by mass and the ethylene-propylene-diene rubber includes an ethylene-propylene-diene rubber having a diene amount of 4.0 mass % or more.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 4, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuuki FUKUDA, Takumi KOUSAKA
  • Patent number: 9275778
    Abstract: The present invention relates to a permanent magnet obtained by wet-mixing a Dy compound or a Tb compound with a magnet raw material to coat a surface of the magnet raw material with the Dy compound or the Tb compound, and sintering a green sheet obtained by mixing the resulting magnet raw material with a resin binder and molding the resulting mixture. Since the present invention has the above-mentioned constitution, it becomes possible to sufficiently improve coercive force by Dy or Tb while decreasing the amount of Dy or Tb used. Further, it can be prevented that Dy or Tb is solid-solutionized in magnet particles to decrease residual magnetization.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: March 1, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Izumi Ozeki, Katsuya Kume, Junichi Nakayama, Yuuki Fukuda, Toshinobu Hoshino, Tomokazu Horio
  • Patent number: 9093218
    Abstract: A method for producing a permanent magnet for a motor, including a step of producing a slurry of a magnet powder, a step of molding the slurry into a sheet form to prepare green sheets of the magnet powder, and a step of alternately laminating the green sheets of the magnet powder and an insulating layer and sintering the laminated plural layers.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: July 28, 2015
    Assignees: NITTO DENKO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Izumi Ozeki, Katsuya Kume, Junichi Nakayama, Yuuki Fukuda, Toshinobu Hoshino, Tomokazu Horio, Kenji Nakamura
  • Patent number: 8643531
    Abstract: An electromagnetic wave absorber includes a dielectric layer, a divided conductive film layer and an electromagnetic wave reflective layer, wherein a ratio of thickness ‘d’ and wavelength ‘?’ satisfies a condition of [0.01?d/?0.03], weight per unit area of the electromagnetic wave absorber falls within a range of 1000 g/m2 and 3000 g/m2. The divided conductive film layer is configured such that each side's length of conductive films is dimensioned within a range of 0.5 mm and 4.8 mm and arrangement distance between adjoining conductive films is taken within a range of 0.01 mm and 3 mm.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: February 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yuuki Fukuda, Takashi Wano, Masataka Tada, Osamu Hashimoto
  • Publication number: 20130306364
    Abstract: Disclosed is an electromagnetic wave shielding sheet for use in wireless power transmission which suppresses electromagnetic wave leakage in a broad range and which is easily adaptable to various types of wireless power transmitters. The disclosed electromagnetic wave shielding sheet is used in a wireless transmitter and has a multilayer structure including at least one metal layer and at least one magnetic material layer.
    Type: Application
    Filed: May 16, 2011
    Publication date: November 21, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hidenori Suzuki, Takashi Wano, Masataka Tada, Yuuki Fukuda
  • Patent number: 8500922
    Abstract: The present invention relates to a permanent magnet manufactured by steps of: pulverizing a magnet raw material into fine particles having a grain size of 3 ?m or less; mixing the pulverized magnet raw material with a rust preventive oil in which a high-melting metal element-containing organic compound or a precursor of a high-melting ceramic is dissolved, thereby preparing a slurry; compression molding the slurry to form a molded body; and sintering the molded body.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: August 6, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Izumi Ozeki, Katsuya Kume, Junichi Nakayama, Yuuki Fukuda, Toshinobu Hoshino, Tomokazu Horio
  • Publication number: 20130120959
    Abstract: The dielectric sheet of the present invention is made of a sheet having a thickness of 5-30 ?m, which is formed by drying a coated film of a coating liquid containing a resin and a natural graphite powder having an average particle diameter of 10 ?m or less. Preferably, the sheet is formed from a coating liquid containing a resin, a natural graphite powder having an average particle diameter of 10 ?m or less, and a solvent, wherein the content rate of the natural graphite powder to the resin exceeds 5% by volume and is not more than 20% by volume, and the total content of the resin and the natural graphite powder is 10-55 wt %.
    Type: Application
    Filed: May 27, 2011
    Publication date: May 16, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi Wano, Masataka Tada, Yuuki Fukuda, Osamu Hashimoto, Ryoji Tamaru
  • Patent number: 8333848
    Abstract: The present invention relates to a permanent magnet manufactured by steps of: wet-pulverizing a high-melting metal element-containing organic compound or a precursor of a high-melting ceramic in a solvent together with a magnet raw material to pulverize the magnet raw material into fine particles having a grain size of 3 ?m or less and to coat a surface of the pulverized magnet raw material with the high-melting metal element-containing organic compound or the precursor of the high-melting ceramic; adding a resin binder to the magnet raw material coated with the high-melting metal element-containing organic compound or the precursor of the high-melting ceramic; producing a slurry by kneading the magnet raw material and the resin binder; molding the slurry into a sheet form to prepare a green sheet; and sintering the green sheet.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: December 18, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Izumi Ozeki, Katsuya Kume, Junichi Nakayama, Yuuki Fukuda, Toshinobu Hoshino, Tomokazu Horio
  • Patent number: 8211270
    Abstract: A method of detaching two plates adhered via an adhesive sheet or a curable resin layer, comprising moving, relatively parallel to each other, said two plates to develop a shear stress causing rupture of said adhesive sheet or curable resin layer. According to the present invention, two plates bonded via an adhesive sheet or a curable resin layer can be detached by only moving the two plates relatively parallel to each other. Therefore, even when at least one of the two plates is thin and poor in flexibility, two plates can be detached from each other substantially without a force (load) which causes high distortion (deformation) producing a breakage or crack on the plates. Accordingly, for example, when two optical plates adhered via a transparent adhesive sheet need to be re-bonded, two optical plates can be detached from each other and adhered again. Thus, the production cost of equipment with a display function, which carries a flat-panel display, can be reduced.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: July 3, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Tatsuya Suzuki, Ryuuichi Kabutoya, Yuuki Fukuda