Patents by Inventor Yuusuke Takano

Yuusuke Takano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150171021
    Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes forming a sealing resin layer containing an inorganic filler so as to seal a semiconductor chip, removing a portion of the surface of the sealing resin layer by dry etching such that a portion of the inorganic filler is exposed, and forming a shield layer so as to cover at least the sealing resin layer.
    Type: Application
    Filed: September 2, 2014
    Publication date: June 18, 2015
    Inventors: Yuusuke TAKANO, Takashi IMOTO, Takeshi WATANABE, Soichi HOMMA, Katsunori SHIBUYA
  • Publication number: 20150171060
    Abstract: In a manufacturing method of a semiconductor device according to an embodiment, a plurality of semiconductor packages each including a semiconductor chip mounted on a wiring board and a sealing resin layer as objects to be processed, and a tray including a plurality of housing parts are prepared. A depressed portion having a non-penetrating shape or a penetrating shape is formed in the housing part. The semiconductor packages are disposed in the plural housing parts respectively. By sputtering a metal material on the semiconductor package housed in the tray, a conductive shield layer is formed.
    Type: Application
    Filed: September 10, 2014
    Publication date: June 18, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshiaki GOTO, Takashi IMOTO, Takeshi WATANABE, Yuusuke TAKANO, Yusuke AKADA, Yuji KARAKANE, Yoshinori OKAYAMA, Akihiko YANAGIDA
  • Publication number: 20150167157
    Abstract: A semiconductor manufacturing device has an upper cover configured to be arranged above top surface of unshielded semiconductor device which are mounted on a tray placed on a carrier to go through electromagnetic shielding, and a displacement detector configured to detect an abnormality when the upper cover is raised by at least one of the semiconductor device which is brought into contact with a bottom surface of the upper cover.
    Type: Application
    Filed: September 10, 2014
    Publication date: June 18, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsunori Shibuya, Takashi Imoto, Soichi Homma, Takeshi Watanabe, Yuusuke Takano
  • Publication number: 20150171020
    Abstract: A semiconductor device includes a conductive shield layer that has a first portion covering a surface of a sealing resin layer and a second portion covering side surfaces of the sealing resin layer and side surfaces of the substrate. Portions of wiring layers, including a grounding wire, on or in the substrate have cut planes which are exposed to the side surfaces of the substrate and spread out in a thickness direction of the substrate. A cut plane of the grounding wire is electrically connected to the shield layer. An area of the cut plane of the grounding wire is larger than an area of a cross section of the grounding wire parallel to, and inward of the substrate from, the cut plane of the grounding wire.
    Type: Application
    Filed: September 2, 2014
    Publication date: June 18, 2015
    Inventors: Katsunori SHIBUYA, Takashi IMOTO, Soichi HOMMA, Takeshi WATANABE, Yuusuke TAKANO
  • Publication number: 20150167156
    Abstract: A semiconductor manufacturing device has a conveyor configured to convey a tray having an unshielded semiconductor device mounted thereon to go through electromagnetic shielding, and a controller configured to control the conveyor. The controller performs control to take out the tray from a tray supply storage storing trays each having an unshielded semiconductor device mounted thereon to go through the electromagnetic shielding, place the tray on a carrier, and convey this carrier to a sputtering device which coats the unshielded semiconductor device with a sputtering material for the electromagnetic shielding, and the controller performs control to take out, from the sputtering device, the carrier having the tray placed thereon with an electromagnetically shielded semiconductor device being mounted on the tray, convey the tray, pick up the tray having the electromagnetically shielded semiconductor device mounted thereon from the carrier, and store the tray in the tray supply storage.
    Type: Application
    Filed: September 10, 2014
    Publication date: June 18, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Katsunori SHIBUYA, Takashi IMOTO, Soichi HOMMA, Takeshi WATANABE, Yuusuke TAKANO
  • Publication number: 20150171019
    Abstract: According to one embodiment, a semiconductor device includes a substrate. A semiconductor chip is disposed on a first surface of the substrate. The semiconductor chip is covered with a sealing material. A front surface and a side surface of the sealing material are covered with a conductive film. On an outer edge of a substrate-side of the semiconductor device, a step or a trench is formed.
    Type: Application
    Filed: August 29, 2014
    Publication date: June 18, 2015
    Inventors: Katsunori SHIBUYA, Soichi HOMMA, Yuusuke TAKANO, Shinpei ISHIDA
  • Publication number: 20150070046
    Abstract: According to one embodiment, a semiconductor device includes a wiring board that has a first surface and a second surface opposed to the first surface, a semiconductor chip provided on the first surface, external connection terminals provided on the second surface, a sealing resin layer provided on the first surface, and a conductive shield layer that covers at least a portion of a side surface of the wiring board and the sealing resin layer. The wiring board includes a first ground wire that is electrically connected to the conductive shield layer, and a second ground wire that is electrically connected to the conductive shield layer and is electrically insulated from the first ground wire.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 12, 2015
    Inventors: Yuusuke TAKANO, Yoshiaki GOTO, Takeshi WATANABE, Takashi IMOTO
  • Publication number: 20140366124
    Abstract: The determination device displays a target image specifying a random position on a screen, and obtains a designated position by the user for the target image. Then, the determination device determines whether or not the designated position coincides with the position of the target image. When a number of times determined to coincide reaches a predetermined necessary number of coincidence, the determination device determines that the authentication is successful.
    Type: Application
    Filed: December 22, 2011
    Publication date: December 11, 2014
    Applicant: PIONEER CORPORATION
    Inventors: Yozo Takehara, Yuusuke Takano, Shunichiro Nagao
  • Publication number: 20140366125
    Abstract: The information processing device connects with an external device by a first connection unit and a second connection unit different from each other. An identification information specific to the information processing device is transmitted from the information processing device to the external device via the first connection unit, and further transmitted from the external device to the information processing device via the second connection unit. The information processing device compares the specific identification information received from the external device with specific identification information for comparison, stored in advance, to determine whether or not the information processing device and the external device are in a simultaneous connection state in which the information processing device and the external device are connected by the first connection unit and the second connection unit.
    Type: Application
    Filed: December 27, 2011
    Publication date: December 11, 2014
    Inventors: Toshiyuki Murata, Yozo Takehara, Shunichiro Nagao, Yuusuke Takano
  • Publication number: 20120077313
    Abstract: In a semiconductor device manufacturing method, a first resin layer with optical transmission restrained is formed on a supporting substrate and a second resin layer made of thermoplastic resin is formed on the first resin layer. An insulating layer and a wiring layer are formed on the second resin layer and a first semiconductor chip is mounted on the wiring layer. The supporting substrate is separated by irradiating the first resin layer with a laser beam, and the second resin layer is removed.
    Type: Application
    Filed: September 18, 2011
    Publication date: March 29, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Soichi HOMMA, Taku Kamoto, Yuusuke Takano, Masayuki Miura