Abstract: Provided is a silicone resin composition which exhibits excellent workability and which maintains fluidity even if filled, to a high degree, with a thermally conductive filler. This silicone resin composition contains: a component (A), an organopolysiloxane which is represented by a formula (1) and has a molecular weight distribution (Mw/Mn) of 1.20 or less; and a component (B), a thermally conductive filler. In the formula (1), R1 are each independently a monovalent saturated hydrocarbon group or a monovalent aromatic hydrocarbon group, R2 is a monovalent saturated hydrocarbon group, X is oxygen or a divalent hydrocarbon group, n is an integer of 1 or more, and a is an integer between 1 and 3.