Abstract: A power module includes: a first metal brazed substrate; a chipset disposed on the first metal brazed substrate, where the chipset includes at least two chips; and a clip, where the clip covers a side, away from the first metal brazed substrate, of the chipset. Each connecting unit is electrically connected to a corresponding chip. Every two adjacent connecting units are connected along a first direction through a body. Each connecting arm is arranged with respect to two adjacent chips in the chipset. The connecting arm is connected to the first metal brazed substrate. A shortest distance between the connecting arm and one of the two adjacent chips is a first shortest distance, a shortest distance between the connecting arm and the other of the two adjacent chips is a second shortest distance. A difference between the first shortest distance and the second shortest distance falls within a preset threshold.

Abstract: The present application relates to a service decision method and a service decision device. The method includes: receiving a task request sent by a terminal, the task request including a terminal identifier, terminal location information and task information of the terminal; determining that the terminal is currently in an overlapping coverage area, generating a decision-making instruction according to the task request and a target decision network, and sending the decision-making instruction to the terminal according to the terminal identifier, the decision-making instruction being used to indicate whether a target unmanned aerial vehicle server provides to the terminal a service corresponding to the task request, and the target decision-making instruction being used by the terminal to select one server from among the target unmanned aerial vehicle server and the other unmanned aerial vehicle servers to provide the service. Using the present method can improve resource utilization.

Abstract: An inference computing apparatus comprises at least one processor and a memory with program instructions stored therein, the program instructions can be executed by the at least one processor to cause the inference computing apparatus to perform the following operations: receiving a first inference model from a model training apparatus, the first inference model being obtained through a model training by the model training apparatus based on a first training sample library, the first training sample library comprising training samples from historical data generated in a manufacturing stage; performing an inference computing on data to be processed generated in the manufacturing stage based on the first inference model to obtain the inference result which is sent to a user-side device; and evaluating performance of the first inference model to determine whether the first inference model needs to be updated, and if yes, updating the first inference model.

Abstract: The present disclosure provides a detection method. The detection method includes inputting an image to be detected into a detection model being pre-constructed and detecting the image to be detected. The detection model includes a defect classification identification sub-model configured to identify a classification of a defect in the image to be detected, and the defect classification identification sub-model comprises a plurality of base models and a secondary model. The present disclosure further provides an electronic device and a non-transitory computer-readable storage medium.

Abstract: A power module is provided that may include a first metal-clad substrate, a chip located on a side of the first metal-clad substrate, and first solder located between the first metal-clad substrate and the chip. A first metal layer is disposed on a surface that is of the first metal-clad substrate and that faces the chip, and the first metal layer includes a groove and a blocking part. A first thickness of the first metal layer is less than a second thickness. The first thickness is a thickness of at least a part of an area in the blocking part, and the second thickness is a thickness of the first metal layer in an area other than the groove and the blocking part. The blocking part is located between the chip and the adjacent groove, and is configured to prevent the first solder from overflowing into the groove.