Patents by Inventor Zhenyu Bao

Zhenyu Bao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10407594
    Abstract: A chemical-mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a composite or mixture thereof, (B) a polymeric polyamine or a salt thereof comprising at least one type of pendant group (Y) which comprises at least one moiety (Z), wherein (Z) is a carboxylate (—COOR1), sulfonate (—SO3R2), sulfate (—O—SO3R3), phosphonate (—P(?O)(OR4)(OR5)), phosphate (—O—P(?O)(OR6)(OR7)), carboxylic acid (—COOH), sulfonic acid (—SO3H), sulfuric acid (—O—SO3—), phosphonic acid (—P(?O)(OH)2), phosphoric acid (—O—P(?O)(OH)2) moiety, or their deprotonated forms, R1 is alkyl, aryl, alkylaryl, or arylalkyl R2 is alkyl, aryl, alkylaryl, or arylalkyl, R3 is alkyl, aryl, alkylaryl, or arylalkyl, R4 is alkyl, aryl, alkylaryl, or arylalkyl, R5 is H, alkyl, aryl, alkylaryl, or arylalkyl, R6 is alkyl, aryl, alkylaryl, or arylalkyl, R7 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: September 10, 2019
    Assignee: BASF SE
    Inventors: Bastian Marten Noller, Yuzhuo Li, Diana Franz, Kenneth Rushing, Michael Lauter, Daniel Kwo-Hung Shen, Yongqing Lan, Zhenyu Bao
  • Patent number: 10090159
    Abstract: Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: October 2, 2018
    Assignee: BASF SE
    Inventors: Yongqing Lan, Peter Przybylski, Zhenyu Bao, Julian Proelss
  • Patent number: 9862862
    Abstract: Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) one or more polyethylene imines (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: January 9, 2018
    Assignee: BASF SE
    Inventors: Yongqing Lan, Peter Przybylski, Zhenyu Bao, Julian Proelss
  • Patent number: 9828527
    Abstract: Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) N,N,N?,N?-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 28, 2017
    Assignee: BASF SE
    Inventors: Yongqing Lan, Peter Przybylski, Zhenyu Bao, Julian Proelss
  • Patent number: 9765239
    Abstract: Described is a use of a chemical-mechanical polishing (CMP) composition for polishing a substrate or layer containing one or more lll-V materials, wherein the chemical-mechanical polishing (CMP) composition comprises the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) one or more constituents selected from the group consisting of (i) substituted and unsubstituted triazoles not having an aromatic ring annealed to the triazol ring, (ii) benzimidazole, (iii) chelating agents selected from the group consisting of amino acids with two or more carboxyl groups, aliphatic carboxylic acids, and the respective salts thereof, and (iv) homopolymers and copolymers of acrylic acid, and the respective salts thereof, (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: September 19, 2017
    Assignee: BASF SE
    Inventors: Yongqing Lan, Peter Przybylski, Zhenyu Bao, Julian Proelss
  • Publication number: 20170044402
    Abstract: Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) N,N,N?,N?-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Application
    Filed: October 27, 2016
    Publication date: February 16, 2017
    Applicant: BASF SE
    Inventors: Yongqing Lan, Peter Przybylski, Zhenyu Bao, Julian Proelss
  • Publication number: 20160096979
    Abstract: Described is a use of a chemical-mechanical polishing (CMP) composition for polishing a substrate or layer containing one or more lll-V materials, wherein the chemical-mechanical polishing (CMP) composition comprises the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) one or more constituents selected from the group consisting of (i) substituted and unsubstituted triazoles not having an aromatic ring annealed to the triazol ring, (ii) benzimidazole, (iii) chelating agents selected from the group consisting of amino acids with two or more carboxyl groups, aliphatic carboxylic acids, and the respective salts thereof, and (iv) homopolymers and copolymers of acrylic acid, and the respective salts thereof, (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Application
    Filed: May 6, 2014
    Publication date: April 7, 2016
    Applicant: BASF SE
    Inventors: Yongqing LAN, Peter PRZYBYLSKI, Zhenyu BAO, Julian PROELSS
  • Publication number: 20160068712
    Abstract: Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) one or more polyethylene imines (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Application
    Filed: May 5, 2014
    Publication date: March 10, 2016
    Applicant: BASF SE
    Inventors: Yongqing LAN, Peter PRZYBYLSKI, Zhenyu BAO, Julian PROELSS
  • Publication number: 20160009955
    Abstract: Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) N,N,N?,N?-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Application
    Filed: May 6, 2014
    Publication date: January 14, 2016
    Applicant: BASF SE
    Inventors: Yongqing LAN, Peter PRZYBYLSKI, Zhenyu BAO, Julian PROELSS
  • Publication number: 20150380263
    Abstract: Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of ?15 mV or below at a pH in the range of from 2 to 6 (B) one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.
    Type: Application
    Filed: May 5, 2014
    Publication date: December 31, 2015
    Applicant: BASF SE
    Inventors: Yongqing LAN, Peter PRZYBYLSKI, Zhenyu BAO, Julian PROELSS
  • Publication number: 20140004703
    Abstract: A chemical-mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a composite or mixture thereof, (B) a polymeric polyamine or a salt thereof comprising at least one type of pendant group (Y) which comprises at least one moiety (Z), wherein (Z) is a carboxylate (—COOR1), sulfonate (—SO3R2), sulfate (—O—SO3R3), phosphonate (—P(?O) (OR4)(OR5)), phosphate (—O—P(?O)(OR6)(OR7)), carboxylic acid (—COOH), sulfonic acid (—SO3H), sulfuric acid (—O—SO3—), phosphonic acid (—P(?O)(OH)2), phosphoric acid (—O—P(?O)(OH)2) moiety, or their deprotonated forms, R1 is alkyl, aryl, alkylaryl, or arylalkyl R2 is alkyl, aryl, alkylaryl, or arylalkyl, R3 is alkyl, aryl, alkylaryl, or arylalkyl, R4 is alkyl, aryl, alkylaryl, or arylalkyl, R5 is H, alkyl, aryl, alkylaryl, or arylalkyl, R6 is alkyl, aryl, alkylaryl, or arylalkyl, R7 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.
    Type: Application
    Filed: March 19, 2012
    Publication date: January 2, 2014
    Applicant: BASF SE
    Inventors: Bastian Marten Noller, Yuzhuo Li, Diana Franz, Kenneth Rushing, Michael Lauter, Daniel Kwo-Hung Shen, Yongqing Lan, Zhenyu Bao