Patents by Inventor ZHENZHEN HE

ZHENZHEN HE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12224181
    Abstract: One example described herein includes a method for fabricating integrated circuit (IC) packages. The method includes fabricating a plurality of IC dies and providing a conductive metal material sheet. The method also includes laser-cutting the conductive metal material sheet to form a lead-frame sheet. The lead-frame sheet includes at least one of through-holes and three-dimensional locking features. The method further includes coupling the IC dies to the lead-frame sheet and coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: February 11, 2025
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Tiange Xie, Li Xiang Zheng, Alex Chin Sern Ting, Zhenzhen He
  • Publication number: 20230063278
    Abstract: One example described herein includes a method for fabricating integrated circuit (IC) packages. The method includes fabricating a plurality of IC dies and providing a conductive metal material sheet. The method also includes laser-cutting the conductive metal material sheet to form a lead-frame sheet. The lead-frame sheet includes at least one of through-holes and three-dimensional locking features. The method further includes coupling the IC dies to the lead-frame sheet and coupling the lead-frame sheet and the IC dies to packaging material to form an IC package block comprising the IC packages.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: TIANGE XIE, LI XIANG ZHENG, ALEX CHIN SERN TING, ZHENZHEN HE