Abstract: A heat dissipation system includes a base plate, a side plate perpendicularly to the base plate, a motherboard attached on the base plate, a first fan, and a second fan fixed on the side plate facing to the heat sink. The motherboard has a first heat source and a second heat source mounted thereon, a heat sink positioned on the first heat source, and a fan bracket mounted on the heat sink. The first fan is positioned on the fan bracket. A rotating axis of the first fan is perpendicular to that of the second fan.

Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.

Abstract: An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.

Abstract: A heat dissipation assembly includes a heat sink and a fan. The heat sink includes a plurality of fins. The plurality of fins is parallel with each other. Each of the plurality of fins includes two side faces. Each side face is waved. An air channel is located between two adjacent side faces of two adjacent fins. The air channel includes a plurality of wide portions and a plurality of narrow portions interlaced with the plurality of wide portions. The fan is located on a side of the air channel. The fan is adapted to drive air flowing fast in the plurality of narrow portions of the air channel and flowing slow in the plurality of wide portions of the air channel.

Abstract: A fan module includes a fan, a temperature sensor, and a shield. The temperature sensor includes a cable. The shield is mounted on the fan. The shield includes a clip. The clip includes two elastic pieces. A restricting slot and a receiving space are located between the two elastic pieces. The cable has an outer diameter which is wider than the restricting slot but narrower than the receiving space. The two elastic pieces can be elastically deformed to expand the restricting slot so that the cable can be placed in the receiving channel via the restricting slot.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

Abstract: A fan speed control circuit includes a first fan, a second fan, a first temperature sensor, a second temperature sensor, a PWM regulator, and a driving module. The first temperature sensor senses a temperature of the first component to generate a first temperature signal. The second temperature sensor senses a temperature of a second component to generate a second temperature signal. The PWM regulator is connected to the first temperature sensor and the second temperature sensor. The PWM regulator generates a first PWM signal according to the first temperature signal and generates a second PWM signal according to the second temperature signal. The driving module is connected to the PWM regulator. The driving module generates a first driving voltage provided to the first fan according to the first PWM signal. The driving module also generates a second driving voltage provided to the second fan according to the second PWM signal.

Abstract: A mounting assembly includes a circuit board, a securing member and a heat dissipating device. A retainer is located on the circuit board. The securing member includes a positioning portion and a claw connected to the positioning portion. The heat dissipating device includes a base attached to the circuit board and a number of fins perpendicularly located on the base. The number of fins defines a number of first air paths and a number of second air paths substantially perpendicular to the number of first air paths. The positioning portion is received in at least one of the number of first air paths and at least one of the number of second air paths, and the claw is engaged with the retainer.

Abstract: A heat dissipating apparatus includes a base and a heat pipe. A plurality of fins partially overlaps the base; the heat pipe comprising a first body, a second body and a third body, the second body connected between the first body and the third body; the first body is secured between the plurality of fins and the base, the third body is secured to the plurality of fins, and the second body is located in a first corner between the base and the plurality of fins.

Abstract: A computer system includes a chassis, a motherboard, a heat sink and an airflow guiding duct. The chassis includes a chassis bottom wall, a first chassis sidewall, and a second chassis sidewall. The first chassis sidewall defines a first ventilation hole. The second chassis sidewall defines a second ventilation hole. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The airflow guiding duct is configured to guide airflow flowing from the second ventilation to the first ventilation hole. A fan is received inside the airflow guiding duct.

Abstract: A computer system includes a chassis, a motherboard, a heat sink and an airflow guiding duct. The chassis includes a chassis bottom wall, a first chassis sidewall, and a second chassis sidewall. The first chassis sidewall defines a first ventilation hole. The second chassis sidewall defines a second ventilation hole. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The airflow guiding duct is configured to guide airflow flowing from the second ventilation to the first ventilation hole. A fan is received inside the airflow guiding duct.

Abstract: A method for controlling a fan speed is disclosed. The fan cools a CPU in a computer. The method includes defining a CPU-max-temp value of a CPU, such that the first fan speed is linearly enhanced with the increase of a real temperature value of the CPU, when the real temperature value of the CPU is lower than the CPU-max-temp value, and changing the CPU-max-temp value to a higher CPU-max-temp value in a basic input output system. A second fan speed is linearly enhanced with an increase of the real temperature value, when the real temperature value is lower than the higher CPU-max-temp value. The second fan speed is less than the first fan speed at the real temperature value.

Abstract: A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.

Abstract: A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably secured to the second side of the fan.

Abstract: A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.

Abstract: An assembly includes a circuit board and a heat sink apparatus attached to the motherboard. The heat sink apparatus has at least two screws, and a first mistake-proof structure. A plurality of screw holes are defined in the circuit board corresponding to the screws. The circuit board has a second mistake-proof structure corresponding to the first mistake-proof structure. The first mistake-proof structure engages with the second mistake-proof structure to align the heat sink apparatus to the circuit board in only one configuration.

Abstract: A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably securied to the second side of the fan.

Abstract: An electronic device includes a first heat source, a second heat source adjacent to the first heat source, a heat sink, and a fan. The heat sink is mounted on the first heat source for transferring heat from the first heat source to the heat sink. The fan has an air inlet and an air outlet. The air outlet faces the second heat source to drive air flowing through the second heat source if the air inlet faces the heat sink. The air outlet faces the heat sink to drive air flowing through the heat sink if the air inlet faces the second heat source.

Abstract: A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.

Abstract: A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.