Patents by Inventor Zhi-Ping Wu

Zhi-Ping Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130015305
    Abstract: A mounting apparatus for a data storage device comprises a bracket and a locking member attached to the bracket. A plurality of fixing holes is defined in one side of the data storage device. The bracket comprises a bottom wall, a first sidewall and a second sidewall. The bottom wall, the first sidewall and the second sidewall together define a receiving space. A through hole is defined on the first sidewall. The locking member comprises a securing portion and at least one resilient piece extending from the securing portion. A latching portion is located on the resilient piece. The latching portion extends through the through hole to engage in the fixing hole, and configured to disengaged from the fixing hole by the resilient piece elastically deformed.
    Type: Application
    Filed: March 8, 2012
    Publication date: January 17, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: NAI-JUAN LI, ZHI-PING WU, XU-DONG NAN
  • Publication number: 20120327587
    Abstract: A data storage device assembly includes a drive bracket. The drive bracket includes a first side plate and a second side plate which faces to the first side plate. Each of the first side plate and the second side plate defines a slide way which is adapted to receive a data storage device assembly sliding therein. The first piece and a second piece is secured together on the first side plate. The second piece includes a pair of first bent pieces and a pair of second bent pieces connected to edges of the second piece. The pair of first bent pieces faces to each other. The pair of second bent pieces faces to each other. The pair of first bent pieces is secured to the pair of second bent pieces.
    Type: Application
    Filed: March 27, 2012
    Publication date: December 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: GUI-FANG YANG, ZHI-PING WU, TING-TING HE
  • Publication number: 20120326580
    Abstract: An electronic device enclosure which is able to resist damage from jolts or bumping includes a frame, a limiting member located in the frame, a cover secured to the frame, a mounting bracket and a blocking member. The frame includes a side plate. The mounting bracket is adapted to receive a data storage device and includes a first sidewall and a second sidewall opposite to the first sidewall. The second sidewall is secured to the side plate. A first end of the first sidewall is rotatably received in the limiting member and located between the limiting member and the second sidewall. A second end of the first sidewall opposite to the first end is hung on the frame. The blocking member is secured to the cover and abuts the second end. The second end is located between the blocking member and the second sidewall.
    Type: Application
    Filed: March 8, 2012
    Publication date: December 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: XU-DONG NAN, ZHI-PING WU, CHAO LIU, NAI-JUAN LI
  • Publication number: 20120326581
    Abstract: An electronic device enclosure includes a frame, a limiting member located in the frame, a limiting member located in the frame, a mounting bracket, and a maintaining member. The frame includes a mounting plate. The mounting bracket is adapted to receive a data storage device and includes a first sidewall and a second sidewall opposite to the first sidewall. The second sidewall is secured to the mounting plate. A first end of the first sidewall is rotatably received in the limiting member. A second end of the first sidewall opposite to the first end is hung on the frame. A protruding block protrudes from the second end. The maintaining member includes a positioning portion and two latching poles secured to the mounting plate. The protruding block is engaged with the positioning portion and located between the positioning portion and the mounting plate.
    Type: Application
    Filed: March 22, 2012
    Publication date: December 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: CHAO LIU, ZHI-PING WU, XU-DONG NAN
  • Publication number: 20120314352
    Abstract: An electronic device enclosure includes a bracket and a handle. The bracket includes a front plate, a first securing piece, and a resilient tab. The resilient tab is secured to the front plate. The handle includes a handhold and a first mounting portion extending from the handhold. The first mounting portion is pivotably mounted to the first securing piece. The first mounting portion defines a pivot axis. The first mounting portion includes a first side surface, a second side surface, and a connecting surface connected between the first side surface and the second side surface. A distance between the first side surface and the pivot axis and a distance between the second side surface and the pivot axis are both less than a distance between the connecting surface and the pivot axis. The connecting surface resists against the resilient tab to be deformed when the first mounting portion rotates.
    Type: Application
    Filed: March 8, 2012
    Publication date: December 13, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: XU-DONG NAN, ZHI-PING WU
  • Publication number: 20120314357
    Abstract: A server enclosure includes an enclosure body, a connecting member, and a loading member. The enclosure body includes a bottom wall and two sidewalls extending from the bottom wall. The two sidewalls is substantially parallel to each other. The connecting member includes a top panel and two resisting panels extending from the top panel. The top panel is substantially parallel to the bottom wall. The loading member includes a bottom panel substantially parallel to the top panel and two connecting panels extending from the bottom panel. A cross section of the loading member, taken along a plane parallel to the sidewall, is U-shaped. The bottom panel is secured on the top panel. The loading member is secured between the two sidewalls.
    Type: Application
    Filed: February 29, 2012
    Publication date: December 13, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
    Inventors: NAI-JUAN LI, ZHI-PING WU
  • Patent number: 8199497
    Abstract: An electronic device enclosure comprising a chassis, the chassis comprises a chassis bottom wall and a chassis rear wall connected to the chassis bottom wall. The chassis bottom wall is capable of mounting a motherboard with a module. An elastic flange is located on the chassis rear wall. The elastic flange is engaged with the module of the motherboard, and the motherboard is located between the flange and the motherboard. The invention further offers an electronic device.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: June 12, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Zhi-Ping Wu
  • Publication number: 20120097562
    Abstract: An electronic device enclosure includes a chassis and an operating member. The chassis includes a front plate and a top plate connected to the front plate. A clipping hole is defined in the front plate. The operating member includes a positioning portion and a securing piece. The positioning portion is received so it can be slid in the clipping hole, and the securing piece is attached to the front plate.
    Type: Application
    Filed: June 2, 2011
    Publication date: April 26, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: XIAO-RUN CHEN, ZHI-PING WU, CHIH-HANG CHAO
  • Publication number: 20120098398
    Abstract: An electronic device enclosure includes a convex bottom plate, a first side plate connected to a first side of the convex bottom plate, and a second side plate connected to a second side of the convex bottom plate. An electronic component is attached to the convex bottom plate. A horizontal plane is defined by connecting bottom edges of the first side plate and the second side plate, and a distance is defined between a highest point of the convex bottom plate and the horizontal plane. The distance is in a range of about 0.7 mm to about 1.4 mm.
    Type: Application
    Filed: May 13, 2011
    Publication date: April 26, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: NAI-JUAN LI, ZHI-PING WU, XU-DONG NAN
  • Publication number: 20120091870
    Abstract: An electronic device enclosure includes a bracket and a handle. The bracket includes a front plate. A first securing piece extends from the front plate, and three first protrusions are defined in the first securing piece. The handle includes a handhold and a first mounting portion connected to the handhold. A first positioning hole is defined in the first mounting portion. The handle is attached to the first securing piece and rotatable relative to the front plate between a first position and a second position. In the first position, the handhold is substantially parallel to the front plate, and the first positioning hole receives a first one of the three protrusions. In the second position, the handhold is substantially perpendicular to the front plate, and the first positioning hole receives a second one of the three protrusions.
    Type: Application
    Filed: June 16, 2011
    Publication date: April 19, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: XU-DONG NAN, ZHI-PING WU
  • Publication number: 20120033387
    Abstract: A mounting apparatus includes a chassis, an expansion member attached to a first end of the expansion card and a mounting tray. The chassis includes a front plate and a rear plate opposite to the front plate. The expansion member is engaged with the rear plate. The mounting tray includes a first section and a second section connected to the first section. A retaining slot is defined in the first section. An engaging portion is disposed on the second section, and a positioning slot defined in the engaging portion. The positioning slot and the retaining slot are located in a longitudinal line. The first section is engaged with the front plate, and the retaining slot and the positioning slot receive a second end of the expansion card.
    Type: Application
    Filed: March 3, 2011
    Publication date: February 9, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: NAI-JUAN LI, ZHI-PING WU
  • Publication number: 20120026655
    Abstract: An assembly includes a power supply unit, a base, and an enclosure. The base includes a bottom plate. The enclosure includes a bottom panel. A flexible piece is connected to the bottom panel. The power supply unit is located on the bottom panel. The bottom panel is located on the bottom plate of the base. The flexible piece is located between the power supply unit and the bottom plate, and is elastically bent.
    Type: Application
    Filed: March 24, 2011
    Publication date: February 2, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: NAI-JUAN LI, ZHI-PING WU
  • Patent number: 8072757
    Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: December 6, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co. Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang-Liang Cao, Yu-Hsu Lin, Zhi-Ping Wu, Yang Li, Lei Guo
  • Patent number: 7983047
    Abstract: A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a backplate attached to an underside of the circuit board. The heat sink includes a pair of securing legs at two corners of the heat sink, and a pair of securing members. Each securing leg defines a securing hole thereon. Each securing member includes a spring thereon positioned between the corresponding securing legs and the circuit board. The securing members are secured in the corresponding securing holes to secure the heat sink to the circuit board.
    Type: Grant
    Filed: July 23, 2009
    Date of Patent: July 19, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Zhi-Ping Wu
  • Publication number: 20110164378
    Abstract: An electronic device enclosure comprising a chassis, the chassis comprises a chassis bottom wall and a chassis rear wall connected to the chassis bottom wall. The chassis bottom wall is capable of mounting a motherboard with a module. An elastic flange is located on the chassis rear wall. The elastic flange is engaged with the module of the motherboard, and the motherboard is located between the flange and the motherboard. The invention further offers an electronic device.
    Type: Application
    Filed: April 20, 2010
    Publication date: July 7, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: ZHI-PING WU
  • Publication number: 20110164380
    Abstract: A circuit board assembly is provided, includes a circuit board having a first side and a second side opposite to the first side. A chip is connected to the first side of the circuit board. A first heat dissipating device is located on the first side of the circuit board. The chip is located between the first heat dissipating device and the first side of the circuit board. A second heat dissipating device abuts the second side of the circuit board, and the second heat dissipating device are secured to the first heat dissipating device to clamp the circuit board and the chip.
    Type: Application
    Filed: March 31, 2010
    Publication date: July 7, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jeng-Da WU, Chih-Hang CHAO, Zhi-Ping WU
  • Publication number: 20110155882
    Abstract: A mounting apparatus includes a bracket and a locking member. The bracket is configured for receiving a disk drive and includes a side plate. The side plate defines two through holes. The locking member is secured to the side plate and includes a locking portion and two locking posts. The locking portion is resiliently deformable. The two locking posts are secured to the locking portion. The locking member has an unlocked position, where the locking portion is resiliently deformed and the two locking posts are disengaged from the bracket, and a locked position, where the locking portion is in an original state and inserts the two locking posts into the bracket through the two through holes, for engaging in fixing holes defined in the disk drive.
    Type: Application
    Filed: May 21, 2010
    Publication date: June 30, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: ZHI-PING WU
  • Publication number: 20100290194
    Abstract: A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a backplate attached to an underside of the circuit board. The heat sink includes a pair of securing legs at two corners of the heat sink, and a pair of securing members. Each securing leg defines a securing hole thereon. Each securing member includes a spring thereon positioned between the corresponding securing legs and the circuit board. The securing members are secured in the corresponding securing holes to secure the heat sink to the circuit board.
    Type: Application
    Filed: July 23, 2009
    Publication date: November 18, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO.,LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: ZHI-PING WU
  • Patent number: 7763817
    Abstract: A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: July 27, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zhi-Ping Wu, Chih-Hang Chao, Yu-Hsu Lin, Jeng-Da Wu
  • Publication number: 20100134971
    Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.
    Type: Application
    Filed: June 8, 2009
    Publication date: June 3, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Liang-Liang CAO, Yu-Hsu LIN, Zhi-Ping WU, Yang LI, Lei GUO