Abstract: A structure and a method of forming are provided. The structure includes a first dielectric layer overlying a first substrate. A first connection pad is disposed in a top surface of the first dielectric layer and contacts a first redistribution line. A first dummy pad is disposed in the top surface of the first dielectric layer, the first dummy pad contacting the first redistribution line. A second dielectric layer overlies a second substrate. A second connection pad and a second dummy pad are disposed in the top surface of the second dielectric layer, the second connection pad bonded to the first connection pad, and the first dummy pad positioned in a manner that is offset from the second dummy pad so that the first dummy pad and the second dummy pad do not contact each other.

Abstract: Disclosed is a light guide plate, a back plate, an edge-lit type backlight module and a display device. The light guide plate includes a main body and an extending part, wherein the extending part is disposed on a sidewall of the main body and extending outwardly, and the extending part and the sidewall of the main body define a space for accommodating a backlight source.

Abstract: Embodiments described herein are operable in a computing system. The computing system receives first and second commands (e.g., I/O commands). The computing system determines that the first command has a higher priority than the second I/O command, and queues the second command for servicing at a later time. The computing system services the first command, and services the second command after a timeout period based on performance degradation limit that decreases command processing performance of the computing system, overrides the timeout period, and increases a probability of executing the second command.

Abstract: Provided are a control method and system for a cascade hybrid amplifier, in which respective hybrid amplifiers in the cascade hybrid amplifier simultaneously start to implement a pump-starting process comprising: when the hybrid amplifier receives a request to start pumping, determining whether conditions are satisfied, if yes, determining stability of power of an input light of a Raman, starting pumping of an EDFA so that the EDFA enters into an APC operation mode; starting pumping of the Raman, and calculating a gain deviation according to the calculated input light powers before and after pump-starting of the Raman when no reflection alarm exists; and adjusting gain of the Raman according to the gain deviation, and switching to an AGC (automatic gain control) operation mode after the adjustment; and switching the EDFA to the AGC operation mode.

Abstract: A method is provided. The method includes providing a first wafer having a plurality of first dummy pads exposed along a first surface of the first wafer. The first dummy pads contact a first metallization layer of the first water. The method also includes providing a second wafer having a plurality of second dummy pads exposed along a first surface of the second wafer. The second dummy pads contact a second metallization layer of the second wafer. The method also includes bonding the first wafer to the second wafer in a manner that the first surface of the first wafer contacts the first surface of the second wafer and the plurality of first dummy pads are interleaved with the plurality of second dummy pads but do not contact the plurality of second dummy pads.

Abstract: An implantable neuromodulation system is provided comprising at least one stimulation microelectrode, at least one microelectrode, and a frequency-shaping amplifier (FSA). The at least one stimulation microelectrode is configured to deliver a desired electrical stimulation to a neuronal population. The at least one recording microelectrode is configured to receive neural signals from the neuronal population. The FSA is coupled to the at least one recording microelectrode. The FSA is configured to allow for simultaneous electrical recording and electrical stimulation of the neuronal population.

Abstract: Systems and methods are provided for an implantable neurostimulator system comprising an array of microelectrodes, a pair of current drivers, and a dynamic current allocation network (DCAN). Each current driver in the pair of current drivers is configured to deliver a respective portion of an electrical signal to the array of microelectrodes to deliver the desired electrical stimulation through the array of microelectrodes to the subject. The DCAN is coupled to the pair of current drivers and the array of microelectrodes to selectively electrically connect each of the pair of the current drivers to individual microelectrodes in the array of microelectrodes to deliver the electrical signal to selective collections of less than all microelectrodes in the array of microelectrodes to deliver the desired electrical stimulation. The pair of current drivers and the DCAN are arranged in respective or a common housing configured to be implanted into the subject.

Abstract: A device, a system, a backlight module and a test method for simulating a light guide plate, the device for simulating a light guide plate includes: a light guide substrate layer; and an electroactive polymer layer, wherein the electroactive polymer layer is formed on the light guide substrate layer and is configured to produce a deformation according to a layout signal of dot-patterns to simulate the dot-patterns.

Abstract: A system comprising first and second redundant controller modules, each controller module comprising mode management circuitry configured to identify whether the corresponding controller module operates in a master mode or a slave mode. The mode management circuitry in each controller module is configured to couple to the mode management circuitry in the other controller module. The mode management circuitries in the controller modules are configured to collectively operate so that one of the controller modules is assigned the master mode and the other of the controller modules is assigned the slave mode. At least one of the mode management circuitries in the controller modules is configured to assign the master mode to the corresponding controller module based on a takeover signal when the mode management circuitry in the corresponding controller module is ready for use.

Abstract: A photocatalytic honeycomb assembly and a photocatalytic purification apparatus, which can maximally increase a contact area between polluted air and a photocatalyst while maximally ensuring that the surface of the photocatalyst receives sufficient irradiation of ultraviolet light, and can also make the flow resistance to air flowing in a channel meet requirements in the field of ventilation systems which have high requirements on flow resistance. The photocatalytic honeycomb assembly is formed of one or more photocatalytic honeycomb cores and a photocatalytic honeycomb assembly housing. The one or more photocatalytic honeycomb cores are arranged in a honeycomb form. The photocatalytic honeycomb core is formed of three or more basic core units and a light guide member that is Y-shaped in an end view.

Abstract: A method includes wirelessly connecting to one or more controllers using a BLUETOOTH communication protocol, where the one or more controllers have a BLUETOOTH adapter or transceiver. The method also includes sending a command or data to a first controller among the one or more controllers using the BLUETOOTH communication protocol. The method further includes receiving, from the first controller or a second controller among the one or more controllers using the BLUETOOTH communication protocol, a response associated with the sent command or data. Each of the one or more controllers includes a programmable logic controller (PLC) in an industrial process control and automation system.

Abstract: A system includes a remote terminal unit (RTU) controller module. Each RTU controller module comprises a controller board configured to couple to a carrier board that includes first and second Ethernet ports. Each controller module comprises computer processing circuitry including the first and second MACs and configured to select to transmit a packet to the first Ethernet port through the first MAC and to alternatively select to transmit the packet to the second Ethernet port through the second MAC. Each controller module comprises an Ethernet switch configured to receive the packet from the first media access control (MAC) and transmit the packet to the first Ethernet port. Each controller module comprises a physical Ethernet interface (PHY) configured to receive the packet from the second MAC and transmit the packet to the second Ethernet port. The computer processing circuitry, the Ethernet switch, and the PHY are mounted on the controller board.

Abstract: The present disclosure illustrates a system for using a kernel to perform a pressure test on a communication port and a method thereof. In the system, a transmission parameter corresponding to a port is set and a test procedure is established on a processor in accordance with the transmission parameter, so that the processor executes a kernel of computer to use a driver of network card based on the transmission parameter to transmit and receive test packets on the communication port. As a result, the system and the method of the present disclosure may generate enough data traffic for pressure test and may achieve the effect of performing test on network device installed difference network cards.

Abstract: An apparatus includes a BLUETOOTH low energy (BLE) based emergency backup and recovery tool. The tool includes a backup power source that stores electric energy and outputs electric energy when a main power source is off. The tool includes a shared memory accessible by a processor and a BLE module. The shared memory stores information written by the processor, and operates using at least some of the electric energy output from the backup power source when the main power source is off. The tool includes the BLE module coupled to the backup power source. The BLE module operates using at least some of the electric energy output from the backup power source when the main power source is off, reads the information stored in the shared memory, and transmits the information to an external device through a wireless communication channel using a BLUETOOTH communication protocol.

Abstract: An apparatus includes a remote terminal unit (RTU) having one or more input/output (I/O) modules and a controller module. Each of the one or more I/O modules includes multiple I/O channels. The controller module includes at least one processing device configured to communicate with at least one industrial field device via the I/O channels of the I/O modules. The controller module includes a first connector, and a first of the one or more I/O modules includes a second connector. The first connector is configured to be physically connected to the second connector, and the first and second connectors are configured to transport data and power directly between the controller module and the first I/O module.

Abstract: An apparatus includes a remote terminal unit (RTU) having a housing, where at least a portion of the housing includes a shell of thermally-conductive material. The RTU also includes at least one circuit board assembly having at least one processing device configured to communicate with one or more industrial control and automation field devices via one or more input/output (I/O) channels. The at least one circuit board assembly is positioned within the shell. The RTU further includes a heat sink configured to remove thermal energy from the at least one processing device. In addition, the RTU includes a thermal pad configured to receive the thermal energy from the heat sink and to provide the thermal energy to the shell.

Abstract: A complementary metal-oxide-semiconductor (CMOS) image sensor having a passivation layer is provided. The CMOS image sensor includes a sensing device substrate. Isolation structures are positioned within trenches of the sensing device substrate. The isolation structures are arranged along opposing sides of a plurality of image sensing devices. The CMOS image sensor also includes a passivation layer. The passivation layer includes passivation sidewalls arranged along the sidewalls of the isolation structures. A metallic grid overlies the passivation layer. The metallic grid includes a metal framework surrounding openings overlying the plurality of image sensing devices. The passivation layer further includes passivation section underlying the openings.

Abstract: A cable connector assembly includes a cable and a connector electrically connected with the cable for further electrically connecting with a power source. The connector includes: a main body; a plurality of contacts retained to the main body; a light emitting element; a printed circuit board (15) for controlling the light emitting element to emit light; and an outer case enclosing the connector and defining an indication area; wherein the connector further includes a conducting member mounted on the printed circuit board (15), the conducting member is a spring plate made of metal material pressing upon the indication area of the outer case, a front end of the outer case defines a transparent portion made of transparent material, and upon pressing the indication area, capacitance is affected and the light emitting element is turned on to emit light through the transparent portion.

Abstract: An apparatus includes a first hardware assist device having at least one transmitter, at least one receiver, and a timer. The at least one transmitter is configured to transmit at least one first signal to a second hardware assist device of a redundant second apparatus. The at least one first signal indicates that the apparatus is functional. The at least one receiver is configured to receive at least one second signal from the second hardware assist device. The at least one second signal indicates that the second apparatus is functional. The timer is configured to control a driver to block transmission of the at least one first signal in response to a fault associated with the apparatus. The apparatus also includes at least one processing device configured to perform one or more actions in response to a loss of the at least one second signal from the second apparatus.

Abstract: A complementary metal-oxide-semiconductor (CMOS) image sensor having a passivation layer is provided. The CMOS image sensor includes a sensing device substrate. Isolation structures are positioned within trenches of the sensing device substrate. The isolation structures are arranged along opposing sides of a plurality of image sensing devices. The CMOS image sensor also includes a passivation layer. The passivation layer includes passivation sidewalls arranged along the sidewalls of the isolation structures. A metallic grid overlies the passivation layer. The metallic grid includes a metal framework surrounding openings overlying the plurality of image sensing devices. The passivation layer further includes passivation section underlying the openings.