Abstract: A method and system to signal transmission layers or dedicated reference signal ports to be used in a multiple input multiple output system, the method including providing a downlink control signal containing information for transmission layers or dedicated reference signal ports utilized, the dedicated reference signal ports being associated with the transmission layers; and using the information to demodulate data on each transmission layer.

Abstract: The present disclosure relates to a processor and a computing system. A processor is provided, including: a pipeline stage, including sequential device(s); and a first clock driving circuit, configured to provide a clock signal to the pipeline stage, wherein the first clock driving circuit includes: a plurality of first clock paths, configured to provide corresponding clock signals respectively; a first selector, configured to select a clock signal from the clock signals provided by the plurality of first clock paths for the pipeline stage.

Abstract: A lifting device for building a steel structure hoistway and a method for building a steel structure hoistway. The lifting device includes a lifting mechanism and a crane mechanism. The lifting mechanism includes a bottom platform, a middle platform and a top platform. The crane mechanism is arranged on the top platform of the lifting mechanism, and includes a base and a crane on the base. The base is arranged on the top platform and is rotatable relative to the top platform along a vertical axis, and the hanger frame of the crane is movable between a vertical orientation and an inclined orientation. The lifting mechanism is configured to ascend and descend in the constructed steel structure hoistway, and the crane mechanism is configured to lift building materials, such as steel beams, steel columns, etc., for use in building the steel structure hoistway to their designed installation locations.

Abstract: An apparatus comprising: a die stack comprising at least one die pair, the at least one die pair having a first die over a second die, the first die and the second die both having a first surface and a second surface, the second surface of the first die over the first surface of the second die; and an adhesive film between the first die and the second die of the at least one die pair; wherein the adhesive film comprises an insulating layer and a conductive layer, the insulating layer adhering to the second surface of the first die and the conductive layer adhering to the first surface of the second die.

Abstract: The present disclosure provides a substrate, a maintenance method thereof and a display device. The substrate includes a base substrate, the base substrate is provided with at least one conductive pattern, and at least one of the at least one conductive pattern is interrupted and divided into a first conductive sub-pattern and a second conductive sub-pattern. The maintenance method includes: coating a conductive material in an interruption region in such a manner as to cover both the first conductive sub-pattern and the second conductive sub-pattern; and coating an organic insulation material at a side of the conductive material away from the base substrate, and curing the organic insulation material to form an organic protection film covering the conductive material.

Abstract: Embodiments described herein provide techniques of forming an interconnect structure using lithographic and deposition processes. The interconnect structure can be used to couple components of a semiconductor package. For one example, a semiconductor package includes a die stack and an interconnect structure formed on the die stack. The die stack comprises a plurality of dies. Each die in the die stack comprises: a first surface; a second surface opposite the first surface; sidewall surfaces coupling the first surface to the second surface; and a pad on the first surface. A one sidewall surface of one of the dies has a sloped profile. The semiconductor package also includes an interconnect structure positioned on the first surfaces and the sidewall with the sloped profile. In this semiconductor package, the interconnect structure electrically couples the pad on each of the dies to each other.

Abstract: The present disclosure provides systems and methods for automatic packaging determination comprising a memory storing instructions and at least one processor performing steps comprising: receiving an order comprising at least one item; searching a data store to determine a tag, volume, and weight associated with each item; sorting the items into groups based on the tags of the items; performing an optimization process for each group of items having the same tag by: creating a data structure representing a first package of the group; iteratively simulating packing a largest remaining item of the group into the first package, wherein if the simulating determines that a threshold is exceeded: creating an additional data structure representing an additional package, and iteratively simulating packing a largest remaining item until all items of the group are packed into a package; and generating at least one list of items for the data structures representing packages.

Abstract: The present disclosure provides systems and methods for automatic packaging determination comprising memory storing instructions and at least one processor performing steps comprising: receiving an order comprising at least one item; searching at least one data store to determine tags and properties associated with each item; sorting the items into at least one group; for each group: performing an optimization process for packaging the items in the group, by: selecting a data structure representing a first package; iteratively simulating packaging of a largest item of the group into the first package until all items are packaged, wherein if the simulating determines that the items in the group do not fit into the selected package: choosing a larger package, iteratively packing until all items are packed in the larger package; and generating set of instructions for packaging the items into the box; and sending the generated instructions for display.

Abstract: The present disclosure provides systems and methods for automatic packaging determination comprising a memory storing instructions and at least one processor performing steps comprising: receiving an order comprising at least one item; searching a data store to determine a tag, volume, and weight associated with each item; sorting the items into groups based on the tags of the items; performing an optimization process for each group of items having the same tag by: creating a data structure representing a first package of the group; iteratively simulating packing a largest remaining item of the group into the first package, wherein if the simulating determines that a threshold is exceeded: creating an additional data structure representing an additional package, and iteratively simulating packing a largest remaining item until all items of the group are packed into a package; and generating at least one list of items for the data structures representing packages.

Abstract: The present disclosure provides a substrate, a maintenance method thereof and a display device. The substrate includes a base substrate, the base substrate is provided with at least one conductive pattern, and at least one of the at least one conductive pattern is interrupted and divided into a first conductive sub-pattern and a second conductive sub-pattern. The maintenance method includes: coating a conductive material in an interruption region in such a manner as to cover both the first conductive sub-pattern and the second conductive sub-pattern; and coating an organic insulation material at a side of the conductive material away from the base substrate, and curing the organic insulation material to form an organic protection film covering the conductive material.

Abstract: An apparatus comprising: a die stack comprising at least one die pair, the at least one die pair having a first die over a second die, the first die and the second die both having a first surface and a second surface, the second surface of the first die over the first surface of the second die; and an adhesive film between the first die and the second die of the at least one die pair; wherein the adhesive film comprises an insulating layer and a conductive layer, the insulating layer adhering to the second surface of the first die and the conductive layer adhering to the first surface of the second die.

Abstract: Disclosed is an information providing method of an electronic apparatus. The information providing method includes identifying identification information of at least one item included in a set of items, and, based on the identification information of the at least one item, providing at least one of information associated with the packing material and information associated with the coolant, each information associated with the at least one item.

Abstract: The package configuration optimization system includes at least one non-transitory storage medium comprising instructions and at least one processor executing the instructions for performing operations. The operations may include receiving historical order data associated with a fulfillment center, the order data including at least one of items ordered, package information, shipping costs, or fill rate, generating a forecast for order data based on the historical order data and performance data associated with the fulfillment center, the forecast comprising a plurality of dummy orders, receiving preferences for packaging cost reduction, determining a current packaging configuration associated with the fulfillment center, optimizing the current packaging configuration to generate at least one new packaging configuration using the received preferences and the generated forecast, and sending the at least one new packaging configuration to a remote system.

Abstract: The present disclosure provides systems and methods for automated bag packaging, comprising at least one processor; and memory storing comprising: receiving an order comprising at least one item; searching at least one data store to determine one or more properties associated with each item; for each group: performing an optimization process for packaging the at least one item into one or more bags, by: selecting a data structure representing a first bag, the data structure comprising a size of the first bag; iteratively simulating packaging of a largest item of the group into the first bag until all items are packaged in the selected bag; generating at least one set of instructions for packaging the items into the selected bag; and sending the generated instructions to a computer system for display, the instructions including at least one item identifier and one bag identifier.

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a package substrate with a top surface, a corner portion, and a plurality of solder balls on the top surface of the package substrate. The semiconductor package also includes a pattern on the corner portion of the package substrate. The pattern may have a width substantially equal to a width of the solder balls. The pattern may also include a continuous line having solder materials. The semiconductor package may include a plurality of conductive pads on the package substrate. The conductive pads may be coupled to the pattern. The pattern may have a z-height that is substantially equal to a z-height of the solder balls, and have one or more outer edges, where the outer edges of the pattern are sidewalls. The sidewalls of the pattern may be substantially vertical or tapered sidewalls.

Abstract: An apparatus comprising: a die stack comprising at least one die pair, the at least one die pair having a first die over a second die, the first die and the second die both having a first surface and a second surface, the second surface of the first die over the first surface of the second die; and an adhesive film between the first die and the second die of the at least one die pair; wherein the adhesive film comprises an insulating layer and a conductive layer, the insulating layer adhering to the second surface of the first die and the conductive layer adhering to the first surface of the second die.

Abstract: The package configuration optimization system includes at least one non-transitory storage medium comprising instructions and at least one processor executing the instructions for performing operations. The operations may include receiving historical order data associated with a fulfillment center, the order data including at least one of items ordered, package information, shipping costs, or fill rate, generating a forecast for order data based on the historical order data and performance data associated with the fulfillment center, the forecast comprising a plurality of dummy orders, receiving preferences for packaging cost reduction, determining a current packaging configuration associated with the fulfillment center, optimizing the current packaging configuration to generate at least one new packaging configuration using the received preferences and the generated forecast, and sending the at least one new packaging configuration to a remote system.

Abstract: The present disclosure provides systems and methods for automatic packaging determination comprising a memory storing instructions and at least one processor performing steps comprising: receiving an order comprising at least one item; searching a data store to determine a tag, volume, and weight associated with each item; sorting the items into groups based on the tags of the items; performing an optimization process for each group of items having the same tag by: creating a data structure representing a first package of the group; iteratively simulating packing a largest remaining item of the group into the first package, wherein if the simulating determines that a threshold is exceeded: creating an additional data structure representing an additional package, and iteratively simulating packing a largest remaining item until all items of the group are packed into a package; and generating at least one list of items for the data structures representing packages.

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a package substrate with a plurality of cavities, and a plurality of adhesives in the cavities of the package substrate. The semiconductor package also includes a plurality of stacked dies over the adhesives and the package substrate, where the stacked dies are coupled to the adhesives with spacers. The spacers may be positioned below outer edges of the stacked dies. The adhesives may include a plurality of films. The semiconductor package may further include a plurality of interconnects coupled to the stacked dies and package substrate, a plurality of electrical components on the package substrate, a mold layer over the stacked dies, interconnects, spacers, adhesives, and electrical components, and a plurality of adhesive layers coupled to the plurality of stacked dies, where one of the adhesive layers couples the stacked dies to the spacers.

Abstract: Disclosed is an information providing method of an electronic apparatus. The information providing method includes identifying identification information of at least one item included in a set of items, and, based on the identification information of the at least one item, providing at least one of information associated with the packing material and information associated with the coolant, each information associated with the at least one item.