Abstract: A gas water heater includes a bottom housing having an opening, a burner mounted at the bottom housing, and a cover plate assembly mounted at the bottom housing and covering the opening. The cover plate assembly includes a first cover plate and a second cover plate. The second cover plate is located between the burner and the first cover plate. The cover plate assembly has an air inlet channel located between the first cover plate and the second cover plate. The first cover plate has a first flow inlet in communication with the air inlet channel. The second cover plate has a second flow inlet distant from the first flow inlet, and in communication with the air inlet channel and an air inlet of the burner.

Abstract: A power module is provided that may include a first metal-clad substrate, a chip located on a side of the first metal-clad substrate, and first solder located between the first metal-clad substrate and the chip. A first metal layer is disposed on a surface that is of the first metal-clad substrate and that faces the chip, and the first metal layer includes a groove and a blocking part. A first thickness of the first metal layer is less than a second thickness. The first thickness is a thickness of at least a part of an area in the blocking part, and the second thickness is a thickness of the first metal layer in an area other than the groove and the blocking part. The blocking part is located between the chip and the adjacent groove, and is configured to prevent the first solder from overflowing into the groove.